Global Wafer Back Grinder Wheels Market Growth 2025-2031

The global Wafer Back Grinder Wheels market size is predicted to grow from US$ 167 million in 2025 to US$ 244 million in 2031; it is expected to grow at a CAGR of 6.5% from 2025 to 2031.

Wafer Back Grinder Wheels are specialized abrasive wheels used in wafer thinning processes for semiconductor manufacturing. These wheels are designed to precisely grind the backside of silicon wafers to achieve ultra-thin thicknesses, making them suitable for advanced applications like 3D ICs, MEMS, power devices, and flip-chip packaging.

United States market for Wafer Back Grinder Wheels is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Wafer Back Grinder Wheels is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Wafer Back Grinder Wheels is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Wafer Back Grinder Wheels players cover DISCO Corporation, ACCRETECH, YDI Co., LTD., KURE GRINDING WHEEL, Kinik Company, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Wafer Back Grinder Wheels Industry Forecast” looks at past sales and reviews total world Wafer Back Grinder Wheels sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Back Grinder Wheels sales for 2025 through 2031. With Wafer Back Grinder Wheels sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Back Grinder Wheels industry.

This Insight Report provides a comprehensive analysis of the global Wafer Back Grinder Wheels landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Back Grinder Wheels portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Back Grinder Wheels market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Back Grinder Wheels and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Back Grinder Wheels.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Back Grinder Wheels market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Ceramic Binder
Resin Binder
Metal Binder

Segmentation by Application:
Silicon Wafer
Compound Semiconductor Wafer

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
ACCRETECH
YDI Co., LTD.
KURE GRINDING WHEEL
Kinik Company
Asahi Diamond Industrial
Norton Abrasive (Saint-Gobain)
EHWA DIAMOND
A.L.M.T. Corp.
Shinhan Diamond
Qingdao Gaoce Technology
Zhengzhou Research Institute For Abrasives & Grinding (Sinomach)
Suzhou Sail Science & Technology
NanJing Sanchao Advanced Materials

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Back Grinder Wheels market?

What factors are driving Wafer Back Grinder Wheels market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Back Grinder Wheels market opportunities vary by end market size?

How does Wafer Back Grinder Wheels break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.