Global Advanced Electronic Packaging Materials Market 2025 by Company, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Advanced Electronic Packaging Materials market size was valued at US$ 11550 million in 2024 and is forecast to a readjusted size of USD 17020 million by 2031 with a CAGR of 5.8% during review period.
Advanced Electronic Packaging Materials include electronic packaging and electronic assembly materials. The main types of materials are: potting, encapsulation and plastic packaging materials, ceramics and glass, soldering materials, electroplating and deposition of metal coatings, bonding materials, printed circuit board materials , packaging substrates, adhesives for electronic packaging and assembly, lower fillers and coatings, and thermal management materials, etc. The report mainly studies electronic-grade adhesives and functional film materials.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report is a detailed and comprehensive analysis for global Advanced Electronic Packaging Materials market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Advanced Electronic Packaging Materials market size and forecasts, in consumption value ($ Million), 2020-2031
Global Advanced Electronic Packaging Materials market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Advanced Electronic Packaging Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Advanced Electronic Packaging Materials market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Advanced Electronic Packaging Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Advanced Electronic Packaging Materials market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Panasonic, Henkel, Shin-Etsu MicroSi, Lord, Nitto, Sumitomo Bakelite, Darbond Technology, Huitian New Material, Crystal Clear Electronic Material, Cybrid Technologies, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Advanced Electronic Packaging Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Electronic Grade Adhesives
Functional Film Material
Market segment by Application
Integrated Circuit Packaging
Smart Terminal Packaging
Power Battery
Photovoltaic Cell Packaging
Market segment by players, this report covers
Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Nitto
Sumitomo Bakelite
Darbond Technology
Huitian New Material
Crystal Clear Electronic Material
Cybrid Technologies
Suzhou Shihua Technology
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Advanced Electronic Packaging Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Advanced Electronic Packaging Materials, with revenue, gross margin, and global market share of Advanced Electronic Packaging Materials from 2020 to 2025.
Chapter 3, the Advanced Electronic Packaging Materials competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Advanced Electronic Packaging Materials market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Advanced Electronic Packaging Materials.
Chapter 13, to describe Advanced Electronic Packaging Materials research findings and conclusion.
Advanced Electronic Packaging Materials include electronic packaging and electronic assembly materials. The main types of materials are: potting, encapsulation and plastic packaging materials, ceramics and glass, soldering materials, electroplating and deposition of metal coatings, bonding materials, printed circuit board materials , packaging substrates, adhesives for electronic packaging and assembly, lower fillers and coatings, and thermal management materials, etc. The report mainly studies electronic-grade adhesives and functional film materials.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report is a detailed and comprehensive analysis for global Advanced Electronic Packaging Materials market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Advanced Electronic Packaging Materials market size and forecasts, in consumption value ($ Million), 2020-2031
Global Advanced Electronic Packaging Materials market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Advanced Electronic Packaging Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Advanced Electronic Packaging Materials market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Advanced Electronic Packaging Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Advanced Electronic Packaging Materials market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Panasonic, Henkel, Shin-Etsu MicroSi, Lord, Nitto, Sumitomo Bakelite, Darbond Technology, Huitian New Material, Crystal Clear Electronic Material, Cybrid Technologies, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Advanced Electronic Packaging Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Electronic Grade Adhesives
Functional Film Material
Market segment by Application
Integrated Circuit Packaging
Smart Terminal Packaging
Power Battery
Photovoltaic Cell Packaging
Market segment by players, this report covers
Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Nitto
Sumitomo Bakelite
Darbond Technology
Huitian New Material
Crystal Clear Electronic Material
Cybrid Technologies
Suzhou Shihua Technology
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Advanced Electronic Packaging Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Advanced Electronic Packaging Materials, with revenue, gross margin, and global market share of Advanced Electronic Packaging Materials from 2020 to 2025.
Chapter 3, the Advanced Electronic Packaging Materials competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Advanced Electronic Packaging Materials market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Advanced Electronic Packaging Materials.
Chapter 13, to describe Advanced Electronic Packaging Materials research findings and conclusion.
Table of Contents
113 Pages
- 1 Market Overview
- 2 Company Profiles
- 3 Market Competition, by Players
- 4 Market Size Segment by Type
- 5 Market Size Segment by Application
- 6 North America
- 7 Europe
- 8 Asia-Pacific
- 9 South America
- 10 Middle East & Africa
- 11 Market Dynamics
- 12 Industry Chain Analysis
- 13 Research Findings and Conclusion
- 14 Appendix
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
