Global Silver Powder and Paste for Electronic Components Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032
Description
Market Overview
According to DIResearch＇s in-depth investigation and research, the global Silver Powder and Paste for Electronic Components market size will reach 680.81 Million USD in 2025 and is projected to reach 789.04 Million USD by 2032, with a CAGR of 2.13% (2025-2032). Notably, the China Silver Powder and Paste for Electronic Components market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Silver powder and paste for electronic components are specialized materials used in the manufacturing and assembly of electronic devices. Silver powder consists of finely ground particles of silver, while silver paste is a mixture of silver powder and a binder solution. These materials are employed for their excellent electrical conductivity and thermal conductivity, making them ideal for creating conductive paths, traces, and connections within electronic circuits. Silver powder and paste are applied onto substrates such as printed circuit boards (PCBs) using techniques like screen printing, stencil printing, or dispensing. Upon drying and curing, the binder evaporates or solidifies, leaving behind a conductive layer of silver particles that facilitate the flow of electrical current. These materials are crucial components in the production of various electronic devices, including semiconductors, integrated circuits, sensors, and other microelectronic components, where precise and reliable electrical connections are vital for performance and functionality.
The major global manufacturers of Silver Powder and Paste for Electronic Components include Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Fukuda, Kunming Noble Metal Electronic Materials, Tongling Nonferrous Metals Group Holding, Ningbo Jingxin Electronic Material, Ames Goldsmith, Shin Nihon Kakin, Technic, AG PRO Technology, Jiangsu Boqian New Materials, Ling Guang, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Silver Powder and Paste for Electronic Components. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Silver Powder and Paste for Electronic Components market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Silver Powder and Paste for Electronic Components market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Silver Powder and Paste for Electronic Components industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Silver Powder and Paste for Electronic Components Include:
Shoei Chemical
Heraeus
CNMC Ningxia Orient Group
Mitsui Kinzoku
Changgui Metal Powder
Fukuda
Kunming Noble Metal Electronic Materials
Tongling Nonferrous Metals Group Holding
Ningbo Jingxin Electronic Material
Ames Goldsmith
Shin Nihon Kakin
Technic
AG PRO Technology
Jiangsu Boqian New Materials
Ling Guang
Silver Powder and Paste for Electronic Components Product Segment Include:
Average Particle Size: Below 1.0 μm
Average Particle Size: 1.0 μm-5.0 μm
Average Particle Size: Above 5.0 μm
Silver Powder and Paste for Electronic Components Product Application Include:
IC
Capacitor
Resistor
Membrane Switch
Ohers
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Silver Powder and Paste for Electronic Components Industry PESTEL Analysis
Chapter 3: Global Silver Powder and Paste for Electronic Components Industry Porter's Five Forces Analysis
Chapter 4: Global Silver Powder and Paste for Electronic Components Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Silver Powder and Paste for Electronic Components Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Silver Powder and Paste for Electronic Components Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Silver Powder and Paste for Electronic Components Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
According to DIResearch＇s in-depth investigation and research, the global Silver Powder and Paste for Electronic Components market size will reach 680.81 Million USD in 2025 and is projected to reach 789.04 Million USD by 2032, with a CAGR of 2.13% (2025-2032). Notably, the China Silver Powder and Paste for Electronic Components market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Silver powder and paste for electronic components are specialized materials used in the manufacturing and assembly of electronic devices. Silver powder consists of finely ground particles of silver, while silver paste is a mixture of silver powder and a binder solution. These materials are employed for their excellent electrical conductivity and thermal conductivity, making them ideal for creating conductive paths, traces, and connections within electronic circuits. Silver powder and paste are applied onto substrates such as printed circuit boards (PCBs) using techniques like screen printing, stencil printing, or dispensing. Upon drying and curing, the binder evaporates or solidifies, leaving behind a conductive layer of silver particles that facilitate the flow of electrical current. These materials are crucial components in the production of various electronic devices, including semiconductors, integrated circuits, sensors, and other microelectronic components, where precise and reliable electrical connections are vital for performance and functionality.
