
Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
Description
Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
The global advanced packaging market size reached US$ 37.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 74.7 Billion by 2028, exhibiting a growth rate (CAGR) of 11.2% during 2023-2028.
Advanced packaging is the interconnection and aggregation of components that encloses metallic parts and various devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It encompasses 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of different techniques. These packaging methods are implemented after determining multiple parameters, such as power consumption, operating conditions, measurable size, and costs. Advanced packaging increases the functionality of various electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, it is extensively used in various electronic gadgets and devices.
Advanced Packaging Market Trends:
The global advanced packaging market is primarily driven by the rapid expansion in the electronics sector, along with the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, and miniaturized devices. In line with this, manufacturers are extensively utilizing advanced packaging to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in the semiconductor, which is acting as another growth-inducing factor. Furthermore, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices has encouraged leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is contributing to the market growth. Additionally, the inclination toward fan-out wafer-level packaging, owing to its several benefits, including superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is impelling the market growth. Apart from this, strategic collaborations amongst key players to enhance product efficacy and the large-scale usage of artificial intelligence (AI), deep learning, and machine learning (ML) to combine processing elements and memories through high-speed interconnect are supporting the market growth.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type and end use.
Breakup by Type:
Flip-Chip Ball Grid Array
Flip Chip CSP
Wafer Level CSP
5D/3D
Fan Out WLP
Others
Breakup by End Use:
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace and Defense
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).
Key Questions Answered in This Report
1. What was the size of the global advanced packaging market in 2022?
2. What is the expected growth rate of the global advanced packaging market during 2023-2028?
3. What has been the impact of COVID-19 on the global advanced packaging market?
4. What are the key factors driving the global advanced packaging market?
5. What is the breakup of the global advanced packaging market based on the type?
6. What is the breakup of the global advanced packaging market based on the end use?
7. What are the key regions in the global advanced packaging market?
8. Who are the key players/companies in the global advanced packaging market?
The global advanced packaging market size reached US$ 37.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 74.7 Billion by 2028, exhibiting a growth rate (CAGR) of 11.2% during 2023-2028.
Advanced packaging is the interconnection and aggregation of components that encloses metallic parts and various devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It encompasses 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of different techniques. These packaging methods are implemented after determining multiple parameters, such as power consumption, operating conditions, measurable size, and costs. Advanced packaging increases the functionality of various electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, it is extensively used in various electronic gadgets and devices.
Advanced Packaging Market Trends:
The global advanced packaging market is primarily driven by the rapid expansion in the electronics sector, along with the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, and miniaturized devices. In line with this, manufacturers are extensively utilizing advanced packaging to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in the semiconductor, which is acting as another growth-inducing factor. Furthermore, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices has encouraged leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is contributing to the market growth. Additionally, the inclination toward fan-out wafer-level packaging, owing to its several benefits, including superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is impelling the market growth. Apart from this, strategic collaborations amongst key players to enhance product efficacy and the large-scale usage of artificial intelligence (AI), deep learning, and machine learning (ML) to combine processing elements and memories through high-speed interconnect are supporting the market growth.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type and end use.
Breakup by Type:
Flip-Chip Ball Grid Array
Flip Chip CSP
Wafer Level CSP
5D/3D
Fan Out WLP
Others
Breakup by End Use:
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace and Defense
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).
