Global SiC & GaN Wafer Defect Inspection System Market Research Report 2025
Description
The global SiC & GaN Wafer Defect Inspection System market was valued at US$ 777.25 million in 2024 and is anticipated to reach US$ 2631.67 million by 2031, witnessing a CAGR of 18.34% during the forecast period 2026-2031.
North American is the largest producer of SiC & GaN Wafer Defect Inspection System, the production value is estimated to increase from $ 559.11 million in 2024 to reach $ 1726 million by 2031, at a CAGR of 17.23% during the forecast period of 2024 through 2031.
Japan is the second producer of SiC & GaN Wafer Defect Inspection System, the production value is estimated to increase from $ 128.65 million in 2024 to reach $ 414.63 million by 2031, at a CAGR of 16.75% during the forecast period of 2024 through 2031.
In past few years, China is the fastest-growing production region of SiC & GaN Wafer Defect Inspection System, the production value is estimated to increase from $ 49.51 million in 2024 to reach $ 342.55 million by 2031, at a CAGR of 28.48% during the forecast period of 2024 through 2031.
The major global manufacturers of SiC & GaN Wafer Defect Inspection System include KLA Corporation, Onto Innovation, Rigaku, Angkun Vision (Beijing) Technology, Lasertec, Bruker, Visiontec Group, TASMIT, Inc. (Toray) and HORIBA (EtaMax), etc. In 2024, the world's top ten vendors accounted for approximately 90 % of the revenue.
The SiC & GaN Wafer Defect Inspection System industry is a narrowly defined segment of semiconductor metrology that covers only wafer-level defect inspection systems dedicated to silicon carbide (SiC) and gallium nitride (GaN) wafers across three process stages: SiC substrate, SiC epitaxy and SiC devices; GaN substrate, GaN epitaxy and GaN devices. In statistical terms, this segment includes automated tools that perform full-wafer or high-coverage defect detection and mapping on 100–200 mm SiC and GaN wafers used in power, RF and optoelectronic devices, but excludes generic silicon-only inspection tools and back-end/packaging inspection. Representative systems are explicitly marketed for SiC/GaN wafer defect inspection. KLA’s Candela® 8520 is an integrated surface- and photoluminescence-inspection platform for SiC and GaN substrates and epitaxial wafers, detecting particles, scratches, cracks, stains, pits, carrots, basal-plane dislocations (BPDs), micropipes, stacking faults, grain boundaries and threading dislocations up to 200 mm diameter. Lasertec’s SICA88 and next-generation SICA108 are SiC-only wafer inspection and review systems that integrate surface scatter and PL channels in a single tool to concurrently inspect and classify surface and crystallographic defects on SiC substrates and epi wafers. Onto Innovation’s Celero™ PL system is designed specifically for subsurface and crystalline defect inspection and classification in SiC and GaN wafers, using a laser-based phase-detection PL architecture to meet growing demand from power-device and compound-semiconductor lines. On the X-ray side, Rigaku’s XRTmicron and XRTmicron Near-Fab systems provide fast, high-resolution X-ray topography for non-destructive imaging and mapping of dislocations, stacking faults, micropipes and grain boundaries in single-crystal wafers including SiC and GaN, bridging the gap between lab characterization and fab-compatible inspection.
Technically, these SiC & GaN wafer defect inspection systems combine several complementary modalities optimized for WBG materials and the six defined applications (SiC/GaN substrate, epi and devices). At the substrate and epitaxy stages, tool design is dominated by wide-field optical inspection with integrated photoluminescence (PL) and X-ray diffraction imaging/topography (XRDI/XRT). The latest PL systems illuminate SiC or GaN wafers with UV/blue lasers and capture variations in PL intensity and lifetime to map micropipes, BPDs, stacking faults and threading dislocations, while simultaneously using dark-field/bright-field scatter channels to capture surface defects such as pits, carrots and scratches—this is explicit in Candela 8520 and SICA88/108 datasheets. XRDI/XRT systems such as XRTmicron exploit diffraction contrast rather than absorption to produce full-wafer images of dislocation networks and grain boundaries, and are increasingly offered in “Near-Fab” configurations with automated wafer handling for routine SiC/GaN substrate and epi-wafer qualification. At the device stage, the same WBG wafers are inspected by a mix of patterned-wafer optical defect tools and electron-beam systems (bright-field/dark-field optical, e-beam inspection, review SEM/CD-SEM, CL-SEM) that focus on lithography, etch and metallization defects but are tuned for the thicker, high-voltage SiC/GaN device topographies; these are not always branded as “SiC/GaN-only”, but in this industry definition they are counted only when configured and deployed on SiC or GaN device lines. Complementary lab-scale methods such as optical microscopy/DIC, AFM and various failure-analysis techniques are essential for understanding defect physics and validating inline methods, but in market statistics they usually form a smaller, supporting share compared with high-throughput PL/XRT systems.
