High Performance Computing (HPC) Chipset Market, By Chipset Type, By Interconnect Technology, By Memory Type, By Application, By Country, and By Region – Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032

REPORT HIGHLIGHT

High Performance Computing (HPC) Chipset Market size was valued at US$ 7,809.28 Million in 2024, expanding at a CAGR of 16.70% from 2025 to 2032.
The High-Performance Computing (HPC) Chipset Market involves specialized processors and architectures designed to perform complex computations at high speeds for scientific, industrial, and commercial applications. The rising demand for AI modeling, climate simulation, and genomics research is driving the need for faster, energy-efficient chipsets. Limited semiconductor fabrication capacity and high development costs present challenges. However, growing government investments in exascale computing and quantum research offer long-term potential. In 2024, the U.S. Department of Energy’s Aurora supercomputer, powered by Intel and HPE chips, achieved over 1.2 exaflops in benchmark performance testing.
High Performance Computing (HPC) Chipset Market- Market Dynamics

AI Workloads and Scientific Research Drive Demand for High-Performance Computing Chipsets
The increasing complexity of AI workloads and the growing scale of scientific research are accelerating demand for high-performance computing (HPC) chipsets. In 2024, the U.S. Department of Energy's Aurora supercomputer, developed in partnership with Intel and Hewlett Packard Enterprise, was benchmarked at over 1.2 exaflops, making it one of the most powerful systems globally. Meanwhile, Japan’s Fugaku supercomputer, co-developed by RIKEN and Fujitsu, continues to support advanced climate modeling and pharmaceutical research. The European Union’s EuroHPC initiative is also investing in regional HPC infrastructure using custom chipsets to reduce reliance on U.S. semiconductors. These systems support applications ranging from weather forecasting and cancer research to national security, pushing innovation in chip design, data throughput, and energy efficiency across public and private sectors.
High Performance Computing (HPC) Chipset Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 16.70% over the forecast period (2025-2032)
Based on Chipset Type segmentation, the GPU was predicted to show maximum market share in the year 2024
Based on Interconnect Technology segmentation, Ethernet was the leading Interconnect Technology in 2024
Based on Memory Type segmentation, Dynamic Random Access Memory (DRAM) was the leading Memory Type in 2024
On the basis of region, North America was the leading revenue generator in 2024
High Performance Computing (HPC) Chipset Market- Segmentation Analysis:

The Global High Performance Computing (HPC) Chipset Market is segmented on the basis of Chipset Type, Interconnect Technology, Memory Type, Application, and Region.
The market is divided into four categories based on Chipset Type: CPU, GPU, FPGA, and ASIC. GPU holds the highest priority due to its parallel processing power ideal for AI and scientific workloads, followed by CPU for general-purpose computing. FPGA offers flexibility for specialized tasks, while ASIC is used in ultra-specific, high-efficiency computing environments.
The market is divided into four categories based on Interconnect Technology: Ethernet, InfiniBand, Optical Interconnects, and Fibre Channel. Ethernet holds the top position due to its widespread adoption and cost-effectiveness, followed by InfiniBand for high-performance computing needs. Optical Interconnects are gaining momentum in data-intensive environments, while Fibre Channel remains relevant in legacy storage networks and specialized enterprise systems.
High Performance Computing (HPC) Chipset Market- Geographical Insights

North America leads the High Performance Computing (HPC) Chipset Market, fueled by federal funding and partnerships between tech giants and research institutions. In 2024, Intel and HPE collaborated with the U.S. Department of Energy to deploy the Aurora supercomputer at Argonne National Laboratory, powered by Intel’s Xeon CPU Max Series and Ponte Vecchio GPUs. Europe is advancing through the EuroHPC Joint Undertaking, with countries like Germany and France investing in domestic chip design and hosting next-gen supercomputing centers. In Asia-Pacific, Japan’s RIKEN and Fujitsu continue enhancing Fugaku’s capabilities, while India’s C-DAC (Centre for Development of Advanced Computing) expanded its indigenous PARAM series under the National Supercomputing Mission. In 2023, AMD partnered with South Korea’s Electronics and Telecommunications Research Institute (ETRI) to develop AI-ready HPC chip architectures. These developments highlight regional focus on technological sovereignty, strategic research, and low-latency, high-throughput computing power.
High Performance Computing (HPC) Chipset Market- Competitive Landscape:

