Global Laser Processing Machine for IC Substrates Market Growth 2025-2031
Description
The global Laser Processing Machine for IC Substrates market size is predicted to grow from US$ 98 million in 2025 to US$ 128 million in 2031; it is expected to grow at a CAGR of 4.5% from 2025 to 2031.
This report studies laser processing machines for IC Substrates, covering the drilling machine and laser direct imaging (LDI) for IC Substrates.
The key manufacturers of IC substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, and Samsung Electro-Mechanics, etc. Currently FC-BGA (ABF) is the largest and fastest-growing segment of IC Substrate, driven by the demand from PCs, server, AI Chips, Data Center, HPC Chips, and Communication, etc.
LP Information, Inc. (LPI) ' newest research report, the “Laser Processing Machine for IC Substrates Industry Forecast” looks at past sales and reviews total world Laser Processing Machine for IC Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected Laser Processing Machine for IC Substrates sales for 2025 through 2031. With Laser Processing Machine for IC Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Processing Machine for IC Substrates industry.
This Insight Report provides a comprehensive analysis of the global Laser Processing Machine for IC Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Processing Machine for IC Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Processing Machine for IC Substrates market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Processing Machine for IC Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Processing Machine for IC Substrates.
This report presents a comprehensive overview, market shares, and growth opportunities of Laser Processing Machine for IC Substrates market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Drilling Machine for IC Substrate
Laser Direct Imaging (LDI) for IC Substrate
Segmentation by Application:
FC-BGA
FC-CSP
BGA/CSP
SiP and RF Modules
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
LPKF
Via Mechanics
MKS (ESI)
Tongtai Machine & Tool
Orbotech (KLA)
ADTEC
SCREEN
Chime Ball Technology
ORC Manufacturing
Ofuna Technology Co., Ltd.
Schmoll Maschinen
Manz AG
Circuit Fabology Microelectronics Equipment Co.,Ltd.
TZTEK Company
Han's Laser
Jiangsu Yingsu IC Equipment
HGLaser Engineering
Vega Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Laser Processing Machine for IC Substrates market?
What factors are driving Laser Processing Machine for IC Substrates market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Laser Processing Machine for IC Substrates market opportunities vary by end market size?
How does Laser Processing Machine for IC Substrates break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
This report studies laser processing machines for IC Substrates, covering the drilling machine and laser direct imaging (LDI) for IC Substrates.
The key manufacturers of IC substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, and Samsung Electro-Mechanics, etc. Currently FC-BGA (ABF) is the largest and fastest-growing segment of IC Substrate, driven by the demand from PCs, server, AI Chips, Data Center, HPC Chips, and Communication, etc.
LP Information, Inc. (LPI) ' newest research report, the “Laser Processing Machine for IC Substrates Industry Forecast” looks at past sales and reviews total world Laser Processing Machine for IC Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected Laser Processing Machine for IC Substrates sales for 2025 through 2031. With Laser Processing Machine for IC Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Processing Machine for IC Substrates industry.
This Insight Report provides a comprehensive analysis of the global Laser Processing Machine for IC Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Processing Machine for IC Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Processing Machine for IC Substrates market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Processing Machine for IC Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Processing Machine for IC Substrates.
This report presents a comprehensive overview, market shares, and growth opportunities of Laser Processing Machine for IC Substrates market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Drilling Machine for IC Substrate
Laser Direct Imaging (LDI) for IC Substrate
Segmentation by Application:
FC-BGA
FC-CSP
BGA/CSP
SiP and RF Modules
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
LPKF
Via Mechanics
MKS (ESI)
Tongtai Machine & Tool
Orbotech (KLA)
ADTEC
SCREEN
Chime Ball Technology
ORC Manufacturing
Ofuna Technology Co., Ltd.
Schmoll Maschinen
Manz AG
Circuit Fabology Microelectronics Equipment Co.,Ltd.
TZTEK Company
Han's Laser
Jiangsu Yingsu IC Equipment
HGLaser Engineering
Vega Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Laser Processing Machine for IC Substrates market?
What factors are driving Laser Processing Machine for IC Substrates market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Laser Processing Machine for IC Substrates market opportunities vary by end market size?
How does Laser Processing Machine for IC Substrates break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
142 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Laser Processing Machine for IC Substrates by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Laser Processing Machine for IC Substrates by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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