Viewed under this narrow SiC/GaN scope, the SiC & GaN Wafer Defect Inspection System market is already a sizable and fast-growing niche within semiconductor metrology. Dedicated market studies for metrology and inspection equipment serving SiC and GaN estimate a market value of roughly US$ 958 million in 2025 with a ~18.34 % CAGR out to 2031, reflecting the combined spend on PL wafer inspectors, X-ray topography tools and related WBG-focused inspection/metrology platforms. This growth rate is several times higher than the broader wafer-inspection and semiconductor-metrology equipment markets, which are typically forecast in the mid-single-digit to high-single-digit CAGR range over similar horizons. The installed base is dominated by a small group of specialists: KLA (Candela series) for SiC/GaN substrate and epi PL/surface inspection; Lasertec (SICA88/SICA108) for SiC wafer inspection and review; Onto Innovation (Celero PL and compound-semi inspection portfolio) for subsurface and crystalline-defect mapping on SiC and GaN wafers; and Rigaku (XRTmicron family) for production-oriented X-ray topography on SiC and GaN substrates. Adoption is already broad among leading SiC substrate and epi suppliers and is spreading down the value chain into power-device fabs and GaN-device manufacturers, driven by the need to screen crystal and process defects that can trigger premature breakdown, current collapse or long-term reliability issues.
Looking ahead, the segment is shaped by a tension between rapid demand growth and significant technical/economic barriers. On the demand side, the ramp of EV traction inverters and onboard chargers, renewable-energy and grid-tied inverters, industrial motor drives, data-center power supplies and 5G/RF infrastructure is pushing SiC and GaN device shipments upward, and each incremental wafer start requires tighter control of BPDs, stacking faults, threading dislocations and surface defects—directly pulling through more PL/XRT capacity and more advanced inspection algorithms. On the technology side, vendors are moving from simple 2D surface/PL maps to subsurface and quasi-3D PL inspection, as exemplified by Celero PL and high-speed PL scanners, and from lab-only X-ray topography to Near-Fab automated XRT configurations, while increasingly embedding deep-learning-based defect classification and analytics in tools like Lasertec’s SICA108. Key drivers therefore include: the steep growth of SiC/GaN power markets, stricter automotive-grade quality and reliability standards, the migration to 200 mm SiC wafers, and OEM/IDM efforts to reduce scrap and energy use in support of broader sustainability goals. Counterbalancing this, the industry faces high tool cost and cost-of-ownership, limited throughput for XRT/XRDI relative to optical PL systems, a shortage of experienced WBG-materials engineers, and the still-immature state of standardized, fab-wide flows that link detailed defect maps to yield and lifetime specifications. As a result, SiC & GaN Wafer Defect Inspection remains a strategic, high-growth but technically demanding niche, where vendors compete less on raw throughput and more on physics-based sensitivity, subsurface visibility and actionable correlations to power-device performance and reliability.
Report Scope
This report aims to provide a comprehensive presentation of the global market for SiC & GaN Wafer Defect Inspection System, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC & GaN Wafer Defect Inspection System.
The SiC & GaN Wafer Defect Inspection System market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC & GaN Wafer Defect Inspection System market comprehensively. Regional market sizes, concerning products by Technology, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC & GaN Wafer Defect Inspection System manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Technology, by Application, and by regions.
Market Segmentation
By Company
KLA Corporation
Onto Innovation
Rigaku
Angkun Vision (Beijing) Technology
Lasertec
Bruker
Visiontec Group
TASMIT, Inc. (Toray)
HORIBA (EtaMax)
Nanotronics
Olympus
CETC Fenghua Information Equipment
Nikon
Leica Microsystems
Skyverse Technology
Attolight
LAZIN CO.,LTD
Spirox Corporation
Shanghai Youruipu Semiconductor Equipment
CASI Vision Technology (Luoyang) Co., Ltd
Dalian Chuangrui Spectral Technology Co., Ltd
Shenzhen Glint Vision
T-Vision.AI (Hangzhou) Tech Co.,Ltd.
HGTECH
Segment by Technology
Optical Inspection System (Photoluminescence)
X-ray Diffraction Imaging (XRDI) System
Optical Microscopy (OM) / DIC
Atomic Force Microscopy (AFM)
Others
Segment by Application
SiC Substrate, Epitaxy and Devices
GaN Substrate, Epitaxy and Devices
Production by Region
North America
China
Japan
South Korea
China Taiwan
Singapore
Others
Consumption by Region
North America
Europe
Japan
China
China Taiwan
South Korea
Singapore
Malaysia
Others
Chapter Outline:
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Technology, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC & GaN Wafer Defect Inspection System manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC & GaN Wafer Defect Inspection System by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC & GaN Wafer Defect Inspection System in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Technology, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
North American is the largest producer of SiC & GaN Wafer Defect Inspection System, the production value is estimated to increase from $ 559.11 million in 2024 to reach $ 1726 million by 2031, at a CAGR of 17.23% during the forecast period of 2024 through 2031.
Japan is the second producer of SiC & GaN Wafer Defect Inspection System, the production value is estimated to increase from $ 128.65 million in 2024 to reach $ 414.63 million by 2031, at a CAGR of 16.75% during the forecast period of 2024 through 2031.
