Global DFN and QFN Packages Market Growth 2025-2031
Description
The global DFN and QFN Packages market size is predicted to grow from US$ 5649 million in 2025 to US$ 6752 million in 2031; it is expected to grow at a CAGR of 3.0% from 2025 to 2031.
QFN package is an emerging surface mount chip packaging technology with small pad size, small volume and plastic as sealing material. The appearance is square or rectangular. It is suitable for high frequency, radio frequency and other applications.
DFN package is a No-leads packaging technology with a Dual Flat structure. It has a smaller size and lower profile than traditional packages. DFN package is usually manufactured using advanced semiconductor processes. Through precision manufacturing processes, the chip is encapsulated in a thin and strong plastic or ceramic substrate, and micro-arc welding or other high-precision connection technologies are used to connect the chip to the pad to achieve electrical and mechanical connections.
The main forms of QFN and DFN packages include QFN16L-80L, DFN2L-16L, etc. The downstream can be mainly used for security chips, automotive electronics, medical equipment electronics, digital video, radio frequency, data acquisition, level converters, inverters, general MCUs, car audio processors, lithium battery charging management chips, etc.
The main feature of QFN and DFN packages is that they occupy a smaller area of PCB. With low cost and small size, QFN/DFN packaging will be a growth point in the next few years.
LP Information, Inc. (LPI) ' newest research report, the “DFN and QFN Packages Industry Forecast” looks at past sales and reviews total world DFN and QFN Packages sales in 2024, providing a comprehensive analysis by region and market sector of projected DFN and QFN Packages sales for 2025 through 2031. With DFN and QFN Packages sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world DFN and QFN Packages industry.
This Insight Report provides a comprehensive analysis of the global DFN and QFN Packages landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on DFN and QFN Packages portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global DFN and QFN Packages market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for DFN and QFN Packages and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global DFN and QFN Packages.
This report presents a comprehensive overview, market shares, and growth opportunities of DFN and QFN Packages market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
QFN Packages
DFN Packages
Segmentation by Application:
Automotive
Consumer Electronics
Industrial
Communication
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASE
Amkor Technology
JCET
Powertech Technology Inc
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC Group
OSE CORP
Chipmos Technologies
King Yuan Electronics
SFA
China Chippacking
Chizhou HISEMI Electronics Technology
Forehope Electronic (Ningbo) Co., Ltd
Wuxi Huarun Anseng Technology
Unimos
Key Questions Addressed in this Report
What is the 10-year outlook for the global DFN and QFN Packages market?
What factors are driving DFN and QFN Packages market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do DFN and QFN Packages market opportunities vary by end market size?
How does DFN and QFN Packages break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
QFN package is an emerging surface mount chip packaging technology with small pad size, small volume and plastic as sealing material. The appearance is square or rectangular. It is suitable for high frequency, radio frequency and other applications.
DFN package is a No-leads packaging technology with a Dual Flat structure. It has a smaller size and lower profile than traditional packages. DFN package is usually manufactured using advanced semiconductor processes. Through precision manufacturing processes, the chip is encapsulated in a thin and strong plastic or ceramic substrate, and micro-arc welding or other high-precision connection technologies are used to connect the chip to the pad to achieve electrical and mechanical connections.
The main forms of QFN and DFN packages include QFN16L-80L, DFN2L-16L, etc. The downstream can be mainly used for security chips, automotive electronics, medical equipment electronics, digital video, radio frequency, data acquisition, level converters, inverters, general MCUs, car audio processors, lithium battery charging management chips, etc.
The main feature of QFN and DFN packages is that they occupy a smaller area of PCB. With low cost and small size, QFN/DFN packaging will be a growth point in the next few years.
LP Information, Inc. (LPI) ' newest research report, the “DFN and QFN Packages Industry Forecast” looks at past sales and reviews total world DFN and QFN Packages sales in 2024, providing a comprehensive analysis by region and market sector of projected DFN and QFN Packages sales for 2025 through 2031. With DFN and QFN Packages sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world DFN and QFN Packages industry.
This Insight Report provides a comprehensive analysis of the global DFN and QFN Packages landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on DFN and QFN Packages portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global DFN and QFN Packages market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for DFN and QFN Packages and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global DFN and QFN Packages.
This report presents a comprehensive overview, market shares, and growth opportunities of DFN and QFN Packages market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
QFN Packages
DFN Packages
Segmentation by Application:
Automotive
Consumer Electronics
Industrial
Communication
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASE
Amkor Technology
JCET
Powertech Technology Inc
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC Group
OSE CORP
Chipmos Technologies
King Yuan Electronics
SFA
China Chippacking
Chizhou HISEMI Electronics Technology
Forehope Electronic (Ningbo) Co., Ltd
Wuxi Huarun Anseng Technology
Unimos
Key Questions Addressed in this Report
What is the 10-year outlook for the global DFN and QFN Packages market?
What factors are driving DFN and QFN Packages market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do DFN and QFN Packages market opportunities vary by end market size?
How does DFN and QFN Packages break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
136 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for DFN and QFN Packages by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for DFN and QFN Packages by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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