Global Underfills for Semiconductor Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032
Description
Market Overview
According to DIResearch＇s in-depth investigation and research, the global Underfills for Semiconductor market size will reach 313.46 Million USD in 2025 and is projected to reach 524.46 Million USD by 2032, with a CAGR of 7.63% (2025-2032). Notably, the China Underfills for Semiconductor market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Underfills for semiconductors are specialized materials used in the electronics manufacturing process to fill the empty spaces between semiconductor chips and their packaging. These materials, usually in liquid or gel form, provide structural support, enhance thermal conductivity, and protect the delicate semiconductor components from environmental factors like moisture, contaminants, and mechanical stress. The application of underfill is a critical step in semiconductor packaging, improving the overall reliability and performance of electronic devices. The choice of underfill depends on factors such as the type of semiconductor, packaging method, and the specific requirements of the application. Advanced formulations aim to achieve optimal adhesion, thermal stability, and mechanical properties, ensuring the longevity and functionality of semiconductor devices in diverse applications ranging from consumer electronics to industrial machinery.
The major global manufacturers of Underfills for Semiconductor include Henkel, Won Chemical, NAMICS, Showa Denko, Panasonic, MacDermid (Alpha Advanced Materials), Shin-Etsu, Sunstar, Fuji Chemical, Zymet, Shenzhen Dover, Threebond, AIM Solder, Darbond, Master Bond, Hanstars, Nagase ChemteX, LORD Corporation, Asec Co., Ltd., Everwide Chemical, Bondline, Panacol-Elosol, United Adhesives, U-Bond, Shenzhen Cooteck Electronic Material Technology, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Underfills for Semiconductor. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Underfills for Semiconductor market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Underfills for Semiconductor market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Underfills for Semiconductor industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Underfills for Semiconductor Include:
Henkel
Won Chemical
NAMICS
Showa Denko
Panasonic
MacDermid (Alpha Advanced Materials)
Shin-Etsu
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Hanstars
Nagase ChemteX
LORD Corporation
Asec Co., Ltd.
Everwide Chemical
Bondline
Panacol-Elosol
United Adhesives
U-Bond
Shenzhen Cooteck Electronic Material Technology
Underfills for Semiconductor Product Segment Include:
Chip-on-film Underfills
Flip Chip Underfills
CSP/BGA Board Level Underfills
Underfills for Semiconductor Product Application Include:
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Underfills for Semiconductor Industry PESTEL Analysis
Chapter 3: Global Underfills for Semiconductor Industry Porter's Five Forces Analysis
Chapter 4: Global Underfills for Semiconductor Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Underfills for Semiconductor Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Underfills for Semiconductor Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Underfills for Semiconductor Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
According to DIResearch＇s in-depth investigation and research, the global Underfills for Semiconductor market size will reach 313.46 Million USD in 2025 and is projected to reach 524.46 Million USD by 2032, with a CAGR of 7.63% (2025-2032). Notably, the China Underfills for Semiconductor market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Underfills for semiconductors are specialized materials used in the electronics manufacturing process to fill the empty spaces between semiconductor chips and their packaging. These materials, usually in liquid or gel form, provide structural support, enhance thermal conductivity, and protect the delicate semiconductor components from environmental factors like moisture, contaminants, and mechanical stress. The application of underfill is a critical step in semiconductor packaging, improving the overall reliability and performance of electronic devices. The choice of underfill depends on factors such as the type of semiconductor, packaging method, and the specific requirements of the application. Advanced formulations aim to achieve optimal adhesion, thermal stability, and mechanical properties, ensuring the longevity and functionality of semiconductor devices in diverse applications ranging from consumer electronics to industrial machinery.
The major global manufacturers of Underfills for Semiconductor include Henkel, Won Chemical, NAMICS, Showa Denko, Panasonic, MacDermid (Alpha Advanced Materials), Shin-Etsu, Sunstar, Fuji Chemical, Zymet, Shenzhen Dover, Threebond, AIM Solder, Darbond, Master Bond, Hanstars, Nagase ChemteX, LORD Corporation, Asec Co., Ltd., Everwide Chemical, Bondline, Panacol-Elosol, United Adhesives, U-Bond, Shenzhen Cooteck Electronic Material Technology, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Underfills for Semiconductor. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Underfills for Semiconductor market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Underfills for Semiconductor market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Underfills for Semiconductor industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Underfills for Semiconductor Include:
Henkel
Won Chemical
NAMICS
Showa Denko
Panasonic
MacDermid (Alpha Advanced Materials)
Shin-Etsu
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Hanstars
Nagase ChemteX
LORD Corporation
Asec Co., Ltd.
