Global Package Substrates Market Research Report 2025
Description
The global package substrates (IC substrates) market was valued at US$ 12.9 billion in 2024 and is anticipated to reach US$ 21.17 billion by 2031, witnessing a CAGR of 8.01% during the forecast period 2025-2031.
Currently the package substrates are mainly produced by manufactuers headquartered in Japan, South Korea, China Taiwan and China Mainland. China Taiwan is the largest producer of package substrates with global share 28.03% in 2024, followed by South Korea (27.4%), China Mainland (22%) and Japan (17.17%).
The global IC substrate (package substrate) market is structurally segmented by ABF build-up substrates (especially FC-BGA for high-pin-count, large-body packages used in server/AI CPUs, GPUs, networking ASICs), BT resin substrates (widely used in mainstream BGA/CSP for mobile/consumer and many automotive/industrial ICs), plus module/memory-oriented substrates (e.g., SiP/RF modules and memory package substrates) that emphasize high volume, tight dimensional control, and robust reliability. Supply remains highly concentrated in East Asia (Japan/Taiwan/Korea/China), while Europe has selective high-end capacity; the demand mix has been migrating toward larger, more layer-dense, tighter line/space ABF substrates driven by data center compute and heterogeneous integration. In the post-pandemic period, the industry has also shown a “split cycle”: consumer/PC-related substrate demand can correct quickly, while server/AI-oriented ABF tends to be supported by long qualification cycles and multi-year platform roadmaps. Recent capacity moves (e.g., new high-volume substrate manufacturing ramps tied to data-center processors) underscore that leading suppliers still prioritize high-end ABF investment even when parts of the broader electronics cycle soften.
The global ABF substrates market was valued at US$ 5.4 billion in 2024 and is anticipated to reach US$ 10.5 billion by 2031, witnessing a CAGR of 10.73% during the forecast period 2025-2031.
The global BT substrates market was valued at US$ 7.41 billion in 2024 and is anticipated to reach US$ 10.38 billion by 2031, witnessing a CAGR of 5.56% during the forecast period 2025-2031.
The global MIS substrates market was valued at US$ 96 million in 2024 and is anticipated to reach US$ 255 million by 2031, witnessing a CAGR of 13.62% during the forecast period 2025-2031.
The key global manufacturers of package substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, and Toppan, etc. In 2024, the world's top ten vendors accounted for approximately 77.4% of the revenue.
The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2024, the global top seven players had a share approximately 92.44% in terms of revenue.
The global key manufacturers of MIS Substrate include China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
Technology and product trends are increasingly shaped by advanced packaging. The substrate is no longer a “passive carrier” but a key enabler for chiplets, 2.5D/3D integration, and high-bandwidth memory (HBM) ecosystems, which require more routing density, better warpage control, and higher signal integrity at rising data rates. Industry roadmaps therefore push finer L/S via semi-additive processes (mSAP), improved laser via formation, tighter registration (LDI), thinner cores/coreless structures, and higher layer counts—all while maintaining yield and reliability at scale. On the materials side, suppliers are continuously upgrading dielectrics (e.g., ABF-class build-up materials) for lower loss and better thermo-mechanical stability, because substrate performance increasingly gates overall package performance and manufacturability. Meanwhile, the “next substrate curve” (e.g., glass-core substrates) is being explored to extend wiring density, dimensional stability, and power delivery for future compute packages, signaling that the substrate roadmap is entering a new materials-and-process transition rather than simple incremental scaling.
