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Die-Attach Materials Market by Product Type (Adhesive Bonding, Eutectic Bonding, Films), Form Type (Paste, Powder), Material Type, Application - Global Forecast 2024-2030

Publisher 360iResearch
Published Jan 15, 2024
Length 188 Pages
SKU # IRE18442725

Description

Die-Attach Materials Market by Product Type (Adhesive Bonding, Eutectic Bonding, Films), Form Type (Paste, Powder), Material Type, Application - Global Forecast 2024-2030


The Die-Attach Materials Market size was estimated at USD 763.56 million in 2023 and expected to reach USD 809.34 million in 2024, at a CAGR 6.39% to reach USD 1,178.14 million by 2030.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Die-Attach Materials Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Die-Attach Materials Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Die-Attach Materials Market, highlighting leading vendors and their innovative profiles. These include AI Technology, Inc., BE Semiconductor Industries N.V., Creative Materials Inc., DuPont de Nemours, Inc., Henkel AG & Co. KGaA, Heraeus Group, Hybond Inc., Indium Corporation, KYOCERA Corporation, MacDermid Alpha Electronics Solutions, Master Bond Inc., Nordson Corporation, Palomar Technologies, Inc., Shin-Etsu Chemical Co., Ltd., The Dow Chemical Company, Tresky AG, and Umicore N.V..

Market Segmentation & Coverage

This research report categorizes the Die-Attach Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

Product Type
Adhesive Bonding

Eutectic Bonding

Films

Flip Chip

Sintering

Solder Attach
Form Type
Paste

Powder
Material Type
Alloy

Glass

Silver
Application
Commercial

Industrial
Region
Americas
Argentina
Brazil
Canada
Mexico
United States
California
Florida
Illinois
New York
Ohio
Pennsylvania
Texas

Asia-Pacific
Australia
China
India
Indonesia
Japan
Malaysia
Philippines
Singapore
South Korea
Taiwan
Thailand
Vietnam

Europe, Middle East & Africa
Denmark
Egypt
Finland
France
Germany
Israel
Italy
Netherlands
Nigeria
Norway
Poland
Qatar
Russia
Saudi Arabia
South Africa
Spain
Sweden
Switzerland
Turkey
United Arab Emirates
United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Die-Attach Materials Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Die-Attach Materials Market?
3. What are the technology trends and regulatory frameworks in the Die-Attach Materials Market?
4. What is the market share of the leading vendors in the Die-Attach Materials Market?
5. Which modes and strategic moves are suitable for entering the Die-Attach Materials Market?PDF E-mail From Publisher (2-5)Users License

