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Thermal Interface Materials: Technologies, Applications and Global Markets

Publisher BCC Research
Published Jan 17, 2025
Length 150 Pages
SKU # WA19520078

Description

Thermal Interface Materials: Technologies, Applications and Global Markets



Report Scope

The report analyzes the thermal interface material (TIM) market across material types and applications, offering insights into key trends and growth drivers. The study focuses on materials such as polymer composites, metals and phase-change materials (PCMs), assessing their adoption across diverse industries. Key applications include computers, consumer electronics, industrial equipment, automotive, medical devices, telecom, renewable energy, aerospace and defense, and other niche sectors where efficient thermal management is required.

The report provides a comprehensive regional analysis covering North America, Europe, Asia-Pacific and the Rest of the World (RoW), including Latin America, the Middle East and Africa. It evaluates the market dynamics, including drivers, challenges and emerging trends, while highlighting innovations in material design and performance enhancement. The study concludes with an analysis of major market players and their offerings. The base year for the study is 2023, with projections for 2024 through 2029, including compound annual growth rate (CAGR) for the forecast period.

Report Includes

41 data tables and 46 additional tables

An overview of the current and future global markets, technologies, and applications for thermal interface materials (TIM)

Analyses of the global market trends, with sales data for 2023, estimates for 2024, forecasts for 2026, 2028, and projections of compound annual growth rates (CAGRs) through 2029

Estimation of the actual market size and revenue forecast for global thermal interface materials market, and corresponding market share analysis based on the type of material, end-use application, and region

Coverage of thermal interface materials (TIM) technologies, applications and products with the greatest commercial potential in the near to mid-term

Discussion of major growth drivers, industry-specific challenges, regulatory aspects, and technology advancement that will shape the market for thermal interface materials as a basis for projecting demand in the next few years (2024-2029)

Analysis of market opportunities with a holistic review of the Porter’s five forces analysis and value chain analysis considering both microand macro environmental factors prevailing in the market

Understanding of the importance of ESG in the market for thermal interface materials, consumer attitudes towards sustainability, risks and opportunity assessment, ratings and matrices, and ESG practices in the TIMs industry

A relevant patent analysis with emphasis on emerging technologies and new developments in the thermal interface materials (TIM) technologies and applications market

Latest information on the mergers and acquisition deals, partnerships, agreements, collaborations, and other strategic alliances within the marketplace

Identification of the major stakeholders and analysis of the competitive landscape based on recent developments and segmental revenues

Company profiles of the leading global players, including 3M Co., Parker Hannifin Corp., Shin-Etsu Chemical Co. Ltd., Henkel AG & Co. KGaA, and Dow Corning

Companies Mentioned

3m
Ametek Inc.
Aos Thermal Compounds Llc.
Dow
Enerdyne Thermal Solutions Inc.
Epic Resins
Henkel Ag & Co. Kgaa
Indium Corp.
Master Bond Inc.
Mg Chemicals
Momentive Performance Materials
Parker Hannifin Corp.
Polycast International
Rogers Corp.
Shin-etsu Chemical Co. Ltd.
Timtronics
Universal Science
Vanguard Products Corp.
Wakefield Thermal Inc.
Zalman

Table of Contents

150 Pages
Chapter 1 Executive Summary
Market Outlook
Scope of the Report
Market Summary
Market Dynamics and Growth Factors
Emerging Technologies
Segmental Analysis
Regional Analysis
Conclusion
Chapter 2 Market Overview
Overview
Future Outlook
Value Chain Analysis
Material Development
Manufacturing and Processing
Distribution and Logistics
Application and Integration
Ongoing Support and Performance Optimization
Porter’s Five Forces Analysis
Bargaining Power of Suppliers
Bargaining Power of Consumers
Potential for New Entrants
Competition in the Industry
Threat of Substitutes
Trade Data Analysis
Exports
Imports
Chapter 3 Market Dynamics
Overview
Market Drivers
Increasing Utilization in Data Centers
Escalating Need for Compact and Miniaturized Electronic Components
Expanding Market for High-Efficiency LED Lighting Solutions
Market Restraints
Elevated Costs Associated with Advanced Materials
Regulatory and Compliance Issues
Limited Performance of TIMs Due to Physical Properties
Market Opportunities
Electrification in the Transportation Industry
Increasing Adoption of 5G Technology
Growth in Smart Transportation and IoT
Chapter 4 Regulatory Landscape
Overview
Chapter 5 Emerging Technologies and Patent Analysis
Overview
Emerging Technologies
Graphene-Based TIMs
3D-Printed TIMs
Liquid Metal TIMs
Carbon Nanotube (CNT)-Enhanced TIMs
Hybrid TIMs
Patent Analysis
Regional Patterns
Key Findings
Chapter 6 Market Segment Analysis
Segmentation Breakdown
Market Breakdown by Material Type
Key Takeaways
Polymer Composites
Metals
Phase-Change Materials
Market Breakdown by Application
Key Takeaways
Computers
Consumer Electronics
Industrial
Automotive
Medical Equipment
Telecom
Renewable Energy
Aerospace and Defense
Others
Geographic Breakdown
Market Breakdown by Region
Key Takeaways
North America
Europe
Asia-Pacific
Rest of the World
Chapter 7 Competitive Landscape
Key Takeaways
Ecosystem Analysis
Raw Material Suppliers
TIMs Manufacturers
Distributors
OEMs
Analysis of Key Companies
Strategic Analysis
Recent Developments
Chapter 8 Environmental, Social and Governance Perspective
Key Takeaways
Overview
Environmental Impact
Social Impact
Governance Impact
Status of ESG in the TIMs Market
Concluding Remarks from BCC
Chapter 9 Appendix
Research Methodology
References
Abbreviations
Company Profiles
3M
AMETEK INC.
AOS THERMAL COMPOUNDS LLC.
DOW
ENERDYNE THERMAL SOLUTIONS INC.
EPIC RESINS
HENKEL AG & CO. KGAA
INDIUM CORP.
MASTER BOND INC.
MG CHEMICALS
MOMENTIVE PERFORMANCE MATERIALS
PARKER HANNIFIN CORP.
POLYCAST INTERNATIONAL
ROGERS CORP.
SHIN-ETSU CHEMICAL CO. LTD.
TIMTRONICS
UNIVERSAL SCIENCE
VANGUARD PRODUCTS CORP.
WAKEFIELD THERMAL INC.
ZALMAN

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