Global Optical Patterned Wafer Inspection Equipment Market 2015-2019
Market outlook of the optical patterned wafer inspection equipment market
Optical patterned wafer inspection system is used to detect defects in patterned wafer during the wafer manufacturing process. This system consists of two technologies, such as bright-field inspection and dark-field inspection. The prevalent use of semiconductor wafer over a wide variety of industries, such as consumer electronics, automotive, and industrial segment is stimulating the global optical patterned wafer inspection equipment market, which has resulted in a projected CAGR of over 10% by 2019.
Following the advancements in consumer electronics sector, such as emergence of 3D LEDs and UHD TVs, and hybrid laptops, the demand for semiconductor ICs will increase steadily during the forecast period. As a result, the demand for semiconductor wafers will heighten, which in turn, will increase the semiconductor capital equipment spending and the demand for optical patterned wafer inspection equipment.
Geographical segmentation and analysis of - North America, Europe, and APAC
APAC was the largest revenue contributor to the optical patterned wafer inspection equipment market globally in 2014, with nearly 70 % market share, because of the existence of a majority of prominent semiconductor foundries such as Taiwan Semiconductor Manufacturing, United Microelectronics, and Semiconductor Manufacturing International.
The report offers an analysis of each of the following segments and discusses its impact on the overall market growth -
Technavio Announces the Publication of its Research Report – Global Optical Patterned Wafer Inspection Equipment Market 2015-2019
Technavio recognizes the following companies as the key players in the Global Optical Patterned Wafer Inspection Equipment Market: Applied Materials and KLA-Tencor
Other Prominent Vendors in the market are: ASML Holding, Hitachi High-Technologies, JEOL, Tokyo Seimitsu, and Toray Engineering.
Commenting on the report, an analyst from Technavio’s team said: “The semiconductor market has been witnessing rapid changes in technology, with the emergence of 3D NAND and FinFET technologies. However, due to a reduction in the size of ICs, the size of defects is also getting smaller, which is prompting inspection equipment vendors to put their focus area more into large investments in R&D with an aim to improving their existing technology for detecting such minute defects.”
According to the report, the increasing demand for semiconductor ICs in consumer electronics, automotive, and industrial products is driving the growth of wafer inspection equipment. Also, the growing need for compact ICs and short product replacement cycle of mobile devices are expected to increase the capital expenditure on fab equipment, which will create the demand for optical wafer inspection equipment during the forecast period.
Further, the report states that the market is facing a challenge due to the higher efficiency of e-beam wafer inspection equipment, which can even detect a defect of 3nm, which is not in the case for the optical patterned wafer inspection system.
Applied Materials, KLA-Tencor, ASML Holding, Hitachi High-Technologies, JEOL, Tokyo Seimitsu, Toray Engineering.
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