In past few years, China is the fastest-growing production region of SiC & GaN Wafer Defect Inspection System, the production value is estimated to increase from $ 49.51 million in 2024 to reach $ 342.55 million by 2031, at a CAGR of 28.48% during the forecast period of 2024 through 2031.
The major global manufacturers of SiC & GaN Wafer Defect Inspection System include KLA Corporation, Onto Innovation, Rigaku, Angkun Vision (Beijing) Technology, Lasertec, Bruker, Visiontec Group, TASMIT, Inc. (Toray) and HORIBA (EtaMax), etc. In 2024, the world's top ten vendors accounted for approximately 90 % of the revenue.
The SiC & GaN Wafer Defect Inspection System industry is a narrowly defined segment of semiconductor metrology that covers only wafer-level defect inspection systems dedicated to silicon carbide (SiC) and gallium nitride (GaN) wafers across three process stages: SiC substrate, SiC epitaxy and SiC devices; GaN substrate, GaN epitaxy and GaN devices. In statistical terms, this segment includes automated tools that perform full-wafer or high-coverage defect detection and mapping on 100–200 mm SiC and GaN wafers used in power, RF and optoelectronic devices, but excludes generic silicon-only inspection tools and back-end/packaging inspection. Representative systems are explicitly marketed for SiC/GaN wafer defect inspection. KLA’s Candela® 8520 is an integrated surface- and photoluminescence-inspection platform for SiC and GaN substrates and epitaxial wafers, detecting particles, scratches, cracks, stains, pits, carrots, basal-plane dislocations (BPDs), micropipes, stacking faults, grain boundaries and threading dislocations up to 200 mm diameter. Lasertec’s SICA88 and next-generation SICA108 are SiC-only wafer inspection and review systems that integrate surface scatter and PL channels in a single tool to concurrently inspect and classify surface and crystallographic defects on SiC substrates and epi wafers. Onto Innovation’s Celero™ PL system is designed specifically for subsurface and crystalline defect inspection and classification in SiC and GaN wafers, using a laser-based phase-detection PL architecture to meet growing demand from power-device and compound-semiconductor lines. On the X-ray side, Rigaku’s XRTmicron and XRTmicron Near-Fab systems provide fast, high-resolution X-ray topography for non-destructive imaging and mapping of dislocations, stacking faults, micropipes and grain boundaries in single-crystal wafers including SiC and GaN, bridging the gap between lab characterization and fab-compatible inspection.
Technically, these SiC & GaN wafer defect inspection systems combine several complementary modalities optimized for WBG materials and the six defined applications (SiC/GaN substrate, epi and devices). At the substrate and epitaxy stages, tool design is dominated by wide-field optical inspection with integrated photoluminescence (PL) and X-ray diffraction imaging/topography (XRDI/XRT). The latest PL systems illuminate SiC or GaN wafers with UV/blue lasers and capture variations in PL intensity and lifetime to map micropipes, BPDs, stacking faults and threading dislocations, while simultaneously using dark-field/bright-field scatter channels to capture surface defects such as pits, carrots and scratches—this is explicit in Candela 8520 and SICA88/108 datasheets. XRDI/XRT systems such as XRTmicron exploit diffraction contrast rather than absorption to produce full-wafer images of dislocation networks and grain boundaries, and are increasingly offered in “Near-Fab” configurations with automated wafer handling for routine SiC/GaN substrate and epi-wafer qualification. At the device stage, the same WBG wafers are inspected by a mix of patterned-wafer optical defect tools and electron-beam systems (bright-field/dark-field optical, e-beam inspection, review SEM/CD-SEM, CL-SEM) that focus on lithography, etch and metallization defects but are tuned for the thicker, high-voltage SiC/GaN device topographies; these are not always branded as “SiC/GaN-only”, but in this industry definition they are counted only when configured and deployed on SiC or GaN device lines. Complementary lab-scale methods such as optical microscopy/DIC, AFM and various failure-analysis techniques are essential for understanding defect physics and validating inline methods, but in market statistics they usually form a smaller, supporting share compared with high-throughput PL/XRT systems.
Viewed under this narrow SiC/GaN scope, the SiC & GaN Wafer Defect Inspection System market is already a sizable and fast-growing niche within semiconductor metrology. Dedicated market studies for metrology and inspection equipment serving SiC and GaN estimate a market value of roughly US$ 958 million in 2025 with a ~18.34 % CAGR out to 2031, reflecting the combined spend on PL wafer inspectors, X-ray topography tools and related WBG-focused inspection/metrology platforms. This growth rate is several times higher than the broader wafer-inspection and semiconductor-metrology equipment markets, which are typically forecast in the mid-single-digit to high-single-digit CAGR range over similar horizons. The installed base is dominated by a small group of specialists: KLA (Candela series) for SiC/GaN substrate and epi PL/surface inspection; Lasertec (SICA88/SICA108) for SiC wafer inspection and review; Onto Innovation (Celero PL and compound-semi inspection portfolio) for subsurface and crystalline-defect mapping on SiC and GaN wafers; and Rigaku (XRTmicron family) for production-oriented X-ray topography on SiC and GaN substrates. Adoption is already broad among leading SiC substrate and epi suppliers and is spreading down the value chain into power-device fabs and GaN-device manufacturers, driven by the need to screen crystal and process defects that can trigger premature breakdown, current collapse or long-term reliability issues.
