North America Advanced Packaging Market By Type (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2),5D/3D and others), By End User (Consumer Electronics, Automotive, Industrial, Aerospace & Defense, Healthcare & Life Sciences and Others), By Co

North America Advanced Packaging Market By Type (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2),5D/3D and others), By End User (Consumer Electronics, Automotive, Industrial, Aerospace & Defense, Healthcare & Life Sciences and Others), By Country, Industry Analysis and Forecast, 2020 - 2026

The North America Advanced Packaging Market would witness market growth of 11.6% CAGR during the forecast period (2020-2026).

Manufacturing processes rely on the specifications that consumers will satisfy in order tguarantee the functionality of the finished product. Integrated circuits are designed thave all the electrical functions necessary and tfit inta particular range of packages. The bond pads on the chip are connected by wire bonding tthe pins of the conventional package. Design rules for standard packages require bond pads tbe located on the perimeter of the chip. In order tprevent twdesigns for the same chip, a redistribution layer is usually required tconnect bumps tbond pads.

The dual in-line package is an electronic component package with a rectangular housing and twparallel rows of electrical connectors. The package may be placed through a hole on a printed circuit board (PCB). More and more complex circuits required more signal and power supply lines. Eventually, microprocessors and related complex devices needed more leads than could be mounted on a DIP box, leading tthe development of higher-density chip carriers. In addition, square and rectangular packages alsmade it easier for the printed-circuit traces tbe routed under packages.

Semiconductor packaging technology has advanced significantly and several thousand different types of semiconductor packages have been manufactured. Industries such as aerospace, healthcare, data centers and many other sectors are projected tbe the main growth factors for the advanced semiconductor packaging industry in the coming years. In view of market apprehensions, several semiconductor companies around the world have developed different modes of operation tmeet the requirements of the industry.

Based on Type, the market is segmented intFlip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D and Others. Based on End User, the market is segmented intConsumer Electronics, Automotive, Industrial, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on countries, the market is segmented intU.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.

Scope of the Study

Market Segmentation:

By Type

• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D
• Others

By End User

• Consumer Electronics
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare & Life Sciences
• Others

By Country

• US
• Canada
• Mexic
• Rest of North America

Companies Profiled

• Qualcomm, Inc.
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd. (Samsung Group)
• Amkor Technology, Inc.
• Brewer Science, Inc.
• Microchip Technology, Inc.

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