Key Questions Answered in This Report
1. What was the size of the global advanced packaging market in 2022?
2. What is the expected growth rate of the global advanced packaging market during 2023-2028?
3. What has been the impact of COVID-19 on the global advanced packaging market?
4. What are the key factors driving the global advanced packaging market?
5. What is the breakup of the global advanced packaging market based on the type?
6. What is the breakup of the global advanced packaging market based on the end use?
7. What are the key regions in the global advanced packaging market?
8. Who are the key players/companies in the global advanced packaging market?
Table of Contents
142 Pages
- 1 Preface
- 2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
- 3 Executive Summary
- 4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
- 5 Global Advanced Packaging Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
- 6 Market Breakup by Type
- 6.1 Flip-Chip Ball Grid Array
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 Flip Chip CSP
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 Wafer Level CSP
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
- 6.4 5D/3D
- 6.4.1 Market Trends
- 6.4.2 Market Forecast
- 6.5 Fan Out WLP
- 6.5.1 Market Trends
- 6.5.2 Market Forecast
- 6.6 Others
- 6.6.1 Market Trends
- 6.6.2 Market Forecast
- 7 Market Breakup by End Use
- 7.1 Consumer Electronics
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Automotive
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 Industrial
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Healthcare
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
- 7.5 Aerospace and Defense
- 7.5.1 Market Trends
- 7.5.2 Market Forecast
- 7.6 Others
- 7.6.1 Market Trends
- 7.6.2 Market Forecast
- 8 Market Breakup by Region
- 8.1 North America
- 8.1.1 United States
- 8.1.1.1 Market Trends
- 8.1.1.2 Market Forecast
- 8.1.2 Canada
- 8.1.2.1 Market Trends
- 8.1.2.2 Market Forecast
- 8.2 Asia-Pacific
- 8.2.1 China
- 8.2.1.1 Market Trends
- 8.2.1.2 Market Forecast
- 8.2.2 Japan
- 8.2.2.1 Market Trends
- 8.2.2.2 Market Forecast
- 8.2.3 India
- 8.2.3.1 Market Trends
- 8.2.3.2 Market Forecast
- 8.2.4 South Korea
- 8.2.4.1 Market Trends
- 8.2.4.2 Market Forecast
- 8.2.5 Australia
- 8.2.5.1 Market Trends
- 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
- 8.2.6.1 Market Trends
- 8.2.6.2 Market Forecast
- 8.2.7 Others
- 8.2.7.1 Market Trends
- 8.2.7.2 Market Forecast
- 8.3 Europe
- 8.3.1 Germany
- 8.3.1.1 Market Trends
- 8.3.1.2 Market Forecast
- 8.3.2 France
- 8.3.2.1 Market Trends
- 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
- 8.3.3.1 Market Trends
- 8.3.3.2 Market Forecast
- 8.3.4 Italy
- 8.3.4.1 Market Trends
- 8.3.4.2 Market Forecast
- 8.3.5 Spain
- 8.3.5.1 Market Trends
- 8.3.5.2 Market Forecast
- 8.3.6 Russia
- 8.3.6.1 Market Trends
- 8.3.6.2 Market Forecast
- 8.3.7 Others
- 8.3.7.1 Market Trends
- 8.3.7.2 Market Forecast
- 8.4 Latin America
- 8.4.1 Brazil
- 8.4.1.1 Market Trends
- 8.4.1.2 Market Forecast
- 8.4.2 Mexico
- 8.4.2.1 Market Trends
- 8.4.2.2 Market Forecast
- 8.4.3 Others
- 8.4.3.1 Market Trends
- 8.4.3.2 Market Forecast
- 8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast
- 9 SWOT Analysis
- 9.1 Overview
- 9.2 Strengths
- 9.3 Weaknesses
- 9.4 Opportunities
- 9.5 Threats
- 10 Value Chain Analysis
- 11 Porters Five Forces Analysis
- 11.1 Overview
- 11.2 Bargaining Power of Buyers
- 11.3 Bargaining Power of Suppliers
- 11.4 Degree of Competition
- 11.5 Threat of New Entrants
- 11.6 Threat of Substitutes
- 12 Price Analysis
- 13 Competitive Landscape
- 13.1 Market Structure
- 13.2 Key Players
- 13.3 Profiles of Key Players
- 13.3.1 Advanced Semiconductor Engineering Inc.
- 13.3.1.1 Company Overview
- 13.3.1.2 Product Portfolio
- 13.3.2 Amkor Technology Inc.
- 13.3.2.1 Company Overview
- 13.3.2.2 Product Portfolio
- 13.3.2.3 Financials
- 13.3.2.4 SWOT Analysis
- 13.3.3 Analog Devices Inc.
- 13.3.3.1 Company Overview
- 13.3.3.2 Product Portfolio
- 13.3.3.3 Financials
- 13.3.3.4 SWOT Analysis
- 13.3.4 Brewer Science
- 13.3.4.1 Company Overview
- 13.3.4.2 Product Portfolio
- 13.3.5 ChipMOS Technologies Inc.
- 13.3.5.1 Company Overview
- 13.3.5.2 Product Portfolio
- 13.3.5.3 Financials
- 13.3.6 Microchip Technology Inc.
- 13.3.6.1 Company Overview
- 13.3.6.2 Product Portfolio
- 13.3.6.3 Financials
- 13.3.6.4 SWOT Analysis
- 13.3.7 Powertech Technology Inc.
- 13.3.7.1 Company Overview
- 13.3.7.2 Product Portfolio
- 13.3.7.3 Financials
- 13.3.7.4 SWOT Analysis
- 13.3.8 Samsung Electronics Co. Ltd
- 13.3.8.1 Company Overview
- 13.3.8.2 Product Portfolio
- 13.3.8.3 Financials
- 13.3.8.4 SWOT Analysis
- 13.3.9 SÜSS MicroTec SE
- 13.3.9.1 Company Overview
- 13.3.9.2 Product Portfolio
- 13.3.9.3 Financials
- 13.3.10 Taiwan Semiconductor Manufacturing Company Limited
- 13.3.10.1 Company Overview
- 13.3.10.2 Product Portfolio
- 13.3.10.3 Financials
- 13.3.10.4 SWOT Analysis
- 13.3.11 Texas Instruments Incorporated
- 13.3.11.1 Company Overview
- 13.3.11.2 Product Portfolio
- 13.3.11.3 Financials
- 13.3.11.4 SWOT Analysis
- 13.3.12 Universal Instruments Corporation (CBA Group Inc.)
- 13.3.12.1 Company Overview
- 13.3.12.2 Product Portfolio
Pricing
Currency Rates
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