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Global Automotive Semiconductor Packaging Market Growth (Status and Outlook) 2025-2031

Publisher LP Information, Inc.
Published Jul 10, 2025
Length 197 Pages
SKU # LPI20177206

Description

The global Automotive Semiconductor Packaging market size is predicted to grow from US$ 10350 million in 2025 to US$ 17340 million in 2031; it is expected to grow at a CAGR of 9.0% from 2025 to 2031.

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Automotive Semiconductor Packaging.

Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.

LPI (LP Information)' newest research report, the “Automotive Semiconductor Packaging Industry Forecast” looks at past sales and reviews total world Automotive Semiconductor Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Automotive Semiconductor Packaging sales for 2025 through 2031. With Automotive Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Automotive Semiconductor Packaging industry.

This Insight Report provides a comprehensive analysis of the global Automotive Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Automotive Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Automotive Semiconductor Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Automotive Semiconductor Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Automotive Semiconductor Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Automotive Semiconductor Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:
Advanced Packaging for Automotive
Traditional Packaging for Automotive

Segmentation by Application:
Automotive OSAT
Automotive IDM

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
onsemi
Mitsubishi Electric
Rapidus
Rohm
ADI
Microchip (Microsemi)
Amkor
ASE (SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)

Please note: The report will take approximately 2 business days to prepare and deliver.

Table of Contents

197 Pages
*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Automotive Semiconductor Packaging Market Size by Player
4 Automotive Semiconductor Packaging by Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Global Automotive Semiconductor Packaging Market Forecast
11 Key Players Analysis
12 Research Findings and Conclusion

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