Global Automatic Wafer Thinning Machine Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032
Description
Market Overview
According to DIResearch＇s in-depth investigation and research, the global Automatic Wafer Thinning Machine market size will reach 626.42 Million USD in 2025 and is projected to reach 1,040.62 Million USD by 2032, with a CAGR of 7.52% (2025-2032). Notably, the China Automatic Wafer Thinning Machine market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
An automatic wafer thinning machine is a specialized piece of equipment used in semiconductor manufacturing to reduce the thickness of silicon wafers. These machines employ precise grinding, polishing, or etching techniques to remove material from the surface of the wafer, resulting in the desired thickness required for the fabrication of integrated circuits (ICs) and other semiconductor devices. Equipped with advanced control systems, monitoring tools, and measurement capabilities, automatic wafer thinning machines ensure uniformity and accuracy in the thinning process, essential for achieving consistent wafer thickness across large batches. These machines play a critical role in enabling the production of thinner and lighter semiconductor components, which can improve performance, reduce power consumption, and support the miniaturization of electronic devices.
The major global manufacturers of Automatic Wafer Thinning Machine include Disco, Tokyo Precision, G&N, Okamoto Semiconductor Equipment Division, Beijing CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machinery, SpeedFam, Huahai Qingke, Beijing TSD Semiconductor, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Automatic Wafer Thinning Machine. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Automatic Wafer Thinning Machine market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Automatic Wafer Thinning Machine market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Automatic Wafer Thinning Machine industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Automatic Wafer Thinning Machine Include:
Disco
Tokyo Precision
G&N
Okamoto Semiconductor Equipment Division
Beijing CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machinery
SpeedFam
Huahai Qingke
Beijing TSD Semiconductor
Automatic Wafer Thinning Machine Product Segment Include:
4000RPM
4000-6000RPM
Above 6000RPM
Automatic Wafer Thinning Machine Product Application Include:
8 Inches Wafer (200mm)
12 Inches Wafer (300mm)
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Automatic Wafer Thinning Machine Industry PESTEL Analysis
Chapter 3: Global Automatic Wafer Thinning Machine Industry Porter's Five Forces Analysis
Chapter 4: Global Automatic Wafer Thinning Machine Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Automatic Wafer Thinning Machine Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Automatic Wafer Thinning Machine Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Automatic Wafer Thinning Machine Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
According to DIResearch＇s in-depth investigation and research, the global Automatic Wafer Thinning Machine market size will reach 626.42 Million USD in 2025 and is projected to reach 1,040.62 Million USD by 2032, with a CAGR of 7.52% (2025-2032). Notably, the China Automatic Wafer Thinning Machine market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
An automatic wafer thinning machine is a specialized piece of equipment used in semiconductor manufacturing to reduce the thickness of silicon wafers. These machines employ precise grinding, polishing, or etching techniques to remove material from the surface of the wafer, resulting in the desired thickness required for the fabrication of integrated circuits (ICs) and other semiconductor devices. Equipped with advanced control systems, monitoring tools, and measurement capabilities, automatic wafer thinning machines ensure uniformity and accuracy in the thinning process, essential for achieving consistent wafer thickness across large batches. These machines play a critical role in enabling the production of thinner and lighter semiconductor components, which can improve performance, reduce power consumption, and support the miniaturization of electronic devices.
The major global manufacturers of Automatic Wafer Thinning Machine include Disco, Tokyo Precision, G&N, Okamoto Semiconductor Equipment Division, Beijing CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machinery, SpeedFam, Huahai Qingke, Beijing TSD Semiconductor, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Automatic Wafer Thinning Machine. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Automatic Wafer Thinning Machine market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Automatic Wafer Thinning Machine market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Automatic Wafer Thinning Machine industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Automatic Wafer Thinning Machine Include:
Disco
Tokyo Precision
G&N
Okamoto Semiconductor Equipment Division
Beijing CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machinery
SpeedFam
Huahai Qingke
Beijing TSD Semiconductor
Automatic Wafer Thinning Machine Product Segment Include:
4000RPM
4000-6000RPM
Above 6000RPM
Automatic Wafer Thinning Machine Product Application Include:
8 Inches Wafer (200mm)
12 Inches Wafer (300mm)
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Automatic Wafer Thinning Machine Industry PESTEL Analysis
Chapter 3: Global Automatic Wafer Thinning Machine Industry Porter's Five Forces Analysis
Chapter 4: Global Automatic Wafer Thinning Machine Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Automatic Wafer Thinning Machine Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Automatic Wafer Thinning Machine Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Automatic Wafer Thinning Machine Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
Table of Contents
165 Pages
