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Advanced IC Packaging Market by Type (2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit), Application (Aerospace & Defense, Automotive & Transportation, Consumer Electronics) - Global Forecast 2024-2030

Publisher 360iResearch
Published Jan 15, 2024
Length 197 Pages
SKU # IRE18417841

Description

Advanced IC Packaging Market by Type (2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit), Application (Aerospace & Defense, Automotive & Transportation, Consumer Electronics) - Global Forecast 2024-2030


The Advanced IC Packaging Market size was estimated at USD 45.02 billion in 2023 and expected to reach USD 48.51 billion in 2024, at a CAGR 8.26% to reach USD 78.50 billion by 2030.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Advanced IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Advanced IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech – Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

Type

2.5D Integrated Circuit
  • 2D Integrated Circuit
  • 3D Integrated Circuit
  • Fan Out Silicon In Package
  • Fan Out Wafer Level Package
  • Flip Chip
  • Wafer Level Chip Scale Package
  • Application

    Aerospace & Defense
  • Automotive & Transportation
  • Consumer Electronics
  • IT & Telecom
  • Region

    Americas

    Argentina
  • Brazil
  • Canada
  • Mexico
  • United States

    California
  • Florida
  • Illinois
  • New York
  • Ohio
  • Pennsylvania
  • Texas
  • Asia-Pacific

    Australia
  • China
  • India
  • Indonesia
  • Japan
  • Malaysia
  • Philippines
  • Singapore
  • South Korea
  • Taiwan
  • Thailand
  • Vietnam
  • Europe, Middle East & Africa

    Denmark
  • Egypt
  • Finland
  • France
  • Germany
  • Israel
  • Italy
  • Netherlands
  • Nigeria
  • Norway
  • Poland
  • Qatar
  • Russia
  • Saudi Arabia
  • South Africa
  • Spain
  • Sweden
  • Switzerland
  • Turkey
  • United Arab Emirates
  • United Kingdom
    The report offers valuable insights on the following aspects:

    1. Market Penetration: It presents comprehensive information on the market provided by key players.
    2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
    3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
    4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
    5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
    The report addresses key questions such as:

    1. What is the market size and forecast of the Advanced IC Packaging Market?
    2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Advanced IC Packaging Market?
    3. What are the technology trends and regulatory frameworks in the Advanced IC Packaging Market?
    4. What is the market share of the leading vendors in the Advanced IC Packaging Market?
    5. Which modes and strategic moves are suitable for entering the Advanced IC Packaging Market?