Looking ahead, the segment is shaped by a tension between rapid demand growth and significant technical/economic barriers. On the demand side, the ramp of EV traction inverters and onboard chargers, renewable-energy and grid-tied inverters, industrial motor drives, data-center power supplies and 5G/RF infrastructure is pushing SiC and GaN device shipments upward, and each incremental wafer start requires tighter control of BPDs, stacking faults, threading dislocations and surface defects—directly pulling through more PL/XRT capacity and more advanced inspection algorithms. On the technology side, vendors are moving from simple 2D surface/PL maps to subsurface and quasi-3D PL inspection, as exemplified by Celero PL and high-speed PL scanners, and from lab-only X-ray topography to Near-Fab automated XRT configurations, while increasingly embedding deep-learning-based defect classification and analytics in tools like Lasertec’s SICA108. Key drivers therefore include: the steep growth of SiC/GaN power markets, stricter automotive-grade quality and reliability standards, the migration to 200 mm SiC wafers, and OEM/IDM efforts to reduce scrap and energy use in support of broader sustainability goals. Counterbalancing this, the industry faces high tool cost and cost-of-ownership, limited throughput for XRT/XRDI relative to optical PL systems, a shortage of experienced WBG-materials engineers, and the still-immature state of standardized, fab-wide flows that link detailed defect maps to yield and lifetime specifications. As a result, SiC & GaN Wafer Defect Inspection remains a strategic, high-growth but technically demanding niche, where vendors compete less on raw throughput and more on physics-based sensitivity, subsurface visibility and actionable correlations to power-device performance and reliability.
Report Scope
This report aims to provide a comprehensive presentation of the global market for SiC & GaN Wafer Defect Inspection System, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC & GaN Wafer Defect Inspection System.
The SiC & GaN Wafer Defect Inspection System market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC & GaN Wafer Defect Inspection System market comprehensively. Regional market sizes, concerning products by Technology, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC & GaN Wafer Defect Inspection System manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Technology, by Application, and by regions.
Market Segmentation
By Company
KLA Corporation
Onto Innovation
Rigaku
Angkun Vision (Beijing) Technology
Lasertec
Bruker
Visiontec Group
TASMIT, Inc. (Toray)
HORIBA (EtaMax)
Nanotronics
Olympus
CETC Fenghua Information Equipment
Nikon
Leica Microsystems
Skyverse Technology
Attolight
LAZIN CO.,LTD
Spirox Corporation
Shanghai Youruipu Semiconductor Equipment
CASI Vision Technology (Luoyang) Co., Ltd
Dalian Chuangrui Spectral Technology Co., Ltd
Shenzhen Glint Vision
T-Vision.AI (Hangzhou) Tech Co.,Ltd.
HGTECH
Segment by Technology
Optical Inspection System (Photoluminescence)
X-ray Diffraction Imaging (XRDI) System
Optical Microscopy (OM) / DIC
Atomic Force Microscopy (AFM)
Others
Segment by Application
SiC Substrate, Epitaxy and Devices
GaN Substrate, Epitaxy and Devices
Production by Region
North America
China
Japan
South Korea
China Taiwan
Singapore
Others
Consumption by Region
North America
Europe
Japan
China
China Taiwan
South Korea
Singapore
Malaysia
Others
Chapter Outline:
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Technology, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC & GaN Wafer Defect Inspection System manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC & GaN Wafer Defect Inspection System by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC & GaN Wafer Defect Inspection System in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Technology, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Table of Contents
323 Pages
- 1 Sic & Gan Wafer Defect Inspection System Market Overview
- 1.1 Product Definition
- 1.2 Sic & Gan Wafer Defect Inspection System By Technology
- 1.2.1 Global Sic & Gan Wafer Defect Inspection System Market Value Growth Rate Analysis By Technology: 2024 Vs 2031
- 1.2.2 Optical Inspection System (Photoluminescence)
- 1.2.3 X-ray Diffraction Imaging (Xrdi) System
- 1.2.3.1 X-ray Modalities Relevant To Sic & Gan Wafers
- 1.2.3.2 Applications In Sic Wafer Defect Inspection
- 1.2.3.3 Applications In Gan Wafer Defect Inspection
- 1.2.4 Phase Contrast Microscopy
- 1.2.4.1 Applications In Sic Wafer Defect Inspection
- 1.2.4.2 Applications In Gan Wafer Defect Inspection
- 1.2.5 Optical Microscopy (Om)
- 1.2.6 Atomic Force Microscopy (Afm)
- 1.2.7 Cathodoluminescence (Cl)
- 1.3 Sic & Gan Wafer Defect Inspection System By Application
- 1.3.1 Global Sic & Gan Wafer Defect Inspection System Market Value Growth Rate Analysis By Application: 2024 Vs 2031
- 1.3.2 Sic Material Defects And Their Influence On Device Performance
- 1.3.3 Substrate, Epitaxy And Devices Defect Inspection System Technology
- 1.3.4 Sic Substrate (Boule → Polished Wafer)
- 1.3.5 Sic Epitaxy
- 1.3.6 Sic Devices Manufacturing (Patterned Power Wafers)
- 1.3.7 Gan Substrate Wafer
- 1.3.8 Gan Epitaxy
- 1.3.9 Gan Devices Manufacturing
- 1.4 Sic & Gan Wafer Defect Inspection System By End User
- 1.5 Global Market Growth Prospects
