Global Semiconductor Advanced Packaging Market 2017-2021

Global Semiconductor Advanced Packaging Market 2017-2021

About Semiconductor Advanced Packaging

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device. Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.

Technavio’s analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Advanced Semiconductor Engineering (ASE)
  • Amkor Technology
  • Samsung Semiconductor (SAMSUNG)
  • TSMC (Taiwan Semiconductor Manufacturing Company)
Other prominent vendors
  • China Wafer Level CSP
  • ChipMOS TECHNOLOGIES
  • FlipChip International
  • HANA Micron
  • Interconnect Systems (Molex)
  • Jiangsu Changjiang Electronics Technology (JCET)
  • King Yuan Electronics
  • Tongfu Microelectronics
  • Nepes
  • Powertech Technology (PTI)
  • SIGNETICS
  • Tianshui Huatian
  • Ultratech
  • UTAC
Market driver
  • Complex semiconductor IC designs
  • For a full, detailed list, view our report
Market challenge
  • Rapid technological changes
  • For a full, detailed list, view our report
Market trend
  • Changes in wafer size
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Advanced Packaging Market 2017-2021

Technavio recognizes the following companies as the key players in the global semiconductor advanced packaging market: Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung Semiconductor (SAMSUNG), and TSMC (Taiwan Semiconductor Manufacturing Company).

Other Prominent Vendors in the market are: China Wafer Level CSP, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.

Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Changes in wafer size. The semiconductor industry has seen a drastic transition in wafer size over the last five decades (1910-2016). The industry is focusing on producing larger diameter wafers, which is expected to cut down the manufacturing cost by 20%-25%. As of 2016, the semiconductor industry is using 300-mm wafer, with foundries investing in developing more such fabs. For instance, SK Hynix is building an M14 fab for the 300-mm technology in South Korea.”

According to the report, one of the major drivers for this market is Complex semiconductor IC designs. The number of features and functionalities offered by consumer electronic devices is on the rise as electronic device manufacturers look to differentiate their offerings from those of competitors. Consequently, there has been increasing need for multifunctional ICs. Semiconductor device manufacturers have addressed this need by developing new and more complex architecture and designs for semiconductor ICs. An instance of this is the development of 3D ICs, which are compact, consume less power, and are highly efficient, but also have complex designs and elaborate manufacturing processes.

Further, the report states that one of the major factors hindering the growth of this market is Rapid technological changes. The rapid technological advancements in wafer processing have always been a major challenge faced by vendors in the semiconductor advanced packaging market. The semiconductor industry is continuously seeing transitions, such as the miniaturization of nodes and the increase in wafer sizes with respect to ultra-large-scale integration (ULSI) fabrication technology. This prompts semiconductor manufacturers to increase the development and adoption of new technologies, especially packaging solutions. Hence, to withstand the competition in the market, packaging vendors must develop new technologies that are in line with the changes in semiconductor IC architecture. As a result, manufacturers incur high costs on R&D.

Companies Mentioned

Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung Semiconductor (SAMSUNG), and TSMC (Taiwan Semiconductor Manufacturing Company).

Other Prominent Vendors in the market are: China Wafer Level CSP, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.

  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Market outline
    • Semiconductor value chain
      • Table Semiconductor value chain
      • Table Description of semiconductor value chain
  • Technology landscape
    • Back-end chip formation
      • Table Back-end chip formation steps
    • Wafer-level vs die-level packaging
    • Roadmap of semiconductor packaging industry
      • Table Roadmap of semiconductor packaging industry
      • Table Block diagram for SoC
      • Table Block diagram of SiP
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Ecosystem of semiconductor IC packaging industry
      • Table Old semiconductor IC packaging industry supply chain
      • Table New semiconductor IC packaging industry supply chain
  • Market landscape
    • Market overview
      • Table Overview of global semiconductor advanced packaging market 2016
    • Market size and forecast
      • Table Global semiconductor advanced packaging market 2016-2021 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Segmentation by packaging technology
    • Global semiconductor advanced packaging market by technology
      • Table Global semiconductor advanced packaging market by technology 2016-2021
      • Table Revenue trend-line for technologies in advanced semiconductor packaging 2016-2021 ($ billions)
    • Flip-chip packaging
      • Table Global semiconductor advanced packaging market in flip-chip packaging 2016-2021 ($ billions)
    • FI WLP
      • Table Global semiconductor advanced packaging market FI WLP 2016-2021 ($ billions)
    • 2.5D/3D packaging
      • Table Global semiconductor advanced packaging market in 2.5D/3D packaging 2016-2021 ($ billions)
    • FO WLP
      • Table Global semiconductor advanced packaging market for fan-out WLP 2016-2021 ($ billions)
  • Segmentation by device type
    • Global semiconductor advanced packaging market by device type
      • Table Global semiconductor advanced packaging market by device type 2016-2021
      • Table Revenue trend-line for global semiconductor advanced packaging market by device type 2016-2021 ($ billions)
    • Analog and mixed ICs
      • Table Global semiconductor advanced packaging market for analog and mixed ICs 2016-2021 ($ billions)
    • MEMS and sensors
      • Table Global semiconductor advanced packaging market for MEMS and sensors 2016-2021 ($ billions)
    • Logic and memory devices
      • Table Global semiconductor advanced packaging market for logic and memory devices 2016-2021 ($ billions)
    • Wireless connectivity devices
      • Table Global semiconductor advanced packaging market for wireless connectivity devices 2016-2021 ($ billions)
    • CMOS image sensors
      • Table Global semiconductor advanced packaging market for CMOS image sensors 2016-2021 ($ billions)
  • Geographical segmentation
    • Global semiconductor advanced packaging market by region
      • Table Global semiconductor advanced packaging market by region 2016-2021
      • Table Revenue trend-line for global semiconductor advanced packaging market by region 2016-2021 ($ billions)
    • APAC
      • Table Semiconductor advanced packaging market in APAC 2016-2021 ($ billions)
    • Americas
      • Table Semiconductor advanced packaging market in the Americas 2016-2021 ($ billions)
    • EMEA
      • Table Semiconductor advanced packaging market in EMEA 2016-2021 ($ billions)
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Global IoT market by devices 2016-2021 ($ billions)
      • Table Global wrist computer market 2016-2021 ($ millions)
      • Table Product segmentation of global rugged handheld devices market 2016-2021 ($ millions)
    • Market challenges
      • Table Global semiconductor market trend 1992-2016 ($ billions)
  • Market trends
    • Changes in wafer size
      • Table Timeline: Advances in semiconductor wafer size
    • Integration of semiconductor components in vehicles
      • Table Global car shipment 2016-2021 (million units)
    • Increase in number of M&A
    • Short product lifecycle of mobile devices
    • Increase in number of OSAT vendors
    • High need for semiconductor memory devices
      • Table CAGR of 3D NAND and DRAM during 2016-2021
    • Growing acceptance of wearable devices
      • Table Global wearable devices market 2016-2021 ($ billions)
  • Vendor landscape
    • Competitive scenario
    • Leading vendors
    • Other prominent vendors
      • Table Other vendors in global semiconductor advanced packaging market 2016
  • Appendix
    • List of abbreviations
  • Explore Technavio

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