Global Chip Encapsulation Material Competitive Landscape Professional Research Report 2025
Description
Research Summary
Chip encapsulation material, also known as encapsulant or molding compound, is a protective material used to cover and seal semiconductor chips or integrated circuits (ICs). The main purpose of chip encapsulation is to shield the delicate circuitry inside the chip from environmental factors such as moisture, dust, and mechanical stress, ensuring the chip＇s reliability and longevity. The encapsulation material is applied in liquid or paste form, and it undergoes a curing process to solidify and form a protective coating around the chip. This coating not only provides physical protection but also improves the chip＇s thermal performance by dissipating heat generated during operation. Chip encapsulation materials come in various formulations, including epoxy, silicone, and resin-based compounds, each offering different properties such as flexibility, adhesion, and resistance to high temperatures. The choice of chip encapsulation material is critical in semiconductor manufacturing to ensure the chip＇s performance, reliability, and overall quality for its intended applications in electronic devices and systems.
According to DIResearch's in-depth investigation and research, the global Chip Encapsulation Material market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.
The major global manufacturers of Chip Encapsulation Material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Chang Wah Technology, Panasonic, Henkel, Sumitomo Bakelite, Heraeus, Tanaka etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Chip Encapsulation Material. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Chip Encapsulation Material market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Chip Encapsulation Material market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip Encapsulation Material industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Chip Encapsulation Material Include:
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Chip Encapsulation Material Product Segment Include:
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Chip Encapsulation Material Product Application Include:
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Chip Encapsulation Material Industry PESTEL Analysis
Chapter 3: Global Chip Encapsulation Material Industry Porter’s Five Forces Analysis
Chapter 4: Global Chip Encapsulation Material Major Regional Market Size and Forecast Analysis
Chapter 5: Global Chip Encapsulation Material Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Passenger Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Chip Encapsulation Material Competitive Analysis of Key Manufacturers (Revenue, Market Share, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Chip encapsulation material, also known as encapsulant or molding compound, is a protective material used to cover and seal semiconductor chips or integrated circuits (ICs). The main purpose of chip encapsulation is to shield the delicate circuitry inside the chip from environmental factors such as moisture, dust, and mechanical stress, ensuring the chip＇s reliability and longevity. The encapsulation material is applied in liquid or paste form, and it undergoes a curing process to solidify and form a protective coating around the chip. This coating not only provides physical protection but also improves the chip＇s thermal performance by dissipating heat generated during operation. Chip encapsulation materials come in various formulations, including epoxy, silicone, and resin-based compounds, each offering different properties such as flexibility, adhesion, and resistance to high temperatures. The choice of chip encapsulation material is critical in semiconductor manufacturing to ensure the chip＇s performance, reliability, and overall quality for its intended applications in electronic devices and systems.
According to DIResearch's in-depth investigation and research, the global Chip Encapsulation Material market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.
