Global Copper Product for Semiconductor Package Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Copper Product for Semiconductor Package market size was valued at US$ 3594 million in 2024 and is forecast to a readjusted size of USD 5452 million by 2031 with a CAGR of 6.3% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
The copper materials used in semiconductor packaging primarily include lead frame copper strips, bonding copper wires, high-purity copper, and copper alloy strips.
Lead frame copper strips (e.g., C19400, C70250) serve as core packaging materials, providing structural support for chips and enabling electrical connections. Their high electrical conductivity (≥58 MS/m) and corrosion resistance ensure stable signal transmission, making them widely used in medium- and low-power devices.
Bonding copper wires, acting as interconnects between chips and substrates, have diameters as fine as 15–50 micrometers. Through microalloying (e.g., Cu-Ag), their tensile strength is enhanced to ≥400 MPa, meeting the demands of high-density packaging.
High-purity copper (≥6N) is utilized in copper sputtering targets and backplates. Via physical vapor deposition (PVD), it forms uniform conductive layers that support interconnect structures in advanced packaging. Its low resistivity (<0.017 μΩ·cm) minimizes signal delay.
Copper alloy strips (e.g., Cu-Fe-P, Cu-Ni-Si) combine high conductivity with mechanical strength, making them ideal for power device packaging substrates. Their high-temperature resistance (>200°C) and thermal expansion coefficients matching those of chip materials reduce the risk of thermal stress-induced failures.
According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).
Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.
This report is a detailed and comprehensive analysis for global Copper Product for Semiconductor Package market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Copper Product for Semiconductor Package market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Product for Semiconductor Package market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Product for Semiconductor Package market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Product for Semiconductor Package market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Copper Product for Semiconductor Package
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Copper Product for Semiconductor Package market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Materials, Proterial Metals, Furukawa Electric, Kobe Steel, JX Advanced Metals Corporation, KME, Wieland, Aurubis, Sundwiger Messingwerk, Honeywell, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Copper Product for Semiconductor Package market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Copper Strips for Semiconductor
Others
Market segment by Application
Leadframe
Heat Spreader
Heat Sinks
Copper and Copper Alloy Bonding Wires
Ceramic Substrates
Semiconductor Test Probes
Others
Major players covered
Mitsubishi Materials
Proterial Metals
Furukawa Electric
Kobe Steel
JX Advanced Metals Corporation
KME
Wieland
Aurubis
Sundwiger Messingwerk
Honeywell
Poongsan
Korea Trading & Industries Corporation
EUNSUNG CO.,LTD
Haegang AP Co., Ltd
DOWA METALTECH
Sumitomo Metal Mining Co., Ltd.
YAMAKIN (JAPAN) CO.,LTD.
Harada Metal Industry
Ningbo Jintian Copper
Ningbo Boway Alloy Material
Jinchuan Group
GUOXI ULTRAPURE
GRIKIN Advanced Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Product for Semiconductor Package product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper Product for Semiconductor Package, with price, sales quantity, revenue, and global market share of Copper Product for Semiconductor Package from 2020 to 2025.
Chapter 3, the Copper Product for Semiconductor Package competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Product for Semiconductor Package breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper Product for Semiconductor Package market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Product for Semiconductor Package.
Chapter 14 and 15, to describe Copper Product for Semiconductor Package sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
The copper materials used in semiconductor packaging primarily include lead frame copper strips, bonding copper wires, high-purity copper, and copper alloy strips.
Lead frame copper strips (e.g., C19400, C70250) serve as core packaging materials, providing structural support for chips and enabling electrical connections. Their high electrical conductivity (≥58 MS/m) and corrosion resistance ensure stable signal transmission, making them widely used in medium- and low-power devices.
Bonding copper wires, acting as interconnects between chips and substrates, have diameters as fine as 15–50 micrometers. Through microalloying (e.g., Cu-Ag), their tensile strength is enhanced to ≥400 MPa, meeting the demands of high-density packaging.
High-purity copper (≥6N) is utilized in copper sputtering targets and backplates. Via physical vapor deposition (PVD), it forms uniform conductive layers that support interconnect structures in advanced packaging. Its low resistivity (<0.017 μΩ·cm) minimizes signal delay.
Copper alloy strips (e.g., Cu-Fe-P, Cu-Ni-Si) combine high conductivity with mechanical strength, making them ideal for power device packaging substrates. Their high-temperature resistance (>200°C) and thermal expansion coefficients matching those of chip materials reduce the risk of thermal stress-induced failures.
According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).
Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.
This report is a detailed and comprehensive analysis for global Copper Product for Semiconductor Package market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Copper Product for Semiconductor Package market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Product for Semiconductor Package market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Product for Semiconductor Package market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Product for Semiconductor Package market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Copper Product for Semiconductor Package
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Copper Product for Semiconductor Package market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Materials, Proterial Metals, Furukawa Electric, Kobe Steel, JX Advanced Metals Corporation, KME, Wieland, Aurubis, Sundwiger Messingwerk, Honeywell, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Copper Product for Semiconductor Package market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Copper Strips for Semiconductor
Others
Market segment by Application
Leadframe
Heat Spreader
Heat Sinks
Copper and Copper Alloy Bonding Wires
Ceramic Substrates
Semiconductor Test Probes
Others
Major players covered
Mitsubishi Materials
Proterial Metals
Furukawa Electric
Kobe Steel
JX Advanced Metals Corporation
KME
Wieland
Aurubis
Sundwiger Messingwerk
Honeywell
Poongsan
Korea Trading & Industries Corporation
EUNSUNG CO.,LTD
Haegang AP Co., Ltd
DOWA METALTECH
Sumitomo Metal Mining Co., Ltd.
YAMAKIN (JAPAN) CO.,LTD.
Harada Metal Industry
Ningbo Jintian Copper
Ningbo Boway Alloy Material
Jinchuan Group
GUOXI ULTRAPURE
GRIKIN Advanced Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Product for Semiconductor Package product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper Product for Semiconductor Package, with price, sales quantity, revenue, and global market share of Copper Product for Semiconductor Package from 2020 to 2025.
Chapter 3, the Copper Product for Semiconductor Package competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Product for Semiconductor Package breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper Product for Semiconductor Package market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Product for Semiconductor Package.
Chapter 14 and 15, to describe Copper Product for Semiconductor Package sales channel, distributors, customers, research findings and conclusion.
Table of Contents
162 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Copper Product for Semiconductor Package by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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