- 1.5.1 Global Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 1.5.2 Global Sic & Gan Wafer Defect Inspection System Production Capacity Estimates And Forecasts (2020-2031)
- 1.5.3 Global Sic & Gan Wafer Defect Inspection System Production Estimates And Forecasts (2020-2031)
- 1.5.4 Global Sic & Gan Wafer Defect Inspection System Market Average Price Estimates And Forecasts (2020-2031)
- 1.6 Global Sic & Gan Devices Market Size
- 1.6.1 Global Sic Power Devices Market Size Forecasts (2020-2031)
- 1.6.2 Global Gan Devices Market Size Forecasts (2020-2031)
- 1.7 Assumptions And Limitations
- 2 Market Competition By Manufacturers
- 2.1 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Manufacturers (2020-2025)
- 2.2 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Manufacturers (2020-2025)
- 2.3 Global Sic & Gan Wafer Defect Inspection System Company Type And Market Share By Company Type (Tier 1, Tier 2, And Tier 3)
- 2.4 Global Sic & Gan Wafer Defect Inspection System Average Price By Manufacturers (2020-2025)
- 2.5 Global Key Manufacturers Of Sic & Gan Wafer Defect Inspection System, Manufacturing Sites & Headquarters
- 2.6 Global Key Manufacturers Of Sic & Gan Wafer Defect Inspection System, Product Type & Application
- 2.7 Global Sic & Gan Wafer Defect Inspection System Market Competitive Situation And Trends
- 2.7.1 Global Sic & Gan Wafer Defect Inspection System Market Concentration Rate
- 2.7.2 Global 3 And 5 Largest Sic & Gan Wafer Defect Inspection System Players Market Share By Revenue
- 2.8 Mergers & Acquisitions, Expansion
- 3 Sic & Gan Wafer Defect Inspection System Production By Region
- 3.1 Global Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts By Region: 2020 Vs 2024 Vs 2031
- 3.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Region (2020-2031)
- 3.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Region (2020-2025)
- 3.2.2 Global Forecasted Production Value Of Sic & Gan Wafer Defect Inspection System By Region (2026-2031)
- 3.3 Global Sic & Gan Wafer Defect Inspection System Production Estimates And Forecasts By Region: 2020 Vs 2024 Vs 2031
- 3.4 Global Sic & Gan Wafer Defect Inspection System Production By Region (2020-2031)
- 3.4.1 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Region (2020-2025)
- 3.4.2 Global Forecasted Production Of Sic & Gan Wafer Defect Inspection System By Region (2026-2031)
- 3.5 Global Sic & Gan Wafer Defect Inspection System Market Price Analysis By Region (2020-2025)
- 3.6 Global Sic & Gan Wafer Defect Inspection System Production And Value, Year-over-year Growth
- 3.6.1 North America Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 3.6.2 China Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 3.6.3 Japan Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 3.6.4 South Korea Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 3.6.5 China Taiwan Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 3.6.6 Southeast Asia Sic & Gan Wafer Defect Inspection System Production Value Estimates And Forecasts (2020-2031)
- 4 Sic & Gan Wafer Defect Inspection System Consumption By Region
- 4.1 Global Sic & Gan Wafer Defect Inspection System Consumption Estimates And Forecasts By Region: 2020 Vs 2024 Vs 2031
- 4.2 Global Sic & Gan Wafer Defect Inspection System Consumption By Region (2020-2031)
- 4.2.1 Global Sic & Gan Wafer Defect Inspection System Consumption By Region (2020-2031)
- 4.2.2 Global Sic & Gan Wafer Defect Inspection System Forecasted Consumption By Region (2026-2031)
- 4.3 North America
- 4.4 Europe
- 4.5 China
- 4.6 Japan
- 4.7 South Korea
- 4.8 China Taiwan
- 4.9 Singapore
- 4.10 Malaysia
- 5 Customized Section
- 5.1 Segmentation By Type (Optical Inspection System And X-ray Diffraction Imaging (Xrdi) System)
- 5.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2020-2031)
- 5.1.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2020-2025)
- 5.1.1.2 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2026-2031)
- 5.1.1.3 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Technology (2020-2031)
- 5.1.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2020-2031)
- 5.1.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2020-2025)
- 5.1.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2026-2031)
- 5.1.2.3 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Technology (2020-2031)
- 5.1.3 Global Sic & Gan Wafer Defect Inspection System Price By Technology (2020-2031)
- 5.2 Segmentation By Application ( Sic Substrate, Epitaxy And Devices And Gan Substrate, Epitaxy And Devices )
- 5.2.1 Global Sic & Gan Wafer Defect Inspection System Production By Application (2020-2031)
- 5.2.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Application (2020-2025)
- 5.2.1.2 Global Sic & Gan Wafer Defect Inspection System Production By Application (2026-2031)
- 5.2.1.3 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Application (2020-2031)
- 5.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2020-2031)
- 5.2.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2020-2025)
- 5.2.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2026-2031)
- 5.2.2.3 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Application (2020-2031)
- 5.2.3 Global Sic & Gan Wafer Defect Inspection System Price By Application (2020-2031)
- 5.3 Technology Segmentation (Photoluminescence, Phase Contrast Microscopy, Afm, Xrt, Etc).