The major global manufacturers of Chip Encapsulation Material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Chang Wah Technology, Panasonic, Henkel, Sumitomo Bakelite, Heraeus, Tanaka etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Chip Encapsulation Material. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Chip Encapsulation Material market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Chip Encapsulation Material market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip Encapsulation Material industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Chip Encapsulation Material Include:
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Chip Encapsulation Material Product Segment Include:
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Chip Encapsulation Material Product Application Include:
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Chip Encapsulation Material Industry PESTEL Analysis
Chapter 3: Global Chip Encapsulation Material Industry Porter’s Five Forces Analysis
Chapter 4: Global Chip Encapsulation Material Major Regional Market Size and Forecast Analysis
Chapter 5: Global Chip Encapsulation Material Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Passenger Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Chip Encapsulation Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Chip Encapsulation Material Competitive Analysis of Key Manufacturers (Revenue, Market Share, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Table of Contents
170 Pages
- 1 Chip Encapsulation Material Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Chip Encapsulation Material Product by Type
- 1.2.1 Substrates
- 1.2.2 Lead Frame
- 1.2.3 Bonding Wires
- 1.2.4 Encapsulating Resin
- 1.2.5 Others
- 1.3 Chip Encapsulation Material Product by Application
- 1.3.1 Consumer Electronics
- 1.3.2 Automotive Electronics
- 1.3.3 IT and Communication Industry
- 1.3.4 Others
- 1.4 Global Chip Encapsulation Material Market Size Analysis (2020-2032)
- 1.5 Chip Encapsulation Material Market Development Status and Trends
- 1.5.1 Chip Encapsulation Material Industry Development Status Analysis
- 1.5.2 Chip Encapsulation Material Industry Development Trends Analysis
- 2 Chip Encapsulation Material Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Chip Encapsulation Material Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Chip Encapsulation Material Market Analysis by Regions
- 4.1 Global Chip Encapsulation Material Overall Market: 2024 VS 2025 VS 2032
- 4.2 Global Chip Encapsulation Material Revenue and Forecast Analysis (2020-2032)
- 4.2.1 Global Chip Encapsulation Material Revenue and Market Share by Region (2020-2025)
- 4.2.2 Global Chip Encapsulation Material Revenue Forecast by Region (2026-2032)
- 5 Global Chip Encapsulation Material Market Size by Type and Application
- 5.1 Global Chip Encapsulation Material Market Size by Type (2020-2032)
- 5.2 Global Chip Encapsulation Material Market Size by Application (2020-2032)
- 6 North America
- 6.1 North America Chip Encapsulation Material Market Size and Growth Rate Analysis (2020-2032)
- 6.2 North America Key Manufacturers Analysis
- 6.3 North America Chip Encapsulation Material Market Size by Type
- 6.4 North America Chip Encapsulation Material Market Size by Application
- 6.5 North America Chip Encapsulation Material Market Size by Country
- 6.5.1 US
- 6.5.2 Canada
- 7 Europe
- 7.1 Europe Chip Encapsulation Material Market Size and Growth Rate Analysis (2020-2032)
- 7.2 Europe Key Manufacturers Analysis
- 7.3 Europe Chip Encapsulation Material Market Size by Type
- 7.4 Europe Chip Encapsulation Material Market Size by Application
- 7.5 Europe Chip Encapsulation Material Market Size by Country
- 7.5.1 Germany
- 7.5.2 France
- 7.5.3 United Kingdom
- 7.5.4 Italy
- 7.5.5 Spain
- 7.5.6 Benelux
- 8 China
- 8.1 China Chip Encapsulation Material Market Size and Growth Rate Analysis (2020-2032)
- 8.2 China Key Manufacturers Analysis
- 8.3 China Chip Encapsulation Material Market Size by Type
- 8.4 China Chip Encapsulation Material Market Size by Application
- 9 APAC (excl. China)
- 9.1 APAC (excl. China) Chip Encapsulation Material Market Size and Growth Rate Analysis (2020-2032)
- 9.2 APAC (excl. China) Key Manufacturers Analysis
- 9.3 APAC (excl. China) Chip Encapsulation Material Market Size by Type
- 9.4 APAC (excl. China) Chip Encapsulation Material Market Size by Application
- 9.5 APAC (excl. China) Chip Encapsulation Material Market Size by Country
- 9.5.1 Japan
- 9.5.2 South Korea
- 9.5.3 India
- 9.5.4 Australia
- 9.5.5 Southeast Asia