The major global manufacturers of Silver Powder and Paste for Electronic Components include Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Fukuda, Kunming Noble Metal Electronic Materials, Tongling Nonferrous Metals Group Holding, Ningbo Jingxin Electronic Material, Ames Goldsmith, Shin Nihon Kakin, Technic, AG PRO Technology, Jiangsu Boqian New Materials, Ling Guang, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Silver Powder and Paste for Electronic Components. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Silver Powder and Paste for Electronic Components market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Silver Powder and Paste for Electronic Components market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Silver Powder and Paste for Electronic Components industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Silver Powder and Paste for Electronic Components Include:
Shoei Chemical
Heraeus
CNMC Ningxia Orient Group
Mitsui Kinzoku
Changgui Metal Powder
Fukuda
Kunming Noble Metal Electronic Materials
Tongling Nonferrous Metals Group Holding
Ningbo Jingxin Electronic Material
Ames Goldsmith
Shin Nihon Kakin
Technic
AG PRO Technology
Jiangsu Boqian New Materials
Ling Guang
Silver Powder and Paste for Electronic Components Product Segment Include:
Average Particle Size: Below 1.0 μm
Average Particle Size: 1.0 μm-5.0 μm
Average Particle Size: Above 5.0 μm
Silver Powder and Paste for Electronic Components Product Application Include:
IC
Capacitor
Resistor
Membrane Switch
Ohers
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Silver Powder and Paste for Electronic Components Industry PESTEL Analysis
Chapter 3: Global Silver Powder and Paste for Electronic Components Industry Porter's Five Forces Analysis
Chapter 4: Global Silver Powder and Paste for Electronic Components Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Silver Powder and Paste for Electronic Components Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Silver Powder and Paste for Electronic Components Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Silver Powder and Paste for Electronic Components Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
Table of Contents
165 Pages
- 1 Silver Powder and Paste for Electronic Components Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Silver Powder and Paste for Electronic Components Product by Type
- 1.2.1 Average Particle Size: Below 1.0 μm
- 1.2.2 Average Particle Size: 1.0 μm-5.0 μm
- 1.2.3 Average Particle Size: Above 5.0 μm
- 1.3 Silver Powder and Paste for Electronic Components Product by Application
- 1.3.1 IC
- 1.3.2 Capacitor
- 1.3.3 Resistor
- 1.3.4 Membrane Switch
- 1.3.5 Ohers
- 1.4 Global Silver Powder and Paste for Electronic Components Market Revenue and Sales Analysis
- 1.4.1 Global Silver Powder and Paste for Electronic Components Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Silver Powder and Paste for Electronic Components Sales Market Size Analysis (2020-2032)
- 1.4.3 Global Silver Powder and Paste for Electronic Components Market Sales Price Trend Analysis (2020-2032)
- 1.5 Silver Powder and Paste for Electronic Components Market Development Status and Trends
- 1.5.1 Silver Powder and Paste for Electronic Components Industry Development Status Analysis
- 1.5.2 Silver Powder and Paste for Electronic Components Industry Development Trends Analysis
- 2 Silver Powder and Paste for Electronic Components Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Silver Powder and Paste for Electronic Components Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Silver Powder and Paste for Electronic Components Market Analysis by Country
- 4.1 Global Silver Powder and Paste for Electronic Components Market Size Analysis by Country: 2024 VS 2025 VS 2032
- 4.1.1 Global Silver Powder and Paste for Electronic Components Revenue and Market Share by Country (2020-2025)
- 4.1.2 Global Silver Powder and Paste for Electronic Components Revenue and Market Share Forecast by Country (2026-2032)
- 4.2 Global Silver Powder and Paste for Electronic Components Sales Analysis by Country: 2024 VS 2025 VS 2032
- 4.2.1 Global Silver Powder and Paste for Electronic Components Sales and Market Share by Country (2020-2025)
- 4.2.2 Global Silver Powder and Paste for Electronic Components Sales and Market Share Forecast by Country (2026-2032)
- 4.3 United States Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.4 Germany Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.5 Japan Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.6 China Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.7 France Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.8 U.K. Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.9 South Korea Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.10 Canada Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.11 Italy Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.12 Russia Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.13 Mexico Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.14 Brazil Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.15 India Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.16 Vietnam Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.17 Thailand Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 4.18 South Africa Silver Powder and Paste for Electronic Components Market Sales, Revenue and Growth Rate (2020-2032)
- 5 Competition by Manufacturers
- 5.1 Global Silver Powder and Paste for Electronic Components Market Sales, Revenue and Sales Price by Key Manufacturers (2021-2025)
- 5.1.1 Global Silver Powder and Paste for Electronic Components Market Sales by Key Manufacturers (2021-2025)
- 5.1.2 Global Silver Powder and Paste for Electronic Components Market Revenue by Key Manufacturers (2021-2025)
- 5.1.3 Global Silver Powder and Paste for Electronic Components Average Sales Price by Manufacturers (2021-2025)
- 5.2 Silver Powder and Paste for Electronic Components Competitive Landscape Analysis and Market Dynamic
- 5.2.1 Silver Powder and Paste for Electronic Components Competitive Landscape Analysis
- 5.2.2 Global Key Manufacturers Headquarter and Key Area Sales
- 5.2.3 Market Dynamic
- 6 Silver Powder and Paste for Electronic Components Market Analysis by Type
- 6.1 Global Silver Powder and Paste for Electronic Components Market Revenue Analysis by Type
- 6.1.1 Global Silver Powder and Paste for Electronic Components Market Size Analysis by Type: 2024 & 2025 & 2032
- 6.1.2 Global Silver Powder and Paste for Electronic Components Revenue and Forecast Analysis by Type (2020-2032)
- 6.2 Global Silver Powder and Paste for Electronic Components Market Sales and Forecast Analysis by Type (2020-2032)
- 6.3 Global Silver Powder and Paste for Electronic Components Sales Price Trend Analysis by Type (2020-2032)
- 7 Key Companies Analysis
- 7.1 Shoei Chemical
- 7.1.1 Shoei Chemical Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.1.2 Shoei Chemical Silver Powder and Paste for Electronic Components Product Portfolio
- 7.1.3 Shoei Chemical Silver Powder and Paste for Electronic Components Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.2 Heraeus
- 7.2.1 Heraeus Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.2.2 Heraeus Silver Powder and Paste for Electronic Components Product Portfolio
- 7.2.3 Heraeus Silver Powder and Paste for Electronic Components Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.3 CNMC Ningxia Orient Group
- 7.3.1 CNMC Ningxia Orient Group Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.3.2 CNMC Ningxia Orient Group Silver Powder and Paste for Electronic Components Product Portfolio
- 7.3.3 CNMC Ningxia Orient Group Silver Powder and Paste for Electronic Components Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.4 Mitsui Kinzoku
- 7.4.1 Mitsui Kinzoku Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.4.2 Mitsui Kinzoku Silver Powder and Paste for Electronic Components Product Portfolio
- 7.4.3 Mitsui Kinzoku Silver Powder and Paste for Electronic Components Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.5 Changgui Metal Powder
- 7.5.1 Changgui Metal Powder Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.5.2 Changgui Metal Powder Silver Powder and Paste for Electronic Components Product Portfolio
- 7.5.3 Changgui Metal Powder Silver Powder and
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