- 5.3.1 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2020-2031)
- 5.3.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2020-2025)
- 5.3.1.2 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2026-2031)
- 5.3.1.3 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Technology (2020-2031)
- 5.3.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2020-2031)
- 5.3.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2020-2025)
- 5.3.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2026-2031)
- 5.3.2.3 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Technology (2020-2031)
- 5.3.3 Global Sic & Gan Wafer Defect Inspection System Price By Technology (2020-2031)
- 5.4 Application Segmentation (Substrate, Epi, Device, Sub/Surface)
- 5.4.1 Global Sic & Gan Wafer Defect Inspection System Production By Application (2020-2031)
- 5.4.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Application (2020-2025)
- 5.4.1.2 Global Sic & Gan Wafer Defect Inspection System Production By Application (2026-2031)
- 5.4.1.3 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Application (2020-2031)
- 5.4.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2020-2031)
- 5.4.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2020-2025)
- 5.4.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2026-2031)
- 5.4.2.3 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Application (2020-2031)
- 5.4.3 Global Sic & Gan Wafer Defect Inspection System Price By Application (2020-2031)
- 5.5 User Segmentation As Well: Epi-ready Wafers Manufacturers, Epi-wafers Manufacturers, Epi-only Providers, Device Manufacturers, Etc
- 6 Segment By Technology
- 6.1 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2020-2031)
- 6.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2020-2025)
- 6.1.2 Global Sic & Gan Wafer Defect Inspection System Production By Technology (2026-2031)
- 6.1.3 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Technology (2020-2031)
- 6.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2020-2031)
- 6.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2020-2025)
- 6.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Technology (2026-2031)
- 6.2.3 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Technology (2020-2031)
- 6.3 Global Sic & Gan Wafer Defect Inspection System Price By Technology (2020-2031)
- 7 Segment By Application
- 7.1 Global Sic & Gan Wafer Defect Inspection System Production By Application (2020-2031)
- 7.1.1 Global Sic & Gan Wafer Defect Inspection System Production By Application (2020-2025)
- 7.1.2 Global Sic & Gan Wafer Defect Inspection System Production By Application (2026-2031)
- 7.1.3 Global Sic & Gan Wafer Defect Inspection System Production Market Share By Application (2020-2031)
- 7.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2020-2031)
- 7.2.1 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2020-2025)
- 7.2.2 Global Sic & Gan Wafer Defect Inspection System Production Value By Application (2026-2031)
- 7.2.3 Global Sic & Gan Wafer Defect Inspection System Production Value Market Share By Application (2020-2031)
- 7.3 Global Sic & Gan Wafer Defect Inspection System Price By Application (2020-2031)
- 8 Key Companies Profiled
- 8.1 Kla Corporation
- 8.1.1 Kla Corporation Sic & Gan Wafer Defect Inspection System Company Information
- 8.1.2 Kla Corporation Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.1.3 Kla’s Sic / Gan Wafer Defect Inspection – Advantages, Weaknesses & Roadmap
- 8.1.4 Kla Corporation Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.1.5 Kla Corporation Main Business And Markets Served
- 8.1.6 Kla Corporation Recent Developments/Updates
- 8.2 Lasertec
- 8.2.1 Lasertec Sic & Gan Wafer Defect Inspection System Company Information
- 8.2.2 Lasertec Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.2.3 Lasertec Strengths, Weaknesses And Roadmap For Lasertec Wbg Wafer Inspection
- 8.2.4 Lasertec Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.2.5 Lasertec Main Business And Markets Served
- 8.2.6 Lasertec Recent Developments/Updates
- 8.3 Onto Innovation
- 8.3.1 Onto Innovation Sic & Gan Wafer Defect Inspection System Company Information
- 8.3.2 Onto Innovation Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.3.3 Onto Innovation Strengths, Weaknesses And Roadmap In Sic/Gan Defect Inspection
- 8.3.4 Onto Innovation Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.3.5 Onto Innovation Main Business And Markets Served
- 8.3.6 Onto Innovation Recent Developments/Updates
- 8.4 Visiontec Group
- 8.4.1 Visiontec Group Sic & Gan Wafer Defect Inspection System Company Information
- 8.4.2 Visiontec Group Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.4.3 Visiontec Group Strengths, Weaknesses And Roadmap
- 8.4.4 Visiontec Group Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.4.5 Visiontec Group Main Business And Markets Served
- 8.5 Nanotronics
- 8.5.1 Nanotronics Sic & Gan Wafer Defect Inspection System Company Information
- 8.5.2 Nanotronics Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.5.3 Nanotronics Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.5.4 Nanotronics Main Business And Markets Served
- 8.5.5 Nanotronics Recent Developments/Updates
- 8.6 Toray Engineering (Tasmit, Inc.)
