Development of the Global IC Packaging and Testing Industry, 2019 and Beyond

Development of the Global IC Packaging and Testing Industry, 2019 and Beyond

Worldwide OSAT (Outsourced Semiconductor Assembly and Test) companies who perform IC packaging and testing services registered significant shipment value growth in 2018, thanks to a continued increase in memory production and an advanced inventory replenishment in anticipation of potential tariff increases from the US-China trade war. Worldwide IC packaging and testing industry shipment value in 2018 totaled US$29.462 billion in 2018, up by 7.69% compared to 2017. This report reviews the performance of the worldwide IC packaging and testing industry in 2018 and analyzes its development in 2019 and beyond.


  • WORLDWIDE INDUSTRY SHIPMENT VALUE
    • Steady Growth in 2018
      • OSAT Companies' Market Share Struck by Trade War
      • Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
    • Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
      • Top Six OSAT Companies' Spots Remain Unchanged While Gap between Top Three Narrowing
        • Table M&A of Leading OSAT Companies, 2014-2019
      • Taiwanese IC Packaging and Testing Industry Posts Higher-than- Global-Average Growth at 8.4% in 2018
  • DEVELOPMENT OF LEADING INTERNATIONAL OSAT COMPANIES
    • Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
    • JCET's M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
    • Tianshui Huatian Technology Did Not Live Up to Expectation in 2018
    • Tongfu Microelectronics Maintains High Growth Fueled by International Customers
  • DEVELOPMENT OF LEADING TAIWANESE OSAT COMPANIES
    • ASE Benefits from M&A Synergy with Focus on SiP Technology
      • Table ASE Revenues by Business Types
      • Table Milestones of ASE-SPIL Merger
      • ASE Aggressively Develops SiP to Help Customers Reduce Costs
    • PTI Strives for Product Diversification by Expanding Non-Memory Business
      • Table PTI Revenue by Business Type
    • CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues
  • MIC PERSPECTIVE
    • A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019
    • SiP and Heterogeneous Integration as Key Driving Force for Growth
    • Trade Restrictions Put Stability of Supply Chain to Test
  • APPENDIX
    • Glossary of Terms
    • List of Companies

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