- 10 Latin America
- 10.1 Latin America Chip Encapsulation Material Market Size and Growth Rate Analysis (2020-2032)
- 10.2 Latin America Key Manufacturers Analysis
- 10.3 Latin America Chip Encapsulation Material Market Size by Type
- 10.4 Latin America Chip Encapsulation Material Market Size by Application
- 10.5 Latin America Chip Encapsulation Material Market Size by Country
- 10.5.1 Mexico
- 10.5.2 Brazil
- 11 Middle East & Africa
- 11.1 Middle East & Africa Chip Encapsulation Material Market Size and Growth Rate Analysis (2020-2032)
- 11.2 Middle East & Africa Key Manufacturers Analysis
- 11.3 Middle East & Africa Chip Encapsulation Material Market Size by Type
- 11.4 Middle East & Africa Chip Encapsulation Material Market Size by Application
- 11.5 Middle East & Africa Chip Encapsulation Material Market Size by Country
- 11.5.1 Saudi Arabia
- 11.5.2 South Africa
- 12 Competition by Manufacturers
- 12.1 Global Chip Encapsulation Material Market Revenue by Key Manufacturers (2021-2025)
- 12.2 Chip Encapsulation Material Competitive Landscape Analysis and Market Dynamic
- 12.2.1 Chip Encapsulation Material Competitive Landscape Analysis
- 12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales
- 12.2.3 Market Dynamic
- 13 Key Companies Analysis
- 13.1 Shennan Circuit Company Limited
- 13.1.1 Shennan Circuit Company Limited Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.1.2 Shennan Circuit Company Limited Chip Encapsulation Material Product Portfolio
- 13.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.2 Xingsen Technology
- 13.2.1 Xingsen Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.2.2 Xingsen Technology Chip Encapsulation Material Product Portfolio
- 13.2.3 Xingsen Technology Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.3 Kangqiang Electronics
- 13.3.1 Kangqiang Electronics Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.3.2 Kangqiang Electronics Chip Encapsulation Material Product Portfolio
- 13.3.3 Kangqiang Electronics Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.4 Kyocera
- 13.4.1 Kyocera Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.4.2 Kyocera Chip Encapsulation Material Product Portfolio
- 13.4.3 Kyocera Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.5 Mitsui High-tec
- 13.5.1 Mitsui High-tec Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.5.2 Mitsui High-tec Chip Encapsulation Material Product Portfolio
- 13.5.3 Mitsui High-tec Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.6 Chang Wah Technology
- 13.6.1 Chang Wah Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.6.2 Chang Wah Technology Chip Encapsulation Material Product Portfolio
- 13.6.3 Chang Wah Technology Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.7 Panasonic
- 13.7.1 Panasonic Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.7.2 Panasonic Chip Encapsulation Material Product Portfolio
- 13.7.3 Panasonic Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.8 Henkel
- 13.8.1 Henkel Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.8.2 Henkel Chip Encapsulation Material Product Portfolio
- 13.8.3 Henkel Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.9 Sumitomo Bakelite
- 13.9.1 Sumitomo Bakelite Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.9.2 Sumitomo Bakelite Chip Encapsulation Material Product Portfolio
- 13.9.3 Sumitomo Bakelite Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.10 Heraeus
- 13.10.1 Heraeus Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.10.2 Heraeus Chip Encapsulation Material Product Portfolio
- 13.10.3 Heraeus Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 13.11 Tanaka
- 13.11.1 Tanaka Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.11.2 Tanaka Chip Encapsulation Material Product Portfolio
- 13.11.3 Tanaka Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
- 14 Industry Chain Analysis
- 14.1 Chip Encapsulation Material Industry Chain Analysis
- 14.2 Chip Encapsulation Material Industry Raw Material and Suppliers Analysis
- 14.2.1 Chip Encapsulation Material Key Raw Material Supply Analysis
- 14.2.2 Raw Material Suppliers and Contact Information
- 14.3 Chip Encapsulation Material Typical Downstream Customers
- 14.4 Chip Encapsulation Material Sales Channel Analysis
- 15 Research Findings and Conclusion
- 16 Methodology and Data Source
- 16.1 Methodology/Research Approach
- 16.2 Research Scope
- 16.3 Benchmarks and Assumptions
- 16.4 Date Source
- 16.4.1 Primary Sources
- 16.4.2 Secondary Sources
- 16.5 Data Cross Validation
- 16.6 Disclaimer
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