Global Epoxy Resin for Semiconductor Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Epoxy Resin for Semiconductor Packaging market size was valued at US$ 1666 million in 2024 and is forecast to a readjusted size of USD 2103 million by 2031 with a CAGR of 3.4% during review period.

Epoxy resin compounds for encapsulation of semiconductor devices are used to protect the semiconductor devices from mechanical force, humid, heat and ultraviolet rays et al. As semiconductor packages are getting more sophisticated, smaller, and high density, they are required to offer improved performance and functionality. Recently, with the increasing global environmental awareness, the requirements for epoxy resin compounds for encapsulation of semiconductor devices have become environment responsive and energy saving.

This report is a detailed and comprehensive analysis for global Epoxy Resin for Semiconductor Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Epoxy Resin for Semiconductor Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031

Global Epoxy Resin for Semiconductor Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031

Global Epoxy Resin for Semiconductor Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031

Global Epoxy Resin for Semiconductor Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Epoxy Resin for Semiconductor Packaging

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Epoxy Resin for Semiconductor Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Osaka Soda, Hexion, Epoxy Base Electronic, Huntsman, Aditya Birla Chemicals, DIC, Olin Corporation, Chang Chun Plastics, SHIN-A T&C, Kukdo Chemical, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Epoxy Resin for Semiconductor Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Bisphenol A Epoxy Resin
Bisphenol F Epoxy Resin
Others

Market segment by Application
Liquid Molding Compound
Capillary Under Fill
Non-Conductive Paste

Major players covered
Osaka Soda
Hexion
Epoxy Base Electronic
Huntsman
Aditya Birla Chemicals
DIC
Olin Corporation
Chang Chun Plastics
SHIN-A T&C
Kukdo Chemical
Nan Ya Plastics
Nagase ChemteX

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Epoxy Resin for Semiconductor Packaging product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Epoxy Resin for Semiconductor Packaging, with price, sales quantity, revenue, and global market share of Epoxy Resin for Semiconductor Packaging from 2020 to 2025.

Chapter 3, the Epoxy Resin for Semiconductor Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Epoxy Resin for Semiconductor Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Epoxy Resin for Semiconductor Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Epoxy Resin for Semiconductor Packaging.

Chapter 14 and 15, to describe Epoxy Resin for Semiconductor Packaging sales channel, distributors, customers, research findings and conclusion.