Table of Contents

188 Pages
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
4.1. Introduction
4.2. Die-Attach Materials Market, by Region
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rising adoption of electrical circuit boards due to the surging demand for consumer electronics
5.1.1.2. Increasing requirement for adhesive in wide range of applications globally
5.1.1.3. Growing demand die-attach films in packaging and automotive industries
5.1.2. Restraints
5.1.2.1. Raw material procurement limitations and increasing technical expectations
5.1.3. Opportunities
5.1.3.1. Increasing technological advancement and high demand from end-user industry
5.1.3.2. Rapid advancements in die attach materials technologies globally
5.1.4. Challenges
5.1.4.1. Limited usage due to functional property mechanical fixation
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter’s Five Forces Analysis
5.5.1. Threat of New Entrants
5.5.2. Threat of Substitutes
5.5.3. Bargaining Power of Customers
5.5.4. Bargaining Power of Suppliers
5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework
6. Die-Attach Materials Market, by Product Type
6.1. Introduction
6.2. Adhesive Bonding
6.3. Eutectic Bonding
6.4. Films
6.5. Flip Chip
6.6. Sintering
6.7. Solder Attach
7. Die-Attach Materials Market, by Form Type
7.1. Introduction
7.2. Paste
7.3. Powder
8. Die-Attach Materials Market, by Material Type
8.1. Introduction
8.2. Alloy
8.3. Glass
8.4. Silver
9. Die-Attach Materials Market, by Application
9.1. Introduction
9.2. Commercial
9.3. Industrial
10. Americas Die-Attach Materials Market
10.1. Introduction
10.2. Argentina
10.3. Brazil
10.4. Canada
10.5. Mexico
10.6. United States
11. Asia-Pacific Die-Attach Materials Market
11.1. Introduction
11.2. Australia
11.3. China
11.4. India
11.5. Indonesia
11.6. Japan
11.7. Malaysia
11.8. Philippines
11.9. Singapore
11.10. South Korea
11.11. Taiwan
11.12. Thailand
11.13. Vietnam
12. Europe, Middle East & Africa Die-Attach Materials Market
12.1. Introduction
12.2. Denmark
12.3. Egypt
12.4. Finland
12.5. France
12.6. Germany
12.7. Israel
12.8. Italy
12.9. Netherlands
12.10. Nigeria
12.11. Norway
12.12. Poland
12.13. Qatar
12.14. Russia
12.15. Saudi Arabia
12.16. South Africa
12.17. Spain
12.18. Sweden
12.19. Switzerland
12.20. Turkey
12.21. United Arab Emirates
12.22. United Kingdom
13. Competitive Landscape
13.1. FPNV Positioning Matrix
13.2. Market Share Analysis, By Key Player
13.3. Competitive Scenario Analysis, By Key Player
14. Competitive Portfolio
14.1. Key Company Profiles
14.1.1. AI Technology, Inc.
14.1.2. BE Semiconductor Industries N.V.
14.1.3. Creative Materials Inc.
14.1.4. DuPont de Nemours, Inc.
14.1.5. Henkel AG & Co. KGaA
14.1.6. Heraeus Group
14.1.7. Hybond Inc.
14.1.8. Indium Corporation
14.1.9. KYOCERA Corporation
14.1.10. MacDermid Alpha Electronics Solutions
14.1.11. Master Bond Inc.
14.1.12. Nordson Corporation
14.1.13. Palomar Technologies, Inc.
14.1.14. Shin-Etsu Chemical Co., Ltd.
14.1.15. The Dow Chemical Company
14.1.16. Tresky AG
14.1.17. Umicore N.V.
14.2. Key Product Portfolio
15. Appendix
15.1. Discussion Guide
15.2. License & Pricing
FIGURE 1. DIE-ATTACH MATERIALS MARKET RESEARCH PROCESS
FIGURE 2. DIE-ATTACH MATERIALS MARKET SIZE, 2023 VS 2030
FIGURE 3. DIE-ATTACH MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 4. DIE-ATTACH MATERIALS MARKET SIZE, BY REGION, 2023 VS 2030 (%)
FIGURE 5. DIE-ATTACH MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 6. DIE-ATTACH MATERIALS MARKET DYNAMICS
FIGURE 7. DIE-ATTACH MATERIALS MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2030 (%)
FIGURE 8. DIE-ATTACH MATERIALS MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 9. DIE-ATTACH MATERIALS MARKET SIZE, BY FORM TYPE, 2023 VS 2030 (%)
FIGURE 10. DIE-ATTACH MATERIALS MARKET SIZE, BY FORM TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 11. DIE-ATTACH MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2023 VS 2030 (%)
FIGURE 12. DIE-ATTACH MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 13. DIE-ATTACH MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
FIGURE 14. DIE-ATTACH MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 15. AMERICAS DIE-ATTACH MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 16. AMERICAS DIE-ATTACH MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 17. UNITED STATES DIE-ATTACH MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
FIGURE 18. UNITED STATES DIE-ATTACH MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 19. ASIA-PACIFIC DIE-ATTACH MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 20. ASIA-PACIFIC DIE-ATTACH MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 21. EUROPE, MIDDLE EAST & AFRICA DIE-ATTACH MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 22. EUROPE, MIDDLE EAST & AFRICA DIE-ATTACH MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 23. DIE-ATTACH MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023
FIGURE 24. DIE-ATTACH MATERIALS MARKET SHARE, BY KEY PLAYER, 2023

Pricing

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