Global Chip Encapsulation Material Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032

Market Overview

According to DIResearch's in-depth investigation and research, the global Chip Encapsulation Material market size will reach 29,964 Million USD in 2025 and is projected to reach 42,416 Million USD by 2032, with a CAGR of 5.09% (2025-2032). Notably, the China Chip Encapsulation Material market has changed rapidly in the past few years. By 2025, China's market size is expected to be Million USD, representing approximately % of the global market share.

Research Summary

Chip encapsulation material, also known as encapsulant or molding compound, is a protective material used to cover and seal semiconductor chips or integrated circuits (ICs). The main purpose of chip encapsulation is to shield the delicate circuitry inside the chip from environmental factors such as moisture, dust, and mechanical stress, ensuring the chip's reliability and longevity. The encapsulation material is applied in liquid or paste form, and it undergoes a curing process to solidify and form a protective coating around the chip. This coating not only provides physical protection but also improves the chip's thermal performance by dissipating heat generated during operation. Chip encapsulation materials come in various formulations, including epoxy, silicone, and resin-based compounds, each offering different properties such as flexibility, adhesion, and resistance to high temperatures. The choice of chip encapsulation material is critical in semiconductor manufacturing to ensure the chip's performance, reliability, and overall quality for its intended applications in electronic devices and systems.

The major global suppliers of Chip Encapsulation Material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Chang Wah Technology, Panasonic, Henkel, Sumitomo Bakelite, Heraeus, Tanaka, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Chip Encapsulation Material. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major suppliers, as well as the market status and trends of different product types and applications in the global Chip Encapsulation Material market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Chip Encapsulation Material market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip Encapsulation Material industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Suppliers of Chip Encapsulation Material Include:

Shennan Circuit Company Limited

Xingsen Technology

Kangqiang Electronics

Kyocera

Mitsui High-tec

Chang Wah Technology

Panasonic

Henkel

Sumitomo Bakelite

Heraeus

Tanaka

Chip Encapsulation Material Product Segment Include:

Substrates

Lead Frame

Bonding Wires

Encapsulating Resin

Others

Chip Encapsulation Material Product Application Include:

Consumer Electronics

Automotive Electronics

IT and Communication Industry

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend

Chapter 2: Global Chip Encapsulation Material Industry PESTEL Analysis

Chapter 3: Global Chip Encapsulation Material Industry Porter's Five Forces Analysis

Chapter 4: Global Chip Encapsulation Material Major Regional Market Size (Revenue) and Forecast Analysis

Chapter 5: Global Chip Encapsulation Material Competitive Analysis of Key Suppliers (Revenue, Market Share, Regional Distribution and Industry Concentration)

Chapter 6: Global Chip Encapsulation Material Revenue and Forecast Analysis by Product Type

Chapter 7: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)

Chapter 8: Industrial Chain Analysis, Chip Encapsulation Material Different Application Market Analysis (Revenue and Forecast) and Sales Channel Analysis