- 8.6.1 Tasmit, Inc. Sic & Gan Wafer Defect Inspection System Company Information
- 8.6.2 Tasmit, Inc. Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.6.3 Tasmit, Inc. Strengths, Weaknesses & Roadmap In Sic/Gan Wafer Defect Inspection
- 8.6.4 Tasmit, Inc. Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.6.5 Tasmit, Inc. Main Business And Markets Served
- 8.7 Bruker
- 8.7.1 Bruker Sic & Gan Wafer Defect Inspection System Company Information
- 8.7.2 Bruker Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.7.3 Bruker Strengths, Weaknesses And Roadmap In Sic/Gan Defect Inspection
- 8.7.4 Bruker Future Development Directions (Inferred Roadmap)
- 8.7.5 Bruker Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.7.6 Bruker Main Business And Markets Served
- 8.8 Horiba (Acquired Etamax)
- 8.8.1 Horiba Sic & Gan Wafer Defect Inspection System Company Information
- 8.8.2 Horiba Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.8.3 Horiba Technical Strengths, Weaknesses & Future Direction
- 8.8.4 Horiba Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.8.5 Horiba Main Business And Markets Served
- 8.8.6 Horiba Recent Developments/Updates
- 8.9 Lazin Co.,Ltd
- 8.9.1 Lazin Co.,Ltd Sic & Gan Wafer Defect Inspection System Company Information
- 8.9.2 Lazin Co.,Ltd Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.9.3 Lazin Co.,Ltd Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.9.4 Lazin Co.,Ltd Main Business And Markets Served
- 8.10 Etamax
- 8.10.1 Etamax Sic & Gan Wafer Defect Inspection System Company Information
- 8.10.2 Etamax Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.10.3 Etamax Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.10.4 Etamax Main Business And Markets Served
- 8.11 Spirox Corporation
- 8.11.1 Spirox Corporation Sic & Gan Wafer Defect Inspection System Company Information
- 8.11.2 Spirox Corporation Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.11.3 Spirox Corporation Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.11.4 Spirox Corporation Main Business And Markets Served
- 8.11.5 Spirox Corporation Recent Developments/Updates
- 8.12 Angkun Vision (Beijing) Technology
- 8.12.1 Angkun Vision (Beijing) Technology Sic & Gan Wafer Defect Inspection System Company Information
- 8.12.2 Angkun Vision (Beijing) Technology Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.12.3 Angkun Vision (Beijing) Technology Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.12.4 Angkun Vision (Beijing) Technology Main Business And Markets Served
- 8.13 Shenzhen Glint Vision
- 8.13.1 Shenzhen Glint Vision Sic & Gan Wafer Defect Inspection System Company Information
- 8.13.2 Shenzhen Glint Vision Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.13.3 Shenzhen Glint Vision Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.13.4 Shenzhen Glint Vision Main Business And Markets Served
- 8.14 Cetc Fenghua Information Equipment
- 8.14.1 Cetc Fenghua Information Equipment Sic & Gan Wafer Defect Inspection System Company Information
- 8.14.2 Cetc Fenghua Information Equipment Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.14.3 Cetc Fenghua Information Equipment Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.14.4 Cetc Fenghua Information Equipment Main Business And Markets Served
- 8.15 Casi Vision Technology (Luoyang) Co., Ltd
- 8.15.1 Casi Vision Technology (Luoyang) Co., Ltd Sic & Gan Wafer Defect Inspection System Company Information
- 8.15.2 Casi Vision Technology (Luoyang) Co., Ltd Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.15.3 Casi Vision Technology (Luoyang) Co., Ltd Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.15.4 Casi Vision Technology (Luoyang) Co., Ltd Main Business And Markets Served
- 8.16 Shanghai Youruipu Semiconductor Equipment
- 8.16.1 Shanghai Youruipu Semiconductor Equipment Sic & Gan Wafer Defect Inspection System Company Information
- 8.16.2 Shanghai Youruipu Semiconductor Equipment Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.16.3 Shanghai Youruipu Semiconductor Equipment Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.16.4 Shanghai Youruipu Semiconductor Equipment Main Business And Markets Served
- 8.17 Timetech Spectra (Dalian Chuangrui Spectral Technology Co., Ltd)
- 8.17.1 Dalian Chuangrui Spectral Technology Co., Ltd Sic & Gan Wafer Defect Inspection System Company Information
- 8.17.2 Dalian Chuangrui Spectral Technology Co., Ltd Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.17.3 Dalian Chuangrui Spectral Technology Co., Ltd Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.17.4 Dalian Chuangrui Spectral Technology Co., Ltd Main Business And Markets Served
- 8.18 T-vision.Ai (Hangzhou) Tech Co.,Ltd.
