Global Automotive Grade Power Semiconductor Module Cooling Substrate Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Automotive Grade Power Semiconductor Module Cooling Substrate market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.

The temperature of power modules changes rapidly and is often in an "extremely hot" or "extremely cold" state. The temperature tolerance range of consumer-grade semiconductors is generally -20°C to 70°C, while automotive-grade semiconductors generally require a temperature tolerance range of -40°C. —125℃. The heat dissipation substrate needs to meet the needs of automotive grade usage scenarios in terms of thermal conductivity, thermal expansion coefficient, hardness, durability, volume, cost and many other aspects.

Multiple factors such as the continued rapid growth of new energy passenger vehicles, the acceleration of the new energy conversion of commercial vehicles, and the full start of the electrification wave of transportation vehicles have brought important opportunities to the long-term development of the automotive grade power module cooling substrate industry, and the industry has huge room for development.

This report is a detailed and comprehensive analysis for global Automotive Grade Power Semiconductor Module Cooling Substrate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Automotive Grade Power Semiconductor Module Cooling Substrate market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Automotive Grade Power Semiconductor Module Cooling Substrate market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Automotive Grade Power Semiconductor Module Cooling Substrate market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Automotive Grade Power Semiconductor Module Cooling Substrate market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Automotive Grade Power Semiconductor Module Cooling Substrate

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Automotive Grade Power Semiconductor Module Cooling Substrate market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Dana Limited, Jentech Precision Industrial Co.,LTD., Huangshangujie Co., Ltd., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Automotive Grade Power Semiconductor Module Cooling Substrate market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Needle Type
Flat Type

Market segment by Application
Passenger Car
Commercial Vehicle

Major players covered
Dana Limited
Jentech Precision Industrial Co.,LTD.
Huangshangujie Co., Ltd.

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Automotive Grade Power Semiconductor Module Cooling Substrate product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Automotive Grade Power Semiconductor Module Cooling Substrate, with price, sales quantity, revenue, and global market share of Automotive Grade Power Semiconductor Module Cooling Substrate from 2020 to 2025.

Chapter 3, the Automotive Grade Power Semiconductor Module Cooling Substrate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Automotive Grade Power Semiconductor Module Cooling Substrate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Automotive Grade Power Semiconductor Module Cooling Substrate market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Automotive Grade Power Semiconductor Module Cooling Substrate.

Chapter 14 and 15, to describe Automotive Grade Power Semiconductor Module Cooling Substrate sales channel, distributors, customers, research findings and conclusion.