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Global Semiconductor Front-End Equipment Market Growth 2025-2031

Published Jul 02, 2025
Length 193 Pages
SKU # LPI20152852

Description

The global Semiconductor Front-End Equipment market size is predicted to grow from US$ 109010 million in 2025 to US$ 162470 million in 2031; it is expected to grow at a CAGR of 6.9% from 2025 to 2031.

Semiconductor front-end equipment mainly includes eight categories: lithography machines, etch equipment, deposition/thin film machines, ion implanter, CMP equipment, cleaning equipment, front-end inspection equipment and oxidation annealing equipment. Front-end equipment is used in the wafer manufacturing process, covering hundreds of processes from optical slices to wafers.

The global semiconductor etching equipment market was valued at US$ 19.6 billion in 2024 and is expected to reach US$ 29.9 billion by 2031, growing at a CAGR of 6.35% during 2025-2031.

The global semiconductor Lithography equipment market was valued at US$ 24.8 billion in 2024 and is expected to reach US$ 35.99 billion by 2031, growing at a CAGR of 5.85% during 2025-2031.

The global semiconductor metrology and inspection equipment market was valued at US$ 16.3 billion in 2024 and is expected to reach US$ 25.0 billion by 2031, growing at a CAGR of 6.67% during 2025-2031.

The global semiconductor deposition equipment market was valued at US$ 23.9 billion in 2024 and is expected to reach US$ 36.6 billion by 2031, growing at a CAGR of 6.5% during 2025-2031.

The global semiconductor cleaning equipment market was valued at US$ 4.58 billion in 2024 and is expected to reach US$ 7.22 billion by 2031, growing at a CAGR of 6.72% during 2025-2031.

The global semiconductor Track/(Coater & Developer) market was valued at US$ 411 billion in 2024 and is expected to reach US$ 6.24 billion by 2031, growing at a CAGR of 6.13% during 2025-2031.

The global semiconductor CMP equipment market was valued at US$ 5.0 billion in 2024 and is expected to reach US$ 8.16 billion by 2031, growing at a CAGR of 6.67% during 2025-2031.

The global semiconductor heat treatment equipment market was valued at US$ 2.17 billion in 2024 and is expected to reach US$ 3.26 billion by 2031, growing at a CAGR of 6.11% during 2025-2031.

The global semiconductor Ion implantation systems market was valued at US$ 5.12 billion in 2024 and is expected to reach US$ 7.85 billion by 2031, growing at a CAGR of 6.21% during 2025-2031.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Front-End Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Front-End Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Front-End Equipment sales for 2025 through 2031. With Semiconductor Front-End Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Front-End Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Front-End Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Front-End Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Front-End Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Front-End Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Front-End Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Front-End Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Semiconductor Etch Equipment
Lithography Machines
Semiconductor Metrology and Inspection
Semiconductor Deposition System
Semiconductor Cleaning Equipment
Track/(Coater & Developer)
CMP Equipment
Heat Treatment Equipment
Ion Implant

Segmentation by Application:
Foundry and Logic Equipment
NAND Equipment
DRAM Equipment
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASML
KLA Corporation
Lam Research
ASM International
Kokusai Electric
Applied Materials, Inc. (AMAT)
Nikon Precision Inc
Ebara Technologies, Inc. (ETI)
Axcelis Technologies Inc
Canon
TEL (Tokyo Electron Ltd.)
ULVAC
SCREEN
DISCO Corporation
Hitachi High-Tech Corporation
SEMES
Onto Innovation
PSK Group
NuFlare Technology, Inc.
Wonik IPS
Eugene Technology
Jusung Engineering
TES CO., LTD
Veeco
Oxford Instruments
Samco Inc.
Lasertec
SUSS Group
NAURA
AMEC
Skyverse Technology
Hwatsing Technology
ACM Research
Piotech, Inc
PNC Technology Group
KINGSEMI Co., Ltd
Beijing E-Town Semiconductor Technology
Shanghai Micro Electronics Equipment (SMEE)
Camtek
ZEUS Co., Ltd.
Shibaura Mechatronics
KCTech Co., ltd

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Front-End Equipment market?

What factors are driving Semiconductor Front-End Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Front-End Equipment market opportunities vary by end market size?

How does Semiconductor Front-End Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.

Table of Contents

193 Pages
*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Global by Company
4 World Historic Review for Semiconductor Front-End Equipment by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for Semiconductor Front-End Equipment by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion
How Do Licenses Work?
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