LCP Based Molded Interconnect Devices Market Size, Share & Trends Analysis Report By Process (LDS, Two-Shot Molding), By Product, By End Use, By Region, And Segment Forecasts, 2025 - 2030

LCP Based Molded Interconnect Devices Market Summary

The global LCP based molded interconnect devices market size was estimated at USD 737.5 million in 2024 and is projected to reach USD 1,897.2 million by 2030, growing at a CAGR of 17.5% from 2025 to 2030. The LCP based molded interconnect devices market is growing rapidly, as this technology enables manufacturers to achieve significant space and weight reductions by implanting electrical circuitry directly onto 3D molded plastic parts.

LCP resin offers exceptional thermal stability, chemical resistance, and dimensional stability, making it a preferred material for MID manufacturing in demanding applications. The market is increasingly in demand as it benefits from innovative processing techniques beyond traditional methods. Two-component injection molding and hot stamping are alternative methods utilized for producing MIDs, facilitating multifunctional parts with enhanced circuit integration on complex geometries. LCP’s inherent properties, such as low linear expansion and superior heat resistance, allow successful metallization through laser activation without compromising dimensional stability.

The rising necessity for miniaturized, lightweight electronic components across industries such as automotive, telecommunications, consumer electronics, and medical devices has driven the adoption of MID technology. Advanced manufacturing techniques such as laser direct structuring (LDS) allow precise circuit patterning on complex 3D surfaces, enabling design flexibility and reduced assembly complexity. These construction methods reduce the number of components and interconnections, thus improving product reliability and performance in various end-use applications.

Furthermore, LDS process, most applied in LCP MID production, activates additive compounds within the resin for electro less copper deposition, achieving fine conductive traces with sharp contours. This precision enables three-dimensional circuit layouts on free-form surfaces, reducing constraints on component design and assembly. The ability to create vertical through-holes and adapted surface finishes supports diverse applications requiring high-density circuitry embedded within molded parts. These methods contribute to lower assembly times and fewer interconnections, enhancing system performance while enabling manufacturability of small and complex components.

Global LCP Based Molded Interconnect Devices Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2018 to 2030. For this study, Grand View Research has segmented the global LCP based molded interconnect devices market report based on process, product, end use, and region:

• Process Outlook (Revenue, USD Million, 2018 - 2030)
• Laser Direct Structuring (LDS)
• Two-Shot Molding
• Others
• Product Outlook (Revenue, USD Million, 2018 - 2030)
• Sensor Housings
• Antennas
• Connectors & Interconnects
• Others
• End Use Outlook (Revenue, USD Million, 2018 - 2030)
• Healthcare
• Automotive
• Consumer Electronics
• Telecommunication
• Aerospace and Defense
• Others
• Regional Outlook (Revenue, USD Million, 2018 - 2030)
• North America
• U.S.
• Canada
• Mexico
• Europe
• UK
• Germany
• France
• Asia Pacific
• China
• Japan
• India
• South Korea
• Australia
• Latin America
• Brazil
• Middle East and Africa (MEA)
• KSA
• UAE
• South Africa

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