The global High–performance Adhesives for Semiconductor market size is predicted to grow from US$ 1471 million in 2025 to US$ 2618 million in 2031; it is expected to grow at a CAGR of 10.1% from 2025 to 2031.
High-performance adhesives for semiconductors are specialized bonding materials used in the semiconductor industry to assemble and encapsulate components with extremely high precision, strength, and durability. These adhesives are designed to meet the rigorous requirements of semiconductor manufacturing, where reliability, thermal stability, electrical insulation, and resistance to harsh environmental conditions are critical.
These adhesives are typically used in processes such as chip bonding, die attachment, encapsulation, wire bonding, and packaging of semiconductor devices.
United States market for High–performance Adhesives for Semiconductor is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for High–performance Adhesives for Semiconductor is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for High–performance Adhesives for Semiconductor is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key High–performance Adhesives for Semiconductor players cover Henkel, DuPont, DELO, Meridian Adhesives Group, TOK, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “High–performance Adhesives for Semiconductor Industry Forecast” looks at past sales and reviews total world High–performance Adhesives for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected High–performance Adhesives for Semiconductor sales for 2025 through 2031. With High–performance Adhesives for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High–performance Adhesives for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global High–performance Adhesives for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High–performance Adhesives for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High–performance Adhesives for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High–performance Adhesives for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High–performance Adhesives for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of High–performance Adhesives for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Epoxy
Silicone
Other
Segmentation by Application:
Semiconductor packaging
Die Attach
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
DuPont
DELO
Meridian Adhesives Group
TOK
3M
Heraeus Electronics
Sekisui Chemical
AI Technology
United Adhesives Adhesives
Laird Performance Materials
Ameri-Cal Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global High–performance Adhesives for Semiconductor market?
What factors are driving High–performance Adhesives for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do High–performance Adhesives for Semiconductor market opportunities vary by end market size?
How does High–performance Adhesives for Semiconductor break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
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