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Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung, and TSMC

Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung, and TSMC

The worldwide semiconductor foundry market has been growing steadily in recent years, thanks to the demand for smartphones, computers, wearables, and IoT (Internet of Things) application devices. Advanced processes have been the major driving force behind the growth. For this reason, IDMs such as Intel and Samsung have been deploying in 14nm and 10nm process technologies, thereby shaking the leadership of TSMC's market share. This report profiles the competition among Intel, Samsung, and TSMC—from the perspective of technology deployment, manufacturing capabilities, and customer relationship—and analyzes the future development of the semiconductor foundry market.


  • ANALYSIS OF ADVANCED PROCESS TECHNOLOGIES
    • Technology Roadmaps
      • Intel's Technology Leadership Had Little Impact on Pure-play Foundries
      • TSMC Dominates 20nm Process; Samsung Has a Head Start in 14nm Process
      • TSMC, Samsung Head-to-Head Competition for 10nm Process
    • Development of Key Technologies
      • Vendors Pursue 3D FinFET in Sub-2xnm Designs
      • TSMC Gets the Upper Hand over Samsung on 16/14nm Process
      • Samsung Faces More Challenges at 10nm Technology
      • Vendors All Focus on 3D IC Packaging Services
    • Capital Expenditures (Capex)
      • TSMC Concentrates on Advanced Process Investments
  • ANALYSIS OF MANUFACTURING CAPABILITIES
    • Diversified Production Lines to Strengthen Competitiveness
      • TSMC Continues to Expand Market Share of Homogeneous ICs
      • Samsung, Intel Have a Head Start in Heterogeneous Integration
    • Smart Manufacturing to Create Economic Benefits
      • TSMC can Use Big Data Analytics to Widen its Advantage
  • ANALYSIS OF CUSTOMER RELATIONSHIP
    • Samsung, Intel May Have Lower Customer Trust
  • CONCLUSION
    • Intel Strengthens Advanced Process Capacity by Acquisitions
    • Samsung Could Focus on Heterogeneous Integration
    • TSMC Needs to Reinforce Cooperation with Memory Vendors on 3D ICs
  • APPENDIX
    • Glossary of Terms
    • List of Companies

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