The global Flip Chip market is projected to reach $40.50 billion by 2028, expanding at a compound annual growth rate (CAGR) of 6.4% from 2021 to 2028. This growth is driven by a range of macroeconomic and microeconomic factors, notably the increasing demand for portable electronic devices, which is fueling the expansion of the Flip Chip market.
The latest research report by Evolve Business Intelligence explores the various factors influencing the global market. It includes an analysis of the current market size, forecasts for key segments and regions, and the driving forces behind market growth. The report examines the potential impacts of key trends on business strategies and provides a SWOT analysis of critical sectors for each major competitor and customer group. This valuable data highlights the conglomerates likely to impact the industry, crucial for any company planning to invest strategically over the next five years. These insights complement our initial quantitative study, aiding in new investments and strategic planning to mitigate threats in existing sectors.
Segments covered
By Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping, Others)
By Industry (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Others)
Key players
3M
Advanced Micro Devices, Inc.
Amkor Technology
Apple Inc.
Fujitsu Limited
Intel Corporation
International Business Machines Corporation
Samsung Electronics Co., Ltd.
Taiwan Semiconductor Manufacturing Company Limited
Texas Instruments Incorporated
- Chapter 1. Executive Summary
- Chapter 2. Scope of The Study
- 2.1. Market Definition
- 2.2. Scope of The Study
- 2.2.1. Objectives of Report
- Chapter 3. Evolve BI Methodology
- Chapter 4. Market Insights and Trends
- 4.1. Supply/ Value Chain Analysis
- 4.2. Porter’s Five Forces Analysis
- 4.2.1. Threat of New Entrants
- 4.2.2. Bargaining Power of Buyers
- 4.2.3. Bargaining Power of Suppliers
- 4.2.4. Threat of Substitutes
- 4.2.5. Industry Rivalry
- 4.3. Impact of COVID-19 on Flip Chip Market
- 4.3.1. Impact on Market Size
- 4.3.2. End User Trend, Preferences and Budget Impact
- 4.3.3. Regulatory Framework/Government Policies
- 4.3.4. Key Players Strategy to Tackle Negative Impact
- 4.3.5. Opportunity Window
- Chapter 5. Market Dynamics
- 5.1. Introduction
- 5.2. DRO Analysis
- 5.2.1. Drivers
- 5.2.2. Restraints
- 5.2.3. Opportunities
- Chapter 6. Global Flip Chip Market, By Bumping Technology
- 6.1. Introduction
- 6.2. Copper Pillar
- 6.3. Solder Bumping
- 6.4. Gold Bumping
- 6.5. Others
- Chapter 7. Global Flip Chip Market, By Industry
- 7.1. Introduction
- 7.2. Electronics
- 7.3. Industrial
- 7.4. Automotive & Transport
- 7.5. Healthcare
- 7.6. IT & Telecommunication
- 7.7. Others
- Chapter 8. Global Flip Chip Market, By Region
- 8.1. Introduction
- 8.2. North America
- 8.2.1. Introduction
- 8.2.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.2.3. Market Size and Forecast, By Country, 2020 - 2028
- 8.2.4. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.2.5. Market Size and Forecast, By Industry, 2020 – 2026
- 8.2.6. US
- 8.2.6.1. Introduction
- 8.2.6.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.2.6.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.2.6.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.2.7. Canada
- 8.2.7.1. Introduction
- 8.2.7.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.2.7.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.2.7.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.3. Europe
- 8.3.1. Introduction
- 8.3.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.3.3. Market Size and Forecast, By Country, 2020 - 2028
- 8.3.4. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.3.5. Market Size and Forecast, By Industry, 2020 – 2026
- 8.3.6. Germany
- 8.3.6.1. Introduction
- 8.3.6.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.3.6.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.3.6.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.3.7. France
- 8.3.7.1. Introduction
- 8.3.7.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.3.7.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.3.7.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.3.8. UK
- 8.3.8.1. Introduction
- 8.3.8.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.3.8.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.3.8.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.3.9. Italy
- 8.3.9.1. Introduction
- 8.3.9.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.3.9.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.3.9.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.3.10. Rest of Europe
