Global Wafer Grinder Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032
Description
Market Overview
According to DIResearch＇s in-depth investigation and research, the global Wafer Grinder market size will reach 1,229.44 Million USD in 2025 and is projected to reach 2,022.50 Million USD by 2032, with a CAGR of 7.37% (2025-2032). Notably, the China Wafer Grinder market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
A wafer grinder, also known as a wafer grinding machine, is a specialized piece of equipment used in semiconductor manufacturing to thin and flatten semiconductor wafers to achieve the desired thickness and surface quality. This process, known as wafer thinning or backgrinding, is typically performed after the semiconductor devices have been fabricated on the wafer and before the individual chips are separated and packaged. The wafer grinder uses precision grinding wheels or abrasive discs to remove material from the backside of the wafer, gradually reducing its thickness to the required specifications while maintaining uniformity and flatness. Wafer grinders are equipped with advanced control systems and measurement tools to ensure precise control over the grinding process, including parameters such as grinding speed, pressure, and depth of cut. The wafer grinder plays a critical role in semiconductor manufacturing by enabling the production of thinner wafers with precise thickness control, which is essential for achieving high-performance semiconductor devices.
The major global manufacturers of Wafer Grinder include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, SpeedFam, Hauhaiqingke, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Wafer Grinder. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer Grinder market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Wafer Grinder market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer Grinder industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Wafer Grinder Include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Wafer Grinder Product Segment Include:
Fully Automatic
Semi-Automatic
Wafer Grinder Product Application Include:
200mm Wafer
300mm Wafer
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Wafer Grinder Industry PESTEL Analysis
Chapter 3: Global Wafer Grinder Industry Porter's Five Forces Analysis
Chapter 4: Global Wafer Grinder Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Wafer Grinder Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Wafer Grinder Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Wafer Grinder Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
According to DIResearch＇s in-depth investigation and research, the global Wafer Grinder market size will reach 1,229.44 Million USD in 2025 and is projected to reach 2,022.50 Million USD by 2032, with a CAGR of 7.37% (2025-2032). Notably, the China Wafer Grinder market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
A wafer grinder, also known as a wafer grinding machine, is a specialized piece of equipment used in semiconductor manufacturing to thin and flatten semiconductor wafers to achieve the desired thickness and surface quality. This process, known as wafer thinning or backgrinding, is typically performed after the semiconductor devices have been fabricated on the wafer and before the individual chips are separated and packaged. The wafer grinder uses precision grinding wheels or abrasive discs to remove material from the backside of the wafer, gradually reducing its thickness to the required specifications while maintaining uniformity and flatness. Wafer grinders are equipped with advanced control systems and measurement tools to ensure precise control over the grinding process, including parameters such as grinding speed, pressure, and depth of cut. The wafer grinder plays a critical role in semiconductor manufacturing by enabling the production of thinner wafers with precise thickness control, which is essential for achieving high-performance semiconductor devices.
The major global manufacturers of Wafer Grinder include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, SpeedFam, Hauhaiqingke, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Wafer Grinder. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer Grinder market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Wafer Grinder market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer Grinder industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Wafer Grinder Include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Wafer Grinder Product Segment Include:
Fully Automatic
Semi-Automatic
Wafer Grinder Product Application Include:
200mm Wafer
300mm Wafer
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Wafer Grinder Industry PESTEL Analysis
Chapter 3: Global Wafer Grinder Industry Porter's Five Forces Analysis
Chapter 4: Global Wafer Grinder Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Wafer Grinder Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Wafer Grinder Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Wafer Grinder Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
Table of Contents
165 Pages
- 1 Wafer Grinder Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Wafer Grinder Product by Type
- 1.2.1 Fully Automatic
- 1.2.2 Semi-Automatic
- 1.3 Wafer Grinder Product by Application
- 1.3.1 200mm Wafer
- 1.3.2 300mm Wafer
- 1.3.3 Others
- 1.4 Global Wafer Grinder Market Revenue and Sales Analysis
- 1.4.1 Global Wafer Grinder Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Wafer Grinder Sales Market Size Analysis (2020-2032)
