Global Air-cooled Computing Equipment Heat Dissipation Module Market Growth 2025-2031

The global Air-cooled Computing Equipment Heat Dissipation Module market size is predicted to grow from US$ 3157 million in 2025 to US$ 5760 million in 2031; it is expected to grow at a CAGR of 10.5% from 2025 to 2031.

Air-cooled Computing Equipment Heat Dissipation Module is a specialized heat dissipation solution designed for computing power equipment. In the current technological field, computing power equipment such as servers and mining machines generate a large amount of heat during operation. If the heat is not dissipated in time, it will seriously affect the performance and service life of the equipment. This heat dissipation module uses air as the heat dissipation medium and mainly consists of heat dissipation fins, fans, and relevant air duct structures. The heat dissipation fins have a large surface area and can quickly absorb and conduct the heat generated by the computing power equipment. The fans accelerate the air flow, allowing the air to continuously take away the heat from the heat dissipation fins. The air duct structure reasonably plans the air flow path to ensure an efficient and orderly heat dissipation process. The air - cooled heat dissipation module has the advantages of low cost and easy installation and maintenance, and can effectively control the temperature of the computing power equipment within a reasonable range to ensure the stable operation of the equipment.

United States market for Air-cooled Computing Equipment Heat Dissipation Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Air-cooled Computing Equipment Heat Dissipation Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Air-cooled Computing Equipment Heat Dissipation Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Air-cooled Computing Equipment Heat Dissipation Module players cover NIDEC CORPORATION, Jones Technology, SHENZHEN FRD SCIENCE& TECHNOLOGY, Suzhou Tianmai Thermal Technology, HYMN Advanced Material Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Air-cooled Computing Equipment Heat Dissipation Module Industry Forecast” looks at past sales and reviews total world Air-cooled Computing Equipment Heat Dissipation Module sales in 2024, providing a comprehensive analysis by region and market sector of projected Air-cooled Computing Equipment Heat Dissipation Module sales for 2025 through 2031. With Air-cooled Computing Equipment Heat Dissipation Module sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Air-cooled Computing Equipment Heat Dissipation Module industry.

This Insight Report provides a comprehensive analysis of the global Air-cooled Computing Equipment Heat Dissipation Module landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Air-cooled Computing Equipment Heat Dissipation Module portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Air-cooled Computing Equipment Heat Dissipation Module market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Air-cooled Computing Equipment Heat Dissipation Module and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Air-cooled Computing Equipment Heat Dissipation Module.

This report presents a comprehensive overview, market shares, and growth opportunities of Air-cooled Computing Equipment Heat Dissipation Module market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Single-fan Cooling
Multi-fan Cooling

Segmentation by Application:
Consumer Electronics
Electric Vehicles
Energy Storage Systems
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
NIDEC CORPORATION
Jones Technology
SHENZHEN FRD SCIENCE& TECHNOLOGY
Suzhou Tianmai Thermal Technology
HYMN Advanced Material Technology
AURAS Technology
Forcecon Technology
Suzhou Yongteng Electronic Product
NTK HOLDINGS LIMITED
Shenzhen Weibochi Thermal Technology
Jentech Precision Industrial
LINGYI iTECH (GUANGDONG) COMPANY
Jiangsu Gian Technology
Taisol Electronics
ZheJiang RIFA Precision Machinery

Key Questions Addressed in this Report

What is the 10-year outlook for the global Air-cooled Computing Equipment Heat Dissipation Module market?

What factors are driving Air-cooled Computing Equipment Heat Dissipation Module market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Air-cooled Computing Equipment Heat Dissipation Module market opportunities vary by end market size?

How does Air-cooled Computing Equipment Heat Dissipation Module break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.