Everwide Chemical
Bondline
Panacol-Elosol
United Adhesives
U-Bond
Shenzhen Cooteck Electronic Material Technology
Underfills for Semiconductor Product Segment Include:
Chip-on-film Underfills
Flip Chip Underfills
CSP/BGA Board Level Underfills
Underfills for Semiconductor Product Application Include:
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Underfills for Semiconductor Industry PESTEL Analysis
Chapter 3: Global Underfills for Semiconductor Industry Porter's Five Forces Analysis
Chapter 4: Global Underfills for Semiconductor Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Underfills for Semiconductor Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Underfills for Semiconductor Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Underfills for Semiconductor Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
Table of Contents
165 Pages
- 1 Underfills for Semiconductor Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Underfills for Semiconductor Product by Type
- 1.2.1 Chip-on-film Underfills
- 1.2.2 Flip Chip Underfills
- 1.2.3 CSP/BGA Board Level Underfills
- 1.3 Underfills for Semiconductor Product by Application
- 1.3.1 Industrial Electronics
- 1.3.2 Defense & Aerospace Electronics
- 1.3.3 Consumer Electronics
- 1.3.4 Automotive Electronics
- 1.3.5 Medical Electronics
- 1.3.6 Others
- 1.4 Global Underfills for Semiconductor Market Revenue and Sales Analysis
- 1.4.1 Global Underfills for Semiconductor Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Underfills for Semiconductor Sales Market Size Analysis (2020-2032)
- 1.4.3 Global Underfills for Semiconductor Market Sales Price Trend Analysis (2020-2032)
- 1.5 Underfills for Semiconductor Market Development Status and Trends
- 1.5.1 Underfills for Semiconductor Industry Development Status Analysis
- 1.5.2 Underfills for Semiconductor Industry Development Trends Analysis
- 2 Underfills for Semiconductor Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Underfills for Semiconductor Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Underfills for Semiconductor Market Analysis by Country
- 4.1 Global Underfills for Semiconductor Market Size Analysis by Country: 2024 VS 2025 VS 2032
- 4.1.1 Global Underfills for Semiconductor Revenue and Market Share by Country (2020-2025)
- 4.1.2 Global Underfills for Semiconductor Revenue and Market Share Forecast by Country (2026-2032)
- 4.2 Global Underfills for Semiconductor Sales Analysis by Country: 2024 VS 2025 VS 2032
- 4.2.1 Global Underfills for Semiconductor Sales and Market Share by Country (2020-2025)
- 4.2.2 Global Underfills for Semiconductor Sales and Market Share Forecast by Country (2026-2032)
- 4.3 United States Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.4 Germany Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.5 Japan Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.6 China Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.7 France Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.8 U.K. Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.9 South Korea Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.10 Canada Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.11 Italy Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.12 Russia Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.13 Mexico Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.14 Brazil Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.15 India Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.16 Vietnam Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.17 Thailand Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 4.18 South Africa Underfills for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5 Competition by Manufacturers
- 5.1 Global Underfills for Semiconductor Market Sales, Revenue and Sales Price by Key Manufacturers (2021-2025)
- 5.1.1 Global Underfills for Semiconductor Market Sales by Key Manufacturers (2021-2025)
- 5.1.2 Global Underfills for Semiconductor Market Revenue by Key Manufacturers (2021-2025)
- 5.1.3 Global Underfills for Semiconductor Average Sales Price by Manufacturers (2021-2025)
- 5.2 Underfills for Semiconductor Competitive Landscape Analysis and Market Dynamic
- 5.2.1 Underfills for Semiconductor Competitive Landscape Analysis
- 5.2.2 Global Key Manufacturers Headquarter and Key Area Sales
- 5.2.3 Market Dynamic
- 6 Underfills for Semiconductor Market Analysis by Type
- 6.1 Global Underfills for Semiconductor Market Revenue Analysis by Type
- 6.1.1 Global Underfills for Semiconductor Market Size Analysis by Type: 2024 & 2025 & 2032
- 6.1.2 Global Underfills for Semiconductor Revenue and Forecast Analysis by Type (2020-2032)
- 6.2 Global Underfills for Semiconductor Market Sales and Forecast Analysis by Type (2020-2032)
- 6.3 Global Underfills for Semiconductor Sales Price Trend Analysis by Type (2020-2032)
- 7 Key Companies Analysis
- 7.1 Henkel
- 7.1.1 Henkel Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.1.2 Henkel Underfills for Semiconductor Product Portfolio
- 7.1.3 Henkel Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.2 Won Chemical
- 7.2.1 Won Chemical Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.2.2 Won Chemical Underfills for Semiconductor Product Portfolio
- 7.2.3 Won Chemical Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.3 NAMICS
- 7.3.1 NAMICS Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.3.2 NAMICS Underfills for Semiconductor Product Portfolio
- 7.3.3 NAMICS Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.4 Showa Denko
- 7.4.1 Showa Denko Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.4.2 Showa Denko Underfills for Semiconductor Product Portfolio
- 7.4.3 Showa Denko Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.5 Panasonic
- 7.5.1 Panasonic Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.5.2 Panasonic Underfills for Semiconductor Product Portfolio
- 7.5.3 Panasonic Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.6 MacDermid (Alpha Advanced Materials)
- 7.6.1 MacDermid (Alpha Advanced Materials) Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.6.2 MacDermid (Alpha Advanced Materials) Underfills for Semiconductor Product Portfolio
- 7.6.3 MacDermid (Alpha Advanced Materials) Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.7 Shin-Etsu
- 7.7.1 Shin-Etsu Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.7.2 Shin-Etsu Underfills for Semiconductor Product Portfolio
- 7.7.3 Shin-Etsu Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.8 Sunstar
- 7.8.1 Sunstar Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.8.2 Sunstar Underfills for Semiconductor Product Portfolio
- 7.8.3 Sunstar Underfills for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.9 Fuji Chemical
Pricing
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