Global Semiconductor Epoxy Molding Compound Market Growth 2025-2031
Description
The global Semiconductor Epoxy Molding Compound market size is predicted to grow from US$ 2517 million in 2025 to US$ 3349 million in 2031; it is expected to grow at a CAGR of 4.9% from 2025 to 2031.
Semiconductor epoxy molding compound (EMC) is a critical material used in the semiconductor packaging process. It is a thermosetting resin-based compound that encapsulates and protects semiconductor chips and wire bonds. The epoxy molding compound is applied in a process known as "transfer molding" to form the protective encapsulation around the semiconductor device.
The semiconductor epoxy molding compound (EMC) market plays a crucial role in the semiconductor packaging industry. EMC is widely used to encapsulate and protect semiconductor devices, providing mechanical, thermal, and electrical properties that enhance the reliability and performance of the chips. The demand for semiconductor devices across various industries, such as consumer electronics, automotive, industrial, and telecommunications, has been a significant driver for the growth of the EMC market. The demand for semiconductor epoxy molding compounds is spread across regions, with Asia-Pacific being a dominant market due to the presence of major semiconductor manufacturers in countries like China, Taiwan, South Korea, and Japan. North America and Europe also contribute significantly to the global market, owing to the strong presence of semiconductor and electronics industries in these regions. The semiconductor epoxy molding compound market is expected to witness continued growth in the coming years, driven by the expansion of semiconductor applications, advancements in packaging technologies, and the increasing need for reliable and efficient semiconductor devices in various industries.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Epoxy Molding Compound Industry Forecast” looks at past sales and reviews total world Semiconductor Epoxy Molding Compound sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Epoxy Molding Compound sales for 2025 through 2031. With Semiconductor Epoxy Molding Compound sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Epoxy Molding Compound industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Epoxy Molding Compound landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Epoxy Molding Compound portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Epoxy Molding Compound market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Epoxy Molding Compound and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Epoxy Molding Compound.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Epoxy Molding Compound market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Bulk Molding Compounds
Sheet Molding Compounds
Segmentation by Application:
Semiconductor Packaging
Electronic Component
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Hitachi Chemical
Sumitomo Bakelite Company
Panasonic
Kyocera
Samsung SDI
KCC Corporation
Chang Chun Group
Hysol Huawei Electronics
Nepes
PhiChem Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
CAPLINQ Corporation
Scienchem
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Epoxy Molding Compound market?
What factors are driving Semiconductor Epoxy Molding Compound market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Epoxy Molding Compound market opportunities vary by end market size?
How does Semiconductor Epoxy Molding Compound break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Semiconductor epoxy molding compound (EMC) is a critical material used in the semiconductor packaging process. It is a thermosetting resin-based compound that encapsulates and protects semiconductor chips and wire bonds. The epoxy molding compound is applied in a process known as "transfer molding" to form the protective encapsulation around the semiconductor device.
The semiconductor epoxy molding compound (EMC) market plays a crucial role in the semiconductor packaging industry. EMC is widely used to encapsulate and protect semiconductor devices, providing mechanical, thermal, and electrical properties that enhance the reliability and performance of the chips. The demand for semiconductor devices across various industries, such as consumer electronics, automotive, industrial, and telecommunications, has been a significant driver for the growth of the EMC market. The demand for semiconductor epoxy molding compounds is spread across regions, with Asia-Pacific being a dominant market due to the presence of major semiconductor manufacturers in countries like China, Taiwan, South Korea, and Japan. North America and Europe also contribute significantly to the global market, owing to the strong presence of semiconductor and electronics industries in these regions. The semiconductor epoxy molding compound market is expected to witness continued growth in the coming years, driven by the expansion of semiconductor applications, advancements in packaging technologies, and the increasing need for reliable and efficient semiconductor devices in various industries.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Epoxy Molding Compound Industry Forecast” looks at past sales and reviews total world Semiconductor Epoxy Molding Compound sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Epoxy Molding Compound sales for 2025 through 2031. With Semiconductor Epoxy Molding Compound sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Epoxy Molding Compound industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Epoxy Molding Compound landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Epoxy Molding Compound portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Epoxy Molding Compound market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Epoxy Molding Compound and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Epoxy Molding Compound.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Epoxy Molding Compound market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Bulk Molding Compounds
Sheet Molding Compounds
Segmentation by Application:
Semiconductor Packaging
Electronic Component
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Hitachi Chemical
Sumitomo Bakelite Company
Panasonic
Kyocera
Samsung SDI
KCC Corporation
Chang Chun Group
Hysol Huawei Electronics
Nepes
PhiChem Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
CAPLINQ Corporation
Scienchem
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Epoxy Molding Compound market?
What factors are driving Semiconductor Epoxy Molding Compound market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Epoxy Molding Compound market opportunities vary by end market size?
How does Semiconductor Epoxy Molding Compound break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
124 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Epoxy Molding Compound by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Epoxy Molding Compound by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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