- 1 Automatic Wafer Thinning Machine Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Automatic Wafer Thinning Machine Product by Type
- 1.2.1 4000RPM
- 1.2.2 4000-6000RPM
- 1.2.3 Above 6000RPM
- 1.3 Automatic Wafer Thinning Machine Product by Application
- 1.3.1 8 Inches Wafer (200mm)
- 1.3.2 12 Inches Wafer (300mm)
- 1.3.3 Other
- 1.4 Global Automatic Wafer Thinning Machine Market Revenue and Sales Analysis
- 1.4.1 Global Automatic Wafer Thinning Machine Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Automatic Wafer Thinning Machine Sales Market Size Analysis (2020-2032)
- 1.4.3 Global Automatic Wafer Thinning Machine Market Sales Price Trend Analysis (2020-2032)
- 1.5 Automatic Wafer Thinning Machine Market Development Status and Trends
- 1.5.1 Automatic Wafer Thinning Machine Industry Development Status Analysis
- 1.5.2 Automatic Wafer Thinning Machine Industry Development Trends Analysis
- 2 Automatic Wafer Thinning Machine Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Automatic Wafer Thinning Machine Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Automatic Wafer Thinning Machine Market Analysis by Country
- 4.1 Global Automatic Wafer Thinning Machine Market Size Analysis by Country: 2024 VS 2025 VS 2032
- 4.1.1 Global Automatic Wafer Thinning Machine Revenue and Market Share by Country (2020-2025)
- 4.1.2 Global Automatic Wafer Thinning Machine Revenue and Market Share Forecast by Country (2026-2032)
- 4.2 Global Automatic Wafer Thinning Machine Sales Analysis by Country: 2024 VS 2025 VS 2032
- 4.2.1 Global Automatic Wafer Thinning Machine Sales and Market Share by Country (2020-2025)
- 4.2.2 Global Automatic Wafer Thinning Machine Sales and Market Share Forecast by Country (2026-2032)
- 4.3 United States Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.4 Germany Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.5 Japan Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.6 China Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.7 France Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.8 U.K. Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.9 South Korea Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.10 Canada Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.11 Italy Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.12 Russia Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.13 Mexico Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.14 Brazil Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.15 India Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.16 Vietnam Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.17 Thailand Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 4.18 South Africa Automatic Wafer Thinning Machine Market Sales, Revenue and Growth Rate (2020-2032)
- 5 Competition by Manufacturers
- 5.1 Global Automatic Wafer Thinning Machine Market Sales, Revenue and Sales Price by Key Manufacturers (2021-2025)
- 5.1.1 Global Automatic Wafer Thinning Machine Market Sales by Key Manufacturers (2021-2025)
- 5.1.2 Global Automatic Wafer Thinning Machine Market Revenue by Key Manufacturers (2021-2025)
- 5.1.3 Global Automatic Wafer Thinning Machine Average Sales Price by Manufacturers (2021-2025)
- 5.2 Automatic Wafer Thinning Machine Competitive Landscape Analysis and Market Dynamic
- 5.2.1 Automatic Wafer Thinning Machine Competitive Landscape Analysis
- 5.2.2 Global Key Manufacturers Headquarter and Key Area Sales
- 5.2.3 Market Dynamic
- 6 Automatic Wafer Thinning Machine Market Analysis by Type
- 6.1 Global Automatic Wafer Thinning Machine Market Revenue Analysis by Type
- 6.1.1 Global Automatic Wafer Thinning Machine Market Size Analysis by Type: 2024 & 2025 & 2032
- 6.1.2 Global Automatic Wafer Thinning Machine Revenue and Forecast Analysis by Type (2020-2032)
- 6.2 Global Automatic Wafer Thinning Machine Sales and Forecast Analysis by Type (2020-2032)
- 6.3 Global Automatic Wafer Thinning Machine Sales Price Trend Analysis by Type (2020-2032)
- 7 Key Companies Analysis
- 7.1 Disco
- 7.1.1 Disco Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.1.2 Disco Automatic Wafer Thinning Machine Product Portfolio
- 7.1.3 Disco Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.2 Tokyo Precision
- 7.2.1 Tokyo Precision Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.2.2 Tokyo Precision Automatic Wafer Thinning Machine Product Portfolio
- 7.2.3 Tokyo Precision Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.3 G&N
- 7.3.1 G&N Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.3.2 G&N Automatic Wafer Thinning Machine Product Portfolio
- 7.3.3 G&N Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.4 Okamoto Semiconductor Equipment Division
- 7.4.1 Okamoto Semiconductor Equipment Division Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.4.2 Okamoto Semiconductor Equipment Division Automatic Wafer Thinning Machine Product Portfolio
- 7.4.3 Okamoto Semiconductor Equipment Division Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.5 Beijing CETC
- 7.5.1 Beijing CETC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.5.2 Beijing CETC Automatic Wafer Thinning Machine Product Portfolio
- 7.5.3 Beijing CETC Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.6 Koyo Machinery
- 7.6.1 Koyo Machinery Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.6.2 Koyo Machinery Automatic Wafer Thinning Machine Product Portfolio
- 7.6.3 Koyo Machinery Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.7 Revasum
- 7.7.1 Revasum Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.7.2 Revasum Automatic Wafer Thinning Machine Product Portfolio
- 7.7.3 Revasum Automatic Wafer Thinning Machine Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.8 WAIDA MFG
- 7.8.1 WAIDA MFG Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.8.2 WAIDA MFG Automatic Wafer Thinning Machine Product Portfolio
- 7.8.3 WAIDA MFG Automatic Wafer Thinning M
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
