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Next Generation Memory Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

Publisher IMARC Services Pvt. Ltd.
Published Jul 05, 2023
Length 145 Pages
SKU # IMRC18054595

Description

Next Generation Memory Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028


Market Overview:

The global next generation memory market size reached US$ 4.8 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 21.4 Billion by 2028, exhibiting a growth rate (CAGR) of 26.9% during 2023-2028.

Next generation memory refers to a fast, efficient and cost-effective storage solution that can store more data than silicon chips. It consequently finds extensive applications in the telecommunications, information technology (IT), and banking, financial services and insurance (BFSI) industries across the globe. At present, there is a surge in the requirement for high bandwidth, low power consumption, and highly scalable memory devices that rely on artificial intelligence (AI), the Internet of things (IoT), big data and other technologies. This, in turn, is catalyzing the demand for next generation memory.



Non-Volatile
Magneto-Resistive Random-Access Memory (MRAM)
Ferroelectric RAM (FRAM)
Resistive Random-Access Memory (ReRAM)
3D Xpoint
Nano RAM
Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
Volatile
Hybrid Memory Cube (HMC)
High-Bandwidth Memory (HBM)

Breakup by Wafer Size:

200 mm
300 mm
450 mm

Breakup by Storage Type:

Mass Storage
Embedded Storage
Others

Breakup by Application:

BFSI
Consumer Electronics
Government
Telecommunications
Information Technology
Others

Breakup by Region:


North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Avalanche Technology, Crossbar Inc., Fujitsu Limited, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Micron Technology Inc., Nantero Inc., Samsung Electronics Co. Ltd., SK hynix Inc., Spin Memory Inc. and Taiwan Semiconductor Manufacturing Co. Ltd.

Key Questions Answered in This Report:
How has the global next generation memory market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global next generation memory market?
What are the key regional markets?
What is the breakup of the market based on the technology?
What is the breakup of the market based on the wafer size?
What is the breakup of the market based on the storage type?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global next generation memory market and who are the key players?
What is the degree of competition in the industry?

Table of Contents

145 Pages
1 Preface
2 Scope and Methodology
2.1Objectives of the Study
2.2Stakeholders
2.3Data Sources
2.3.1Primary Sources
2.3.2Secondary Sources
2.4Market Estimation
2.4.1Bottom-Up Approach
2.4.2Top-Down Approach
2.5Forecasting Methodology
3Executive Summary
4Introduction
4.1Overview
4.2Key Industry Trends
5Global Next Generation Memory Market
5.1Market Overview
5.2Market Performance
5.3Impact of COVID-19
5.4Market Forecast
6Market Breakup by Technology
6.1Non-Volatile
6.1.1 Market Trends
6.1.2 Key Segments
6.1.2.1 Magneto-Resistive Random-Access Memory (MRAM)
6.1.2.2 Ferroelectric RAM (FRAM)
6.1.2.3 Resistive Random-Access Memory (ReRAM)
6.1.2.4 3D Xpoint
6.1.2.5 Nano RAM
6.1.2.6 Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
6.1.3 Market Forecast
6.2Volatile
6.2.1 Market Trends
6.2.2 Key Segments
6.2.2.1 Hybrid Memory Cube (HMC)
6.2.2.2 High-Bandwidth Memory (HBM)
6.2.3 Market Forecast
7Market Breakup by Wafer Size
7.1200 mm
7.1.1 Market Trends
7.1.2 Market Forecast
7.2300 mm
7.2.1 Market Trends
7.2.2 Market Forecast
7.3450 mm
7.3.1 Market Trends
7.3.2 Market Forecast
8Market Breakup by Storage Type
8.1Mass Storage
8.1.1 Market Trends
8.1.2 Market Forecast
8.2Embedded Storage
8.2.1 Market Trends
8.2.2 Market Forecast
8.3Others
8.3.1 Market Trends
8.3.2 Market Forecast
9Market Breakup by Application
9.1BFSI
9.1.1 Market Trends
9.1.2 Market Forecast
9.2Consumer Electronics
9.2.1 Market Trends
9.2.2 Market Forecast
9.3Government
9.3.1 Market Trends
9.3.2 Market Forecast
9.4Telecommunications
9.4.1 Market Trends
9.4.2 Market Forecast
9.5Information Technology
9.5.1 Market Trends
9.5.2 Market Forecast
9.6Others
9.6.1 Market Trends
9.6.2 Market Forecast
10Market Breakup by Region
10.1North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11SWOT Analysis
11.1Overview
11.2Strengths
11.3Weaknesses
11.4Opportunities
11.5Threats
12Value Chain Analysis
13Porters Five Forces Analysis
13.1Overview
13.2Bargaining Power of Buyers
13.3Bargaining Power of Suppliers
13.4Degree of Competition
13.5Threat of New Entrants
13.6Threat of Substitutes
14Price Analysis
15Competitive Landscape
15.1Market Structure
15.2Key Players
15.3Profiles of Key Players
15.3.1Avalanche Technology
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.2Crossbar Inc.
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.3Fujitsu Limited
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.3.3 Financials
15.3.3.4 SWOT Analysis
15.3.4Honeywell International Inc.
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5Infineon Technologies AG
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.5.4 SWOT Analysis
15.3.6Intel Corporation
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7Micron Technology Inc.
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.7.3 Financials
15.3.7.4 SWOT Analysis
15.3.8Nantero Inc.
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.9Samsung Electronics Co. Ltd.
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.9.3 Financials
15.3.10SK hynix Inc.
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.10.3 Financials
15.3.10.4 SWOT Analysis
15.3.11Spin Memory Inc.
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.12Taiwan Semiconductor Manufacturing Co. Ltd.
15.3.12.1 Company Overview
15.3.12.2 Product Portfolio
15.3.12.3 Financials
15.3.12.4 SWOT Analysis

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