Market Overview
According to DIResearch's in-depth investigation and research, the global Bonder market size will reach 2,953.01 Million USD in 2025 and is projected to reach 4,160.73 Million USD by 2032, with a CAGR of 5.02% (2025-2032). Notably, the China Bonder market has changed rapidly in the past few years. By 2025, China's market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
A bonder is a precision machine used in microelectronics packaging and semiconductor manufacturing to electrically connect chips to package substrates or lead frames. Depending on the bonding method, bonders can be classified into types such as ball bonding, wedge bonding, and flip chip bonding, and are widely applied in the packaging processes of integrated circuits (ICs), LEDs, MEMS, and other devices. By precisely controlling parameters like pressure, temperature, time, and ultrasonic energy, bonders achieve high-precision and reliable connections, making them essential equipment for ensuring the performance and stability of microelectronic devices.
The major global manufacturers of Bonder include Besi, ASMPT Ltd, Kulicke & Soffa, Shibaura, Shinkawa Ltd., Fasford Technology, SUSS MicroTec, Hanmi, Palomar Technologies, Panasonic, Toray Engineering, Ultrasonic Engineering, Hesse GmbH, SET, F&K Delvotec, WestBond, Inc., Hybond, DIAS Automation, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Bonder. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Bonder market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Bonder market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Bonder industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Bonder Include:
Besi
ASMPT Ltd
Kulicke & Soffa
Shibaura
Shinkawa Ltd.
Fasford Technology
SUSS MicroTec
Hanmi
Palomar Technologies
Panasonic
Toray Engineering
Ultrasonic Engineering
Hesse GmbH
SET
F&K Delvotec
WestBond, Inc.
Hybond
DIAS Automation
Bonder Product Segment Include:
Wire Bonder
Die Bonder
FC Bonder
Bonder Product Application Include:
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and test (OSATs)
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Bonder Industry PESTEL Analysis
Chapter 3: Global Bonder Industry Porter's Five Forces Analysis
Chapter 4: Global Bonder Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Bonder Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Bonder Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Bonder Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
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