Global LED Encapsulation Market 2022-2026
Technavio has been monitoring the LED encapsulation market and it is poised to grow by $ 481.96 mn during 2022-2026 progressing at a CAGR of 4.3% during the forecast period. Our report on the LED encapsulation market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the growing demand for high power LED applications, growing automotive lighting needs, and rising demand for LED lights from industrial sector.
The LED encapsulation market analysis includes the type segment and geographic landscape.
Technavio's LED encapsulation market is segmented as below:
By Geographical Landscape
- North America
- South America
- Middle East and Africa
This study identifies the anticipated significant growth in silicone encapsulants as one of the prime reasons driving the LED encapsulation market growth during the next few years. Also, growing awareness regarding the implementation of energy-efficient lighting systems and government initiatives regarding retrofitting traditional lights will lead to sizable demand in the market.
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on LED encapsulation market covers the following areas:
- LED encapsulation market sizing
- LED encapsulation market forecast
- LED encapsulation market industry analysis
Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading LED encapsulation market vendors that include ams AG, Avantor Inc., CHT Group, DuPont de Nemours Inc., Epic Corp., Foshan NationStar Optoelectronics Co. Ltd., H.B. Fuller Co., Henkel AG and Co. KGaA, Hitachi Ltd., Intertronics Ltd., Kyocera Corp., Nitto Denko Corp., Panasonic Corp., Shin Etsu Chemical Co. Ltd., SolEpoxy Inc., The Dow Chemical Co., and Wacker Chemie AG. Also, the LED encapsulation market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.Companies Mentioned
A LIFT INDUSTRIAL LTD., AUSA CENTER SLU, CASE Construction, Crown Equipment Corp., Harlo Products Inc., Hyster Yale Materials Handling Inc., J C Bamford Excavators Ltd., Liftking Manufacturing Corp., Vmax International Group Shanghai Co. Ltd., Wolter Group LLC