From a value-chain perspective, the upstream is dominated by dielectric/build-up materials (ABF-type films/resins), BT epoxy systems, copper foil, glass cloth/core laminates, solder masks/photoresists, plating chemicals, and specialized equipment (laser drilling, imaging/LDI, plating lines, lamination/press, AOI/inspection, reliability test). Tightness in any one of these—particularly advanced build-up dielectrics and high-end process tools—can become a bottleneck, which is why upstream material makers continue to publicize multi-year capacity and technology expansion plans aligned with AI/HPC growth expectations. Downstream, substrates flow into OSATs and IDM/foundry-adjacent advanced packaging lines, then into end markets led by server & data center, HPC/AI accelerators, networking/communication infrastructure, plus cyclical volumes from PCs, smartphones, and automotive electronics. Looking forward, the industry’s center of gravity remains in Asia, but policy and supply-chain resilience goals are catalyzing selective localization: the U.S., for example, has backed early-stage domestic manufacturing of glass substrates for advanced packaging, indicating a longer-term push to diversify critical substrate technologies geographically. Near term, demand and utilization will still be uneven by end market (AI strong; consumer more cyclical), but structurally the outlook remains favorable because substrates are increasingly the limiting factor for advanced packaging scaling—technically, economically, and in capacity build time.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates.
The Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (Thousand Square Meters) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Samsung Electro-Mechanics
Kyocera
Toppan
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Korea Circuit
FICT LIMITED
AKM Meadville
Shenzhen Hemei Jingyi Semiconductor Technology
Simmtech
HOREXS
ASE Material
PPt
MiSpak Technology
QDOS
Segment by Type
FCBGA
FCCSP
Others
Segment by Application
PCs
Server & Data Center
HPC/AI Chips
Communication
Smart Phone
Wearable and Consumer Electronics
Automotive Electronics
Others
By Material Type
ABF Substrate
BT Substrate
MIS Substrate
By Chips Type
Non-memory IC Substrate
Memory Substrate
By Region
Japan
South Korea
China Taiwan
China Mainland
Southeast Asia
Chapter Outline:
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Material Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 7: Provides the analysis of various market segments by Chips Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 12: The main points and conclusions of the report.
Currently the package substrates are mainly produced by manufactuers headquartered in Japan, South Korea, China Taiwan and China Mainland. China Taiwan is the largest producer of package substrates with global share 28.03% in 2024, followed by South Korea (27.4%), China Mainland (22%) and Japan (17.17%).
The global IC substrate (package substrate) market is structurally segmented by ABF build-up substrates (especially FC-BGA for high-pin-count, large-body packages used in server/AI CPUs, GPUs, networking ASICs), BT resin substrates (widely used in mainstream BGA/CSP for mobile/consumer and many automotive/industrial ICs), plus module/memory-oriented substrates (e.g., SiP/RF modules and memory package substrates) that emphasize high volume, tight dimensional control, and robust reliability. Supply remains highly concentrated in East Asia (Japan/Taiwan/Korea/China), while Europe has selective high-end capacity; the demand mix has been migrating toward larger, more layer-dense, tighter line/space ABF substrates driven by data center compute and heterogeneous integration. In the post-pandemic period, the industry has also shown a “split cycle”: consumer/PC-related substrate demand can correct quickly, while server/AI-oriented ABF tends to be supported by long qualification cycles and multi-year platform roadmaps. Recent capacity moves (e.g., new high-volume substrate manufacturing ramps tied to data-center processors) underscore that leading suppliers still prioritize high-end ABF investment even when parts of the broader electronics cycle soften.
The global ABF substrates market was valued at US$ 5.4 billion in 2024 and is anticipated to reach US$ 10.5 billion by 2031, witnessing a CAGR of 10.73% during the forecast period 2025-2031.
The global BT substrates market was valued at US$ 7.41 billion in 2024 and is anticipated to reach US$ 10.38 billion by 2031, witnessing a CAGR of 5.56% during the forecast period 2025-2031.
The global MIS substrates market was valued at US$ 96 million in 2024 and is anticipated to reach US$ 255 million by 2031, witnessing a CAGR of 13.62% during the forecast period 2025-2031.
The key global manufacturers of package substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, and Toppan, etc. In 2024, the world's top ten vendors accounted for approximately 77.4% of the revenue.
The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2024, the global top seven players had a share approximately 92.44% in terms of revenue.