- 1.4.3 Global Wafer Grinder Market Sales Price Trend Analysis (2020-2032)
- 1.5 Wafer Grinder Market Development Status and Trends
- 1.5.1 Wafer Grinder Industry Development Status Analysis
- 1.5.2 Wafer Grinder Industry Development Trends Analysis
- 2 Wafer Grinder Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Wafer Grinder Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Wafer Grinder Market Analysis by Country
- 4.1 Global Wafer Grinder Market Size Analysis by Country: 2024 VS 2025 VS 2032
- 4.1.1 Global Wafer Grinder Revenue and Market Share by Country (2020-2025)
- 4.1.2 Global Wafer Grinder Revenue and Market Share Forecast by Country (2026-2032)
- 4.2 Global Wafer Grinder Sales Analysis by Country: 2024 VS 2025 VS 2032
- 4.2.1 Global Wafer Grinder Sales and Market Share by Country (2020-2025)
- 4.2.2 Global Wafer Grinder Sales and Market Share Forecast by Country (2026-2032)
- 4.3 United States Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.4 Germany Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.5 Japan Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.6 China Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.7 France Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.8 U.K. Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.9 South Korea Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.10 Canada Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.11 Italy Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.12 Russia Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.13 Mexico Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.14 Brazil Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.15 India Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.16 Vietnam Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.17 Thailand Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 4.18 South Africa Wafer Grinder Market Sales, Revenue and Growth Rate (2020-2032)
- 5 Competition by Manufacturers
- 5.1 Global Wafer Grinder Market Sales, Revenue and Sales Price by Key Manufacturers (2021-2025)
- 5.1.1 Global Wafer Grinder Market Sales by Key Manufacturers (2021-2025)
- 5.1.2 Global Wafer Grinder Market Revenue by Key Manufacturers (2021-2025)
- 5.1.3 Global Wafer Grinder Average Sales Price by Manufacturers (2021-2025)
- 5.2 Wafer Grinder Competitive Landscape Analysis and Market Dynamic
- 5.2.1 Wafer Grinder Competitive Landscape Analysis
- 5.2.2 Global Key Manufacturers Headquarter and Key Area Sales
- 5.2.3 Market Dynamic
- 6 Wafer Grinder Market Analysis by Type
- 6.1 Global Wafer Grinder Market Revenue Analysis by Type
- 6.1.1 Global Wafer Grinder Market Size Analysis by Type: 2024 & 2025 & 2032
- 6.1.2 Global Wafer Grinder Revenue and Forecast Analysis by Type (2020-2032)
- 6.2 Global Wafer Grinder Market Sales and Forecast Analysis by Type (2020-2032)
- 6.3 Global Wafer Grinder Sales Price Trend Analysis by Type (2020-2032)
- 7 Key Companies Analysis
- 7.1 Disco
- 7.1.1 Disco Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.1.2 Disco Wafer Grinder Product Portfolio
- 7.1.3 Disco Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.2 TOKYO SEIMITSU
- 7.2.1 TOKYO SEIMITSU Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.2.2 TOKYO SEIMITSU Wafer Grinder Product Portfolio
- 7.2.3 TOKYO SEIMITSU Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.3 G&N
- 7.3.1 G&N Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.3.2 G&N Wafer Grinder Product Portfolio
- 7.3.3 G&N Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.4 Okamoto Semiconductor Equipment Division
- 7.4.1 Okamoto Semiconductor Equipment Division Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.4.2 Okamoto Semiconductor Equipment Division Wafer Grinder Product Portfolio
- 7.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.5 CETC
- 7.5.1 CETC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.5.2 CETC Wafer Grinder Product Portfolio
- 7.5.3 CETC Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.6 Koyo Machinery
- 7.6.1 Koyo Machinery Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.6.2 Koyo Machinery Wafer Grinder Product Portfolio
- 7.6.3 Koyo Machinery Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.7 Revasum
- 7.7.1 Revasum Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.7.2 Revasum Wafer Grinder Product Portfolio
- 7.7.3 Revasum Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.8 WAIDA MFG
- 7.8.1 WAIDA MFG Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.8.2 WAIDA MFG Wafer Grinder Product Portfolio
- 7.8.3 WAIDA MFG Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.9 Shenzhen Fangda
- 7.9.1 Shenzhen Fangda Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.9.2 Shenzhen Fangda Wafer Grinder Product Portfolio
- 7.9.3 Shenzhen Fangda Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.10 Hunan Yujing Machine Industrial
- 7.10.1 Hunan Yujing Machine Industrial Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.10.2 Hunan Yujing Machine Industrial Wafer Grinder Product Portfolio
- 7.10.3 Hunan Yujing Machine Industrial Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.11 SpeedFam
- 7.11.1 SpeedFam Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.11.2 SpeedFam Wafer Grinder Product Portfolio
- 7.11.3 SpeedFam Wafer Grinder Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.12 Hauhaiqingke
- 7.12.1 Hauhaiqingke Basic Company Profile (Employees, Areas Service, Competitor
Pricing
Currency Rates
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