- 8.18.1 T-vision.Ai (Hangzhou) Tech Co.,Ltd. Sic & Gan Wafer Defect Inspection System Company Information
- 8.18.2 T-vision.Ai (Hangzhou) Tech Co.,Ltd. Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.18.3 T-vision.Ai (Hangzhou) Tech Co.,Ltd. Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.18.4 T-vision.Ai (Hangzhou) Tech Co.,Ltd. Main Business And Markets Served
- 8.19 Hgtech
- 8.19.1 Hgtech Sic & Gan Wafer Defect Inspection System Company Information
- 8.19.2 Hgtech Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.19.3 Hgtech Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.19.4 Hgtech Main Business And Markets Served
- 8.20 Olympus (Evident)
- 8.20.1 Olympus Sic & Gan Wafer Defect Inspection System Company Information
- 8.20.2 Olympus Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.20.3 Olympus Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.20.4 Olympus Main Business And Markets Served
- 8.21 Nikon Instruments
- 8.21.1 Nikon Sic & Gan Wafer Defect Inspection System Company Information
- 8.21.2 Nikon Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.21.3 Nikon Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.21.4 Nikon Main Business And Markets Served
- 8.22 Leica Microsystems
- 8.22.1 Leica Microsystems Sic & Gan Wafer Defect Inspection System Company Information
- 8.22.2 Leica Microsystems Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.22.3 Leica Microsystems Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.22.4 Leica Microsystems Main Business And Markets Served
- 8.23 Rigaku
- 8.23.1 Rigaku Sic & Gan Wafer Defect Inspection System Company Information
- 8.23.2 Rigaku Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.23.3 Rigaku Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.23.4 Rigaku Main Business And Markets Served
- 8.24 Attolight
- 8.24.1 Attolight Sic & Gan Wafer Defect Inspection System Company Information
- 8.24.2 Attolight Sic & Gan Wafer Defect Inspection System Product Portfolio
- 8.24.3 Attolight Sic & Gan Wafer Defect Inspection System Production, Value, Price And Gross Margin (2020-2025)
- 8.24.4 Attolight Main Business And Markets Served
- 9 Industry Chain And Sales Channels Analysis
- 9.1 Sic & Gan Wafer Defect Inspection System Industry Chain Analysis
- 9.2 Sic & Gan Wafer Defect Inspection System Raw Material Supply Analysis
- 9.2.1 Key Raw Materials
- 9.2.2 Raw Materials Key Suppliers
- 9.3 Sic & Gan Wafer Defect Inspection System Production Mode & Process Analysis
- 9.4 Sic & Gan Wafer Defect Inspection System Sales And Marketing
- 9.5 Sic & Gan Wafer Defect Inspection System Customer Analysis
- 10 Sic & Gan Wafer Defect Inspection System Market Dynamics
- 10.1 Sic & Gan Wafer Defect Inspection System Industry Trends
- 10.2 Sic & Gan Wafer Defect Inspection System Market Drivers
- 10.3 Sic & Gan Wafer Defect Inspection System Market Challenges
- 10.4 Sic & Gan Wafer Defect Inspection System Market Restraints
- 11 Research Findings And Conclusion
- 12 Methodology And Data Source
- 12.1 Methodology/Research Approach
- 12.1.1 Research Programs/Design
- 12.1.2 Market Size Estimation
- 12.1.3 Market Breakdown And Data Triangulation
- 12.2 Data Source
- 12.2.1 Secondary Sources
- 12.2.2 Primary Sources
- 12.3 Author List
- 12.4 Disclaimer
- List Of Tables
- Table 1. Global Sic & Gan Wafer Defect Inspection System Market Value By Technology, (Us$ Million) & (2024 Vs 2031)
- Table 2. Optical Photoluminescence (Pl) Applications In Sic Wafer Defect Inspection
- Table 3. Optical Photoluminescence (Pl) Applications In Gan Wafer Defect Inspection
- Table 4. Optical Inspection System (Photoluminescence) Manufacturers
- Table 5. X-ray Modalities Relevant To Sic & Gan Wafers
- Table 6. Applications In Sic Wafer Defect Inspection
- Table 7. Applications In Gan Wafer Defect Inspection
- Table 8. Optical Microscopy (Om) Sic & Gan Wafer Inspection
- Table 9. Afm Applications In Sic Wafer Defect Inspection
- Table 10. Afm Applications In Gan Wafer Defect Inspection
- Table 11. Cl In Sic Wafer Defect Inspection
- Table 12. Cl In Gan Wafer Defect Inspection
- Table 13. Global Sic & Gan Wafer Defect Inspection System Market Value By Application, (Us$ Million) & (2024 Vs 2031)
- Table 14. Global Sic & Gan Wafer Defect Inspection System Market Value By Application, (Us$ Million) & (2024 Vs 2031)
- Table 15. Sic Material Defects And Their Influence On Device Performance
- Table 16. Sic & Gan Substrate, Epitaxy And Devices Defect Inspection System Technology
- Table 17. Sic Substrate Primary Wafer Defect Inspection System
- Table 18. Sic Epitaxy Primary Wafer Defect Inspection System
- Table 19. Sic Devices (Patterned Power Wafers) Primary Wafer Defect Inspection System
- Table 20. Gan Substrate Primary Wafer Defect Inspection System
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