The global key manufacturers of MIS Substrate include China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
Technology and product trends are increasingly shaped by advanced packaging. The substrate is no longer a “passive carrier” but a key enabler for chiplets, 2.5D/3D integration, and high-bandwidth memory (HBM) ecosystems, which require more routing density, better warpage control, and higher signal integrity at rising data rates. Industry roadmaps therefore push finer L/S via semi-additive processes (mSAP), improved laser via formation, tighter registration (LDI), thinner cores/coreless structures, and higher layer counts—all while maintaining yield and reliability at scale. On the materials side, suppliers are continuously upgrading dielectrics (e.g., ABF-class build-up materials) for lower loss and better thermo-mechanical stability, because substrate performance increasingly gates overall package performance and manufacturability. Meanwhile, the “next substrate curve” (e.g., glass-core substrates) is being explored to extend wiring density, dimensional stability, and power delivery for future compute packages, signaling that the substrate roadmap is entering a new materials-and-process transition rather than simple incremental scaling.
From a value-chain perspective, the upstream is dominated by dielectric/build-up materials (ABF-type films/resins), BT epoxy systems, copper foil, glass cloth/core laminates, solder masks/photoresists, plating chemicals, and specialized equipment (laser drilling, imaging/LDI, plating lines, lamination/press, AOI/inspection, reliability test). Tightness in any one of these—particularly advanced build-up dielectrics and high-end process tools—can become a bottleneck, which is why upstream material makers continue to publicize multi-year capacity and technology expansion plans aligned with AI/HPC growth expectations. Downstream, substrates flow into OSATs and IDM/foundry-adjacent advanced packaging lines, then into end markets led by server & data center, HPC/AI accelerators, networking/communication infrastructure, plus cyclical volumes from PCs, smartphones, and automotive electronics. Looking forward, the industry’s center of gravity remains in Asia, but policy and supply-chain resilience goals are catalyzing selective localization: the U.S., for example, has backed early-stage domestic manufacturing of glass substrates for advanced packaging, indicating a longer-term push to diversify critical substrate technologies geographically. Near term, demand and utilization will still be uneven by end market (AI strong; consumer more cyclical), but structurally the outlook remains favorable because substrates are increasingly the limiting factor for advanced packaging scaling—technically, economically, and in capacity build time.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates.
The Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (Thousand Square Meters) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Samsung Electro-Mechanics
Kyocera
Toppan
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Korea Circuit
FICT LIMITED
AKM Meadville
Shenzhen Hemei Jingyi Semiconductor Technology
Simmtech
HOREXS
ASE Material
PPt
MiSpak Technology
QDOS
Segment by Type
FCBGA
FCCSP
Others
Segment by Application
PCs
Server & Data Center
HPC/AI Chips
Communication
Smart Phone
Wearable and Consumer Electronics
Automotive Electronics
Others
By Material Type
ABF Substrate
BT Substrate
MIS Substrate
By Chips Type
Non-memory IC Substrate
Memory Substrate
By Region
Japan
South Korea
China Taiwan
China Mainland
Southeast Asia
Chapter Outline:
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Material Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 7: Provides the analysis of various market segments by Chips Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 12: The main points and conclusions of the report.
Table of Contents
292 Pages
- 1 Package Substrates Market Overview
- 1.1 Product Definition
- 1.2 Package Substrates By Type
- 1.2.1 Global Package Substrates Market Value Growth Rate Analysis By Type: 2024 Vs 2031
- 1.2.2 Fcbga Substrates
- 1.2.3 Fccsp Substrates
- 1.2.4 Others (Wb Csp, Wb-bga, Sip /Rf Module Substrates, Memory Substrates, Etc.)
