Market Overview
According to DIResearch's in-depth investigation and research, the global Chip Encapsulation Material market size will reach 29,964 Million USD in 2025 and is projected to reach 42,416 Million USD by 2032, with a CAGR of 5.09% (2025-2032). Notably, the China Chip Encapsulation Material market has changed rapidly in the past few years. By 2025, China's market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Chip encapsulation material, also known as encapsulant or molding compound, is a protective material used to cover and seal semiconductor chips or integrated circuits (ICs). The main purpose of chip encapsulation is to shield the delicate circuitry inside the chip from environmental factors such as moisture, dust, and mechanical stress, ensuring the chip's reliability and longevity. The encapsulation material is applied in liquid or paste form, and it undergoes a curing process to solidify and form a protective coating around the chip. This coating not only provides physical protection but also improves the chip's thermal performance by dissipating heat generated during operation. Chip encapsulation materials come in various formulations, including epoxy, silicone, and resin-based compounds, each offering different properties such as flexibility, adhesion, and resistance to high temperatures. The choice of chip encapsulation material is critical in semiconductor manufacturing to ensure the chip's performance, reliability, and overall quality for its intended applications in electronic devices and systems.
The major global suppliers of Chip Encapsulation Material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Chang Wah Technology, Panasonic, Henkel, Sumitomo Bakelite, Heraeus, Tanaka, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Chip Encapsulation Material. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major suppliers, as well as the market status and trends of different product types and applications in the global Chip Encapsulation Material market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Chip Encapsulation Material market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip Encapsulation Material industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Suppliers of Chip Encapsulation Material Include:
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Chip Encapsulation Material Product Segment Include:
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Chip Encapsulation Material Product Application Include:
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Chip Encapsulation Material Industry PESTEL Analysis
Chapter 3: Global Chip Encapsulation Material Industry Porter's Five Forces Analysis
Chapter 4: Global Chip Encapsulation Material Major Regional Market Size (Revenue) and Forecast Analysis
Chapter 5: Global Chip Encapsulation Material Competitive Analysis of Key Suppliers (Revenue, Market Share, Regional Distribution and Industry Concentration)
Chapter 6: Global Chip Encapsulation Material Revenue and Forecast Analysis by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)
Chapter 8: Industrial Chain Analysis, Chip Encapsulation Material Different Application Market Analysis (Revenue and Forecast) and Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
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