    Note: PDF & Excel + Online Access - 1 Year

    • Table of Contents

    197 Pages
    1. Preface
    1.1. Objectives of the Study
    1.2. Market Segmentation & Coverage
    1.3. Years Considered for the Study
    1.4. Currency & Pricing
    1.5. Language
    1.6. Limitations
    1.7. Assumptions
    1.8. Stakeholders
    2. Research Methodology
    2.1. Define: Research Objective
    2.2. Determine: Research Design
    2.3. Prepare: Research Instrument
    2.4. Collect: Data Source
    2.5. Analyze: Data Interpretation
    2.6. Formulate: Data Verification
    2.7. Publish: Research Report
    2.8. Repeat: Report Update
    3. Executive Summary
    4. Market Overview
    4.1. Introduction
    4.2. Advanced IC Packaging Market, by Region
    5. Market Insights
    5.1. Market Dynamics
    5.1.1. Drivers
    5.1.1.1. Increasing demand and adoption of consumer electronic devices
    5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
    5.1.1.3. Ongoing electrification of transportation sector across economies
    5.1.2. Restraints
    5.1.2.1. High cost of advanced IC packaging processes
    5.1.3. Opportunities
    5.1.3.1. Evolution and development of new advanced IC packaging solutions
    5.1.3.2. Rising investment in semiconductor manufacturing industry
    5.1.4. Challenges
    5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
    5.2. Market Segmentation Analysis
    5.3. Market Trend Analysis
    5.4. Cumulative Impact of High Inflation
    5.5. Porter’s Five Forces Analysis
    5.5.1. Threat of New Entrants
    5.5.2. Threat of Substitutes
    5.5.3. Bargaining Power of Customers
    5.5.4. Bargaining Power of Suppliers
    5.5.5. Industry Rivalry
    5.6. Value Chain & Critical Path Analysis
    5.7. Regulatory Framework
    6. Advanced IC Packaging Market, by Type
    6.1. Introduction
    6.2. 2.5D Integrated Circuit
    6.3. 2D Integrated Circuit
    6.4. 3D Integrated Circuit
    6.5. Fan Out Silicon In Package
    6.6. Fan Out Wafer Level Package
    6.7. Flip Chip
    6.8. Wafer Level Chip Scale Package
    7. Advanced IC Packaging Market, by Application
    7.1. Introduction
    7.2. Aerospace & Defense
    7.3. Automotive & Transportation
    7.4. Consumer Electronics
    7.5. IT & Telecom
    8. Americas Advanced IC Packaging Market
    8.1. Introduction
    8.2. Argentina
    8.3. Brazil
    8.4. Canada
    8.5. Mexico
    8.6. United States
    9. Asia-Pacific Advanced IC Packaging Market
    9.1. Introduction
    9.2. Australia
    9.3. China
    9.4. India
    9.5. Indonesia
    9.6. Japan
    9.7. Malaysia
    9.8. Philippines
    9.9. Singapore
    9.10. South Korea
    9.11. Taiwan
    9.12. Thailand
    9.13. Vietnam
    10. Europe, Middle East & Africa Advanced IC Packaging Market
    10.1. Introduction
    10.2. Denmark
    10.3. Egypt
    10.4. Finland
    10.5. France
    10.6. Germany
    10.7. Israel
    10.8. Italy
    10.9. Netherlands
    10.10. Nigeria
    10.11. Norway
    10.12. Poland
    10.13. Qatar
    10.14. Russia
    10.15. Saudi Arabia
    10.16. South Africa
    10.17. Spain
    10.18. Sweden
    10.19. Switzerland
    10.20. Turkey
    10.21. United Arab Emirates
    10.22. United Kingdom
    11. Competitive Landscape
    11.1. FPNV Positioning Matrix
    11.2. Market Share Analysis, By Key Player
    11.3. Competitive Scenario Analysis, By Key Player
    12. Competitive Portfolio
    12.1. Key Company Profiles
    12.1.1. Amkor Technology, Inc.
    12.1.2. ASE Technology Holding Co, Ltd.
    12.1.3. ASMPT
    12.1.4. Broadcom, Inc.
    12.1.5. Cadence Design Systems, Inc.
    12.1.6. Carsem (M) Sdn Bhd
    12.1.7. Faraday Technology Corporation
    12.1.8. FormFactor, Inc.
    12.1.9. Intel Corporation
    12.1.10. Jiangsu Changdian Technology Co., Ltd.
    12.1.11. KYOCERA Corporation
    12.1.12. Microchip Technology Inc.
    12.1.13. Micross Components, Inc.
    12.1.14. NHanced Semiconductors, Inc.
    12.1.15. NXP Semiconductors N.V.
    12.1.16. Optima Technology Associates, Inc.
    12.1.17. Pac Tech – Packaging Technologies GmbH
    12.1.18. Powertech Technology Inc.
    12.1.19. Renesas Electronics Corporation
    12.1.20. Samsung Electronics Co., Ltd.
    12.1.21. Taiwan Semiconductor Manufacturing Company, Ltd.
    12.1.22. Tektronix, Inc.
    12.1.23. Texas Instruments Incorporated
    12.1.24. United Microelectronics Corporation
    12.2. Key Product Portfolio
    13. Appendix
    13.1. Discussion Guide
    13.2. License & Pricing
    FIGURE 1. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
    FIGURE 2. ADVANCED IC PACKAGING MARKET SIZE, 2023 VS 2030
    FIGURE 3. ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
    FIGURE 4. ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
    FIGURE 5. ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 6. ADVANCED IC PACKAGING MARKET DYNAMICS
    FIGURE 7. ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
    FIGURE 8. ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 9. ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
    FIGURE 10. ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 11. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
    FIGURE 12. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
    FIGURE 14. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 15. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
    FIGURE 16. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 17. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
    FIGURE 18. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
    FIGURE 19. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
    FIGURE 20. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023

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