- 1.3 Package Substrates By Material Type
- 1.3.1 Global Package Substrates Market Value Growth Rate Analysis By Material Type: 2024 Vs 2031
- 1.3.2 Abf Substrate
- 1.3.3 Bt Substrate
- 1.3.4 Mis Substrate
- 1.3.4.1 Single-layer Mis
- 1.3.4.2 Multi-layer Mis
- 1.4 Package Substrates By Chips Type
- 1.4.1 Global Package Substrates Market Value Growth Rate Analysis By Chips Type: 2024 Vs 2031
- 1.4.2 Non-memory Ic Substrate
- 1.4.3 Memory Substrate
- 1.5 Package Substrates By Application
- 1.5.1 Global Package Substrates Market Value Growth Rate Analysis By Application: 2024 Vs 2031
- 1.5.2 Pcs
- 1.5.3 Server & Data Center
- 1.5.4 Hpc/Ai Chips
- 1.5.5 Communication
- 1.5.6 Smart Phone
- 1.5.7 Wearable And Consumer Electronics
- 1.5.8 Automotive Electronics (Infotainment / Adas)
- 1.5.9 Others
- 1.6 Global Market Growth Prospects
- 1.6.1 Global Package Substrates Production Value Estimates And Forecasts (2020-2031)
- 1.6.2 Global Package Substrates Production Capacity Estimates And Forecasts (2020-2031)
- 1.6.3 Global Package Substrates Production Estimates And Forecasts (2020-2031)
- 1.6.4 Global Package Substrates Market Average Price Estimates And Forecasts (2020-2031)
- 1.7 Assumptions And Limitations
- 2 Market Competition By Manufacturers
- 2.1 Global Package Substrates Production Market Share By Manufacturers (2020-2025)
- 2.2 Global Package Substrates Production Value Market Share By Manufacturers (2020-2025)
- 2.3 Global Package Substrates Company Type And Market Share By Company Type (Tier 1, Tier 2, And Tier 3)
- 2.4 Global Package Substrates Average Price By Manufacturers (2020-2025)
- 2.5 Global Key Manufacturers Of Package Substrates, Manufacturing Sites & Headquarters
- 2.6 Global Key Manufacturers Of Package Substrates, Product Type & Application
- 2.7 Global Key Manufacturers Of Package Substrates, Date Of Enter Into This Industry
- 2.8 Global Package Substrates Market Competitive Situation And Trends
- 2.8.1 Global Package Substrates Market Concentration Rate
- 2.8.2 Global 5 And 10 Largest Package Substrates Players Market Share By Revenue
- 2.9 Mergers & Acquisitions, Expansion
- 3 Package Substrates Production By Region
- 3.1 Global Package Substrates Production Value Estimates And Forecasts By Region: 2020 Vs 2024 Vs 2031
- 3.2 Global Package Substrates Production Value By Region (2020-2031)
- 3.2.1 Global Package Substrates Production Value Market Share By Region (2020-2025)
- 3.2.2 Global Forecasted Production Value Of Package Substrates By Region (2026-2031)
- 3.3 Global Package Substrates Production Estimates And Forecasts By Region: 2020 Vs 2024 Vs 2031
- 3.4 Global Package Substrates Production By Region (2020-2031)
- 3.4.1 Global Package Substrates Production Market Share By Region (2020-2025)
- 3.4.2 Global Forecasted Production Of Package Substrates By Region (2026-2031)
- 3.5 Global Package Substrates Market Price Analysis By Region (2020-2025)
- 3.6 Global Package Substrates Production And Value, Year-over-year Growth
- 3.6.1 Japan Package Substrates Production Value Estimates And Forecasts (2020-2031)
- 3.6.2 South Korea Package Substrates Production Value Estimates And Forecasts (2020-2031)
- 3.6.3 China Taiwan Package Substrates Production Value Estimates And Forecasts (2020-2031)
- 3.6.4 China Mainland Package Substrates Production Value Estimates And Forecasts (2020-2031)
- 3.6.5 Southeast Asia Package Substrates Production Value Estimates And Forecasts (2020-2031)
- 4 Package Substrates Consumption By Region
- 4.1 Global Package Substrates Consumption Estimates And Forecasts By Region: 2020 Vs 2024 Vs 2031
- 4.2 Global Package Substrates Consumption By Region (2020-2031)
