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Global Wire Bonder Equipment Market 2024-2028

Publisher TechNavio
Published Aug 02, 2024
Length 167 Pages
SKU # INF19175717

Description

Global Wire Bonder Equipment Market 2024-2028


The wire bonder equipment market is forecasted to grow by USD 227.5 mn during 2023-2028, accelerating at a CAGR of 3.32% during the forecast period. The report on the wire bonder equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising electronics production across world, rising electronic content in automobiles, and increase in number of osat vendors.

Technavio's wire bonder equipment market is segmented as below:

By Product
  • Ball bonders
  • Stud-bump bonders
  • Wedge bonders
By End-user
  • OSAT
  • IDM
By Geographical Landscape
  • APAC
  • North America
  • Europe
  • South America
  • Middle East and Africa
This study identifies the technological advancements in wire bonding as one of the prime reasons driving the wire bonder equipment market growth during the next few years. Also, development of wire bonder equipment compliant with industry 4.0 and increasing popularity of flip-chip bonding technology will lead to sizable demand in the market.

The report on the wire bonder equipment market covers the following areas:
  • Wire bonder equipment market sizing
  • Wire bonder equipment market forecast
  • Wire bonder equipment market industry analysis
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading wire bonder equipment market vendors that include Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd.. Also, the wire bonder equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

167 Pages
    • Market overview
    • Market ecosystem
    • Market characteristics
    • Value chain analysis
    • Market definition
    • Market segment analysis
    • Market size 2023
    • Market outlook: Forecast for 2023-2028
    • Global Wire Bonder Equipment Market 2018 - 2022
    • Product segment analysis 2018 - 2022
    • End-user segment analysis 2018 - 2022
    • Geography segment analysis 2018 - 2022
    • Country segment analysis 2018 - 2022
    • Five forces summary
    • Bargaining power of buyers
    • Bargaining power of suppliers
    • Threat of new entrants
    • Threat of substitutes
    • Threat of rivalry
    • Market condition
    • Market segments
    • Comparison by Product
    • Ball bonders - Market size and forecast 2023-2028
    • Stud-bump bonders - Market size and forecast 2023-2028
    • Wedge bonders - Market size and forecast 2023-2028
    • Market opportunity by Product
    • Market segments
    • Comparison by End-user
    • OSAT - Market size and forecast 2023-2028
    • IDM - Market size and forecast 2023-2028
    • Market opportunity by End-user
    • Customer landscape overview
    • Geographic segmentation
    • Geographic comparison
    • APAC - Market size and forecast 2023-2028
    • North America - Market size and forecast 2023-2028
    • Europe - Market size and forecast 2023-2028
    • South America - Market size and forecast 2023-2028
    • Middle East and Africa - Market size and forecast 2023-2028
    • China - Market size and forecast 2023-2028
    • US - Market size and forecast 2023-2028
    • Japan - Market size and forecast 2023-2028
    • India - Market size and forecast 2023-2028
    • Germany - Market size and forecast 2023-2028
    • Market opportunity by geography
    • Market drivers
    • Market challenges
    • Impact of drivers and challenges
    • Market opportunities/restraints
    • Overview
    • Competitive Landscape
    • Landscape disruption
    • Industry risks
    • Companies profiled
    • Market positioning of companies
    • ASMPT Ltd.
    • BE Semiconductor Industries NV
    • Corintech Ltd.
    • DIAS Automation HK Ltd.
    • F and K DELVOTEC Bondtechnik GmbH
    • F and S BONDTEC Semiconductor GmbH
    • Hesse GmbH
    • HYBOND Inc.
    • Kulicke and Soffa Industries Inc.
    • Micro Point Pro Ltd.
    • Palomar Technologies Inc.
    • Toray Industries Inc.
    • TPT Wirebonder GmbH and Co. KG
    • WestBond Inc.
    • Yamaha Motor Co. Ltd.
    • Scope of the report
    • Inclusions and exclusions checklist
    • Currency conversion rates for US$
    • Research methodology
    • Data procurement
    • Data validation
    • Validation techniques employed for market sizing
    • Data synthesis
    • 360 degree market analysis
    • List of abbreviations

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