Chapter 9: Research Findings and Conclusion

Chapter 10: Methodology and Data Sources


1 Chip Encapsulation Material Market Overview
1.1 Product Definition and Statistical Scope
1.2 Chip Encapsulation Material Product by Type
1.2.1 Substrates
1.2.2 Lead Frame
1.2.3 Bonding Wires
1.2.4 Encapsulating Resin
1.2.5 Others
1.3 Chip Encapsulation Material Product by Application
1.3.1 Consumer Electronics
1.3.2 Automotive Electronics
1.3.3 IT and Communication Industry
1.3.4 Others
1.4 Global Chip Encapsulation Material Market Size Analysis (2020-2032)
1.5 Chip Encapsulation Material Market Development Status and Trends
1.5.1 Chip Encapsulation Material Industry Development Status Analysis
1.5.2 Chip Encapsulation Material Industry Development Trends Analysis
2 Chip Encapsulation Material Market PESTEL Analysis
2.1 Political Factors Analysis
2.2 Economic Factors Analysis
2.3 Social Factors Analysis
2.4 Technological Factors Analysis
2.5 Environmental Factors Analysis
2.6 Legal Factors Analysis
3 Chip Encapsulation Material Market Porter's Five Forces Analysis
3.1 Competitive Rivalry
3.2 Threat of New Entrants
3.3 Bargaining Power of Suppliers
3.4 Bargaining Power of Buyers
3.5 Threat of Substitutes
4 Global Chip Encapsulation Material Market Analysis by Country
4.1 Global Chip Encapsulation Material Market Size Analysis by Country: 2024 VS 2025 VS 2032
4.1.1 Global Chip Encapsulation Material Revenue Analysis by Country (2020-2025)
4.1.2 Global Chip Encapsulation Material Revenue Forecast Analysis by Country (2026-2032)
4.2 United States Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.3 Germany Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.4 Japan Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.5 China Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.6 France Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.7 U.K. Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.8 South Korea Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.9 Canada Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.10 Italy Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.11 Russia Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.12 Mexico Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.13 Brazil Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.14 India Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.15 Vietnam Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.16 Thailand Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
4.17 South Africa Chip Encapsulation Material Market Revenue and Growth Rate (2020-2032)
5 Competition by Suppliers
5.1 Global Chip Encapsulation Material Market Revenue by Key Suppliers (2021-2025)
5.2 Chip Encapsulation Material Competitive Landscape Analysis and Market Dynamic
5.2.1 Chip Encapsulation Material Competitive Landscape Analysis
5.2.2 Global Key Suppliers Headquarter and Key Area Sales
5.2.3 Market Dynamic
6 Chip Encapsulation Material Market Analysis by Type
6.1 Global Chip Encapsulation Material Market Size Analysis by Type: 2024 VS 2025 VS 2032
6.2 Global Chip Encapsulation Material Revenue and Forecast Analysis by Type (2020-2032)
7 Key Companies Analysis
7.1 Shennan Circuit Company Limited
7.1.1 Shennan Circuit Company Limited Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.1.2 Shennan Circuit Company Limited Chip Encapsulation Material Product Portfolio
7.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.2 Xingsen Technology
7.2.1 Xingsen Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.2.2 Xingsen Technology Chip Encapsulation Material Product Portfolio
7.2.3 Xingsen Technology Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.3 Kangqiang Electronics
7.3.1 Kangqiang Electronics Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.3.2 Kangqiang Electronics Chip Encapsulation Material Product Portfolio
7.3.3 Kangqiang Electronics Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.4 Kyocera
7.4.1 Kyocera Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.4.2 Kyocera Chip Encapsulation Material Product Portfolio
7.4.3 Kyocera Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.5 Mitsui High-tec
7.5.1 Mitsui High-tec Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.5.2 Mitsui High-tec Chip Encapsulation Material Product Portfolio
7.5.3 Mitsui High-tec Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.6 Chang Wah Technology
7.6.1 Chang Wah Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.6.2 Chang Wah Technology Chip Encapsulation Material Product Portfolio
7.6.3 Chang Wah Technology Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.7 Panasonic
7.7.1 Panasonic Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.7.2 Panasonic Chip Encapsulation Material Product Portfolio
7.7.3 Panasonic Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.8 Henkel
7.8.1 Henkel Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.8.2 Henkel Chip Encapsulation Material Product Portfolio
7.8.3 Henkel Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.9 Sumitomo Bakelite
7.9.1 Sumitomo Bakelite Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.9.2 Sumitomo Bakelite Chip Encapsulation Material Product Portfolio
7.9.3 Sumitomo Bakelite Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.10 Heraeus
7.10.1 Heraeus Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.10.2 Heraeus Chip Encapsulation Material Product Portfolio
7.10.3 Heraeus Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
7.11 Tanaka
7.11.1 Tanaka Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
7.11.2 Tanaka Chip Encapsulation Material Product Portfolio
7.11.3 Tanaka Chip Encapsulation Material Market Data Analysis (Revenue, Gross Margin and Market Share) (2021-2025)
8 Industry Chain Analysis
8.1 Chip Encapsulation Material Industry Chain Analysis
8.2 Chip Encapsulation Material Product Downstream Application Analysis
8.2.1 Global Chip Encapsulation Material Market Size and Growth Rate (CAGR) by Application: 2024 VS 2025 VS 2032
8.2.2 Global Chip Encapsulation Material Revenue and Forecast by Application (2020-2032)
8.3 Chip Encapsulation Material Typical Downstream Customers
8.4 Chip Encapsulation Material Sales Channel Analysis
9 Research Findings and Conclusion
10 Methodology and Data Source
10.1 Methodology/Research Approach
10.2 Research Scope
10.3 Benchmarks and Assumptions
10.4 Date Source
10.4.1 Primary Sources
10.4.2 Secondary Sources
10.5 Data Cross Validation
10.6 Disclaimer

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