Global Copper Product for Semiconductor Package Market Growth 2025-2031
Description
The global Copper Product for Semiconductor Package market size is predicted to grow from US$ 3601 million in 2025 to US$ 5298 million in 2031; it is expected to grow at a CAGR of 6.6% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
The copper materials used in semiconductor packaging primarily include lead frame copper strips, bonding copper wires, high-purity copper, and copper alloy strips.
Lead frame copper strips (e.g., C19400, C70250) serve as core packaging materials, providing structural support for chips and enabling electrical connections. Their high electrical conductivity (≥58 MS/m) and corrosion resistance ensure stable signal transmission, making them widely used in medium- and low-power devices.
Bonding copper wires, acting as interconnects between chips and substrates, have diameters as fine as 15–50 micrometers. Through microalloying (e.g., Cu-Ag), their tensile strength is enhanced to ≥400 MPa, meeting the demands of high-density packaging.
High-purity copper (≥6N) is utilized in copper sputtering targets and backplates. Via physical vapor deposition (PVD), it forms uniform conductive layers that support interconnect structures in advanced packaging. Its low resistivity (<0.017 μΩ·cm) minimizes signal delay.
Copper alloy strips (e.g., Cu-Fe-P, Cu-Ni-Si) combine high conductivity with mechanical strength, making them ideal for power device packaging substrates. Their high-temperature resistance (>200°C) and thermal expansion coefficients matching those of chip materials reduce the risk of thermal stress-induced failures.
According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).
Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Copper Product for Semiconductor Package Industry Forecast” looks at past sales and reviews total world Copper Product for Semiconductor Package sales in 2024, providing a comprehensive analysis by region and market sector of projected Copper Product for Semiconductor Package sales for 2025 through 2031. With Copper Product for Semiconductor Package sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Copper Product for Semiconductor Package industry.
This Insight Report provides a comprehensive analysis of the global Copper Product for Semiconductor Package landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Copper Product for Semiconductor Package portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Copper Product for Semiconductor Package market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Copper Product for Semiconductor Package and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Copper Product for Semiconductor Package.
This report presents a comprehensive overview, market shares, and growth opportunities of Copper Product for Semiconductor Package market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Copper Strips for Semiconductor
Others
Segmentation by Application:
Leadframe
Heat Spreader
Heat Sinks
Copper and Copper Alloy Bonding Wires
Ceramic Substrates
Semiconductor Test Probes
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsubishi Materials
Proterial Metals
Furukawa Electric
Kobe Steel
JX Advanced Metals Corporation
KME
Wieland
Aurubis
Sundwiger Messingwerk
Honeywell
Poongsan
Korea Trading & Industries Corporation
EUNSUNG CO.,LTD
Haegang AP Co., Ltd
DOWA METALTECH
Sumitomo Metal Mining Co., Ltd.
YAMAKIN (JAPAN) CO.,LTD.
Harada Metal Industry
Ningbo Jintian Copper
Ningbo Boway Alloy Material
Jinchuan Group
GUOXI ULTRAPURE
GRIKIN Advanced Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Copper Product for Semiconductor Package market?
What factors are driving Copper Product for Semiconductor Package market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Copper Product for Semiconductor Package market opportunities vary by end market size?
How does Copper Product for Semiconductor Package break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
The copper materials used in semiconductor packaging primarily include lead frame copper strips, bonding copper wires, high-purity copper, and copper alloy strips.
Lead frame copper strips (e.g., C19400, C70250) serve as core packaging materials, providing structural support for chips and enabling electrical connections. Their high electrical conductivity (≥58 MS/m) and corrosion resistance ensure stable signal transmission, making them widely used in medium- and low-power devices.
Bonding copper wires, acting as interconnects between chips and substrates, have diameters as fine as 15–50 micrometers. Through microalloying (e.g., Cu-Ag), their tensile strength is enhanced to ≥400 MPa, meeting the demands of high-density packaging.
High-purity copper (≥6N) is utilized in copper sputtering targets and backplates. Via physical vapor deposition (PVD), it forms uniform conductive layers that support interconnect structures in advanced packaging. Its low resistivity (<0.017 μΩ·cm) minimizes signal delay.
Copper alloy strips (e.g., Cu-Fe-P, Cu-Ni-Si) combine high conductivity with mechanical strength, making them ideal for power device packaging substrates. Their high-temperature resistance (>200°C) and thermal expansion coefficients matching those of chip materials reduce the risk of thermal stress-induced failures.
According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).
Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Copper Product for Semiconductor Package Industry Forecast” looks at past sales and reviews total world Copper Product for Semiconductor Package sales in 2024, providing a comprehensive analysis by region and market sector of projected Copper Product for Semiconductor Package sales for 2025 through 2031. With Copper Product for Semiconductor Package sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Copper Product for Semiconductor Package industry.
This Insight Report provides a comprehensive analysis of the global Copper Product for Semiconductor Package landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Copper Product for Semiconductor Package portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Copper Product for Semiconductor Package market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Copper Product for Semiconductor Package and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Copper Product for Semiconductor Package.
This report presents a comprehensive overview, market shares, and growth opportunities of Copper Product for Semiconductor Package market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Copper Strips for Semiconductor
Others
Segmentation by Application:
Leadframe
Heat Spreader
Heat Sinks
Copper and Copper Alloy Bonding Wires
Ceramic Substrates
Semiconductor Test Probes
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsubishi Materials
Proterial Metals
Furukawa Electric
Kobe Steel
JX Advanced Metals Corporation
KME
Wieland
Aurubis
Sundwiger Messingwerk
Honeywell
Poongsan
Korea Trading & Industries Corporation
EUNSUNG CO.,LTD
Haegang AP Co., Ltd
DOWA METALTECH
Sumitomo Metal Mining Co., Ltd.
YAMAKIN (JAPAN) CO.,LTD.
Harada Metal Industry
Ningbo Jintian Copper
Ningbo Boway Alloy Material
Jinchuan Group
GUOXI ULTRAPURE
GRIKIN Advanced Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Copper Product for Semiconductor Package market?
What factors are driving Copper Product for Semiconductor Package market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Copper Product for Semiconductor Package market opportunities vary by end market size?
How does Copper Product for Semiconductor Package break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
161 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Copper Product for Semiconductor Package by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Copper Product for Semiconductor Package by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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