The competitive landscape of the High Performance Computing (HPC) Chipset Market is shaped by strategic alliances and rapid innovation among major semiconductor and computing firms. In 2024, Intel strengthened its position by supplying its Xeon Max and Ponte Vecchio GPUs to multiple exascale systems, including Aurora in the U.S. and supercomputing projects in the EU. NVIDIA continues to dominate the GPU space with its H100 Tensor Core GPUs, deployed across cloud platforms and research clusters worldwide. AMD, following its acquisition of Xilinx in 2022, integrated FPGA capabilities into its EPYC processor line to optimize AI and data-intensive workloads. ARM-based chipsets are gaining traction, particularly through collaborations like the one between Fujitsu and RIKEN for the Fugaku supercomputer in Japan. Additionally, startups like Cerebras Systems are disrupting the market with wafer-scale engines tailored for scientific deep learning tasks, intensifying competition in custom HPC architecture design.

Recent Developments:

In July 2025, WeRide partnered with Lenovo to launch HPC 3.0, a fully automotive grade high performance computing platform powered by dual NVIDIA DRIVE AGX Thor chips. It delivers 2,000 TOPS, cuts autonomous suite costs by roughly 50%, and reduces total cost of ownership by 84%, enabling scalable L4 Robotaxi deployment.
In February 2025, Q.ANT teamed with IMS CHIPS to launch a dedicated production line for high-performance photonic AI chips, using thin-film lithium niobate and repurposed CMOS facilities. With a €14 million investment, the initiative marks a sustainable blueprint to bolster Europe’s chip sovereignty by delivering up to 30× energy efficiency and 50× speed improvements.
In November 2024, Eni launched HPC6, its new supercomputer at the Green Data Center near Milan. With peak performance of 606 PFlop/s and nearly 14,000 GPUs, it debuted fifth on the TOP500 list and ranks first in Europe, powering Eni’s energy transition R&D.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL HIGH PERFORMANCE COMPUTING (HPC) CHIPSET MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

AMD
Arm Ltd.
Atos SE
Broadcom Inc.
Cerebras Systems
Cray Inc.
Dell Technologies
Fujitsu Ltd.
Hewlett Packard Enterprise
IBM
Intel Corporation
Marvell Technology
NEC Corporation
NVIDIA Corporation
Qualcomm
Samsung Electronics
SiFive Inc.
Tachyum
Tenstorrent
TSMC
Others

GLOBAL HIGH PERFORMANCE COMPUTING (HPC) CHIPSET MARKET, BY CHIPSET TYPE- MARKET ANALYSIS, 2019 - 2032

CPU
GPU
FPGA
ASIC

GLOBAL HIGH PERFORMANCE COMPUTING (HPC) CHIPSET MARKET, BY INTERCONNECT TECHNOLOGY- MARKET ANALYSIS, 2019 - 2032

Ethernet
InfiniBand
Optical Interconnects
Fibre Channel

GLOBAL HIGH PERFORMANCE COMPUTING (HPC) CHIPSET MARKET, BY MEMORY TYPE- MARKET ANALYSIS, 2019 - 2032

Dynamic Random Access Memory (DRAM)
High Bandwidth Memory (HBM)
Flash Memory

GLOBAL HIGH PERFORMANCE COMPUTING (HPC) CHIPSET MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

Artificial Intelligence (AI) and Machine Learning (ML)
Data Analytics
Scientific Research and Simulations
Cloud Computing
Engineering Applications

GLOBAL HIGH PERFORMANCE COMPUTING (HPC) CHIPSET MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

North America
U.S.
Canada
Europe
Germany
UK
France
Italy
Spain
The Netherlands
Sweden
Russia
Poland
Rest of Europe
Asia Pacific
China
India
Japan
South Korea
Australia
Indonesia
Thailand
Philippines
Rest of APAC
Latin America
Brazil
Mexico
Argentina
Colombia
Rest of LATAM
The Middle East and Africa
Saudi Arabia
UAE
Israel
Turkey
Algeria
Egypt
Rest of MEA Show more