Global Direct Imaging (DI) System for PCB Market Growth 2025-2031
Description
The global Direct Imaging (DI) System for PCB market size is predicted to grow from US$ 587 million in 2025 to US$ 843 million in 2031; it is expected to grow at a CAGR of 6.2% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
A Direct Imaging (DI) system for printed circuit boards (PCBs) is an advanced photolithography technology that replaces traditional photomask-based exposure by using digitally controlled light sources, such as UV lasers or LEDs, to project circuit patterns directly onto photoresist-coated PCB substrates. This maskless process enables rapid design changes, higher alignment accuracy, and finer feature resolution, making it ideal for high-density interconnect (HDI), flexible circuits, and advanced packaging applications. DI systems enhance production efficiency by eliminating the need for film and reducing setup time, while also improving yield and reducing costs in modern PCB manufacturing.
The market for Direct Imaging (DI) systems in PCB manufacturing is driven by the increasing demand for higher precision and miniaturization in electronic devices, which requires finer circuit patterns and greater design flexibility. As industries such as consumer electronics, automotive, telecommunications, and medical devices push for smaller, more complex, and high-density interconnect (HDI) PCBs, DI technology offers significant advantages over traditional photomask methods by enabling faster design iterations, improved alignment accuracy, and reduced production costs. Additionally, the growing adoption of flexible and multilayer PCBs further fuels demand for DI systems, as these require precise and reliable imaging techniques. Environmental regulations and the need to reduce chemical waste from traditional mask-based processes also support the transition toward direct imaging solutions, driving market growth.
LP Information, Inc. (LPI) ' newest research report, the “Direct Imaging (DI) System for PCB Industry Forecast” looks at past sales and reviews total world Direct Imaging (DI) System for PCB sales in 2024, providing a comprehensive analysis by region and market sector of projected Direct Imaging (DI) System for PCB sales for 2025 through 2031. With Direct Imaging (DI) System for PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Direct Imaging (DI) System for PCB industry.
This Insight Report provides a comprehensive analysis of the global Direct Imaging (DI) System for PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Direct Imaging (DI) System for PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Direct Imaging (DI) System for PCB market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Direct Imaging (DI) System for PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Direct Imaging (DI) System for PCB.
This report presents a comprehensive overview, market shares, and growth opportunities of Direct Imaging (DI) System for PCB market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Laser Direct Imaging
UV-LED Direct Imaging
Segmentation by Application:
PCB Circuit Layer Exposure
PCB Solder Mask Exposure
PCB Artwork Production
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Orbotech
ADTEC
SCREEN
ORC Manufacturing
Chime Ball Technology
Han's Laser
Cfmee
Heidelberg
Jiangsu Ysphotech Technology
Zhongshan Aiscent Technologies
Tztek
LIMATA
KST
Caiz Optronics
SVG OPTRONICS
Key Questions Addressed in this Report
What is the 10-year outlook for the global Direct Imaging (DI) System for PCB market?
What factors are driving Direct Imaging (DI) System for PCB market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Direct Imaging (DI) System for PCB market opportunities vary by end market size?
How does Direct Imaging (DI) System for PCB break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
A Direct Imaging (DI) system for printed circuit boards (PCBs) is an advanced photolithography technology that replaces traditional photomask-based exposure by using digitally controlled light sources, such as UV lasers or LEDs, to project circuit patterns directly onto photoresist-coated PCB substrates. This maskless process enables rapid design changes, higher alignment accuracy, and finer feature resolution, making it ideal for high-density interconnect (HDI), flexible circuits, and advanced packaging applications. DI systems enhance production efficiency by eliminating the need for film and reducing setup time, while also improving yield and reducing costs in modern PCB manufacturing.
The market for Direct Imaging (DI) systems in PCB manufacturing is driven by the increasing demand for higher precision and miniaturization in electronic devices, which requires finer circuit patterns and greater design flexibility. As industries such as consumer electronics, automotive, telecommunications, and medical devices push for smaller, more complex, and high-density interconnect (HDI) PCBs, DI technology offers significant advantages over traditional photomask methods by enabling faster design iterations, improved alignment accuracy, and reduced production costs. Additionally, the growing adoption of flexible and multilayer PCBs further fuels demand for DI systems, as these require precise and reliable imaging techniques. Environmental regulations and the need to reduce chemical waste from traditional mask-based processes also support the transition toward direct imaging solutions, driving market growth.
LP Information, Inc. (LPI) ' newest research report, the “Direct Imaging (DI) System for PCB Industry Forecast” looks at past sales and reviews total world Direct Imaging (DI) System for PCB sales in 2024, providing a comprehensive analysis by region and market sector of projected Direct Imaging (DI) System for PCB sales for 2025 through 2031. With Direct Imaging (DI) System for PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Direct Imaging (DI) System for PCB industry.
This Insight Report provides a comprehensive analysis of the global Direct Imaging (DI) System for PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Direct Imaging (DI) System for PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Direct Imaging (DI) System for PCB market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Direct Imaging (DI) System for PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Direct Imaging (DI) System for PCB.
This report presents a comprehensive overview, market shares, and growth opportunities of Direct Imaging (DI) System for PCB market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Laser Direct Imaging
UV-LED Direct Imaging
Segmentation by Application:
PCB Circuit Layer Exposure
PCB Solder Mask Exposure
PCB Artwork Production
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Orbotech
ADTEC
SCREEN
ORC Manufacturing
Chime Ball Technology
Han's Laser
Cfmee
Heidelberg
Jiangsu Ysphotech Technology
Zhongshan Aiscent Technologies
Tztek
LIMATA
KST
Caiz Optronics
SVG OPTRONICS
Key Questions Addressed in this Report
What is the 10-year outlook for the global Direct Imaging (DI) System for PCB market?
What factors are driving Direct Imaging (DI) System for PCB market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Direct Imaging (DI) System for PCB market opportunities vary by end market size?
How does Direct Imaging (DI) System for PCB break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
125 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Direct Imaging (DI) System for PCB by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Direct Imaging (DI) System for PCB by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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