- 8.3.10.1. Introduction
- 8.3.10.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.3.10.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.3.10.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.4. Asia-Pacific
- 8.4.1. Introduction
- 8.4.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.4.3. Market Size and Forecast, By Country, 2020 - 2028
- 8.4.4. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.4.5. Market Size and Forecast, By Industry, 2020 - 2028
- 8.4.6. China
- 8.4.6.1. Introduction
- 8.4.6.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.4.6.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.4.6.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.4.7. India
- 8.4.7.1. Introduction
- 8.4.7.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.4.7.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.4.7.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.4.8. Japan
- 8.4.8.1. Introduction
- 8.4.8.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.4.8.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.4.8.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.4.9. South Korea
- 8.4.9.1. Introduction
- 8.4.9.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.4.9.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.4.9.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.4.10. Rest of Asia-Pacific
- 8.4.10.1. Introduction
- 8.4.10.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.4.10.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.4.10.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.5. Rest of The World (Row)
- 8.5.1. Introduction
- 8.5.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.5.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.5.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.5.5. Market Size and Forecast, By Region, 2020 - 2028
- 8.5.6. South America
- 8.5.6.1. Introduction
- 8.5.6.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.5.6.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.5.6.4. Market Size and Forecast, By Industry, 2020 - 2028
- 8.5.7. Middle East and Africa
- 8.5.7.1. Introduction
- 8.5.7.2. Driving Factors, Opportunity Analyzed and Key Trends
- 8.5.7.3. Market Size and Forecast, By Bumping Technology, 2020 - 2028
- 8.5.7.4. Market Size and Forecast, By Industry, 2020 - 2028
- Chapter 9. Competitive Landscape
- 9.1. Introduction
- 9.2. Vendor Share Analysis, 2020/Key Players Positioning, 2020
- Chapter 10. Company Profiles
- 10.1. 3M
- 10.1.1. Business Overview
- 10.1.2. Financial Analysis
- 10.1.3. Product Portfolio
- 10.1.4. Recent Development and Strategies Adopted
- 10.1.5. SWOT Analysis
- 10.2. Advanced Micro Devices, Inc.
- 10.2.1. Business Overview
- 10.2.2. Financial Analysis
- 10.2.3. Product Portfolio
- 10.2.4. Recent Development and Strategies Adopted
- 10.2.5. SWOT Analysis
- 10.3. Amkor Technology
- 10.3.1. Business Overview
- 10.3.2. Financial Analysis
- 10.3.3. Product Portfolio
- 10.3.4. Recent Development and Strategies Adopted
- 10.3.5. SWOT Analysis
- 10.4. Apple Inc.
- 10.4.1. Business Overview
- 10.4.2. Financial Analysis
- 10.4.3. Product Portfolio
- 10.4.4. Recent Development and Strategies Adopted
- 10.4.5. SWOT Analysis
- 10.5. Fujitsu Limited
- 10.5.1. Business Overview
- 10.5.2. Financial Analysis
- 10.5.3. Product Portfolio
- 10.5.4. Recent Development and Strategies Adopted
- 10.5.5. SWOT Analysis
- 10.6. Intel Corporation
- 10.6.1. Business Overview
- 10.6.2. Financial Analysis
- 10.6.3. Product Portfolio
- 10.6.4. Recent Development and Strategies Adopted
- 10.6.5. SWOT Analysis
- 10.7. International Business Machines Corporation
- 10.7.1. Business Overview
- 10.7.2. Financial Analysis
- 10.7.3. Product Portfolio
- 10.7.4. Recent Development and Strategies Adopted
- 10.7.5. SWOT Analysis
- 10.8. Samsung Electronics Co., Ltd.
- 10.8.1. Business Overview
- 10.8.2. Financial Analysis
- 10.8.3. Product Portfolio
- 10.8.4. Recent Development and Strategies Adopted
- 10.8.5. SWOT Analysis
- 10.9. Taiwan Semiconductor Manufacturing Company Limited
- 10.9.1. Business Overview
- 10.9.2. Financial Analysis
- 10.9.3. Product Portfolio
- 10.9.4. Recent Development and Strategies Adopted
- 10.9.5. SWOT Analysis
- 10.10. Texas Instruments Incorporated
- 10.10.1. Business Overview
- 10.10.2. Financial Analysis
- 10.10.3. Product Portfolio
- 10.10.4. Recent Development and Strategies Adopted
- 10.10.5. SWOT Analysis
- Chapter 11. Key Takeaways
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