- 4.2.1 Global Package Substrates Consumption By Region (2020-2031)
- 4.2.2 Global Package Substrates Forecasted Consumption By Region (2026-2031)
- 4.3 North America
- 4.4 Europe
- 4.5 China
- 4.6 Japan
- 4.7 South Korea
- 4.8 China Taiwan
- 4.9 Southeast Asia
- 5 Segment By Type
- 5.1 Global Package Substrates Production By Type (2020-2031)
- 5.1.1 Global Package Substrates Production By Type (2020-2025)
- 5.1.2 Global Package Substrates Production By Type (2026-2031)
- 5.1.3 Global Package Substrates Production Market Share By Type (2020-2031)
- 5.2 Global Package Substrates Production Value By Type (2020-2031)
- 5.2.1 Global Package Substrates Production Value By Type (2020-2025)
- 5.2.2 Global Package Substrates Production Value By Type (2026-2031)
- 5.2.3 Global Package Substrates Production Value Market Share By Type (2020-2031)
- 5.3 Global Package Substrates Price By Type (2020-2031)
- 6 Segment By Material Type
- 6.1 Global Package Substrates Production By Material Type (2020-2031)
- 6.1.1 Global Package Substrates Production By Material Type (2020-2025)
- 6.1.2 Global Package Substrates Production By Material Type (2026-2031)
- 6.1.3 Global Package Substrates Production Market Share By Material Type (2020-2031)
- 6.2 Global Package Substrates Production Value By Material Type (2020-2031)
- 6.2.1 Global Package Substrates Production Value By Material Type (2020-2025)
- 6.2.2 Global Package Substrates Production Value By Material Type (2026-2031)
- 6.2.3 Global Package Substrates Production Value Market Share By Material Type (2020-2031)
- 6.3 Global Package Substrates Price By Material Type (2020-2031)
- 7 Segment By Chips Type
- 7.1 Global Package Substrates Production By Chips Type (2020-2031)
- 7.1.1 Global Package Substrates Production By Chips Type (2020-2025)
- 7.1.2 Global Package Substrates Production By Chips Type (2026-2031)
- 7.1.3 Global Package Substrates Production Market Share By Chips Type (2020-2031)
- 7.2 Global Package Substrates Production Value By Chips Type (2020-2031)
- 7.2.1 Global Package Substrates Production Value By Chips Type (2020-2025)
- 7.2.2 Global Package Substrates Production Value By Chips Type (2026-2031)
- 7.2.3 Global Package Substrates Production Value Market Share By Chips Type (2020-2031)
- 7.3 Global Package Substrates Price By Chips Type (2020-2031)
- 8 Segment By Application
- 8.1 Global Package Substrates Production By Application (2020-2031)
- 8.1.1 Global Package Substrates Production By Application (2020-2025)
- 8.1.2 Global Package Substrates Production By Application (2026-2031)
- 8.1.3 Global Package Substrates Production Market Share By Application (2020-2031)
- 8.2 Global Package Substrates Production Value By Application (2020-2031)
- 8.2.1 Global Package Substrates Production Value By Application (2020-2025)
- 8.2.2 Global Package Substrates Production Value By Application (2026-2031)
- 8.2.3 Global Package Substrates Production Value Market Share By Application (2020-2031)
- 8.3 Global Package Substrates Price By Application (2020-2031)
- 9 Key Companies Profiled
- 9.1 Unimicron
- 9.1.1 Unimicron Package Substrates Company Information
- 9.1.2 Unimicron Package Substrates Product Portfolio
- 9.1.3 Unimicron Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.1.4 Unimicron Main Business And Markets Served
- 9.1.5 Unimicron Recent Developments/Updates
- 9.2 Ibiden
- 9.2.1 Ibiden Package Substrates Company Information
- 9.2.2 Ibiden Package Substrates Product Portfolio
- 9.2.3 Ibiden Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.2.4 Ibiden Main Business And Markets Served
- 9.2.5 Ibiden Recent Developments/Updates
- 9.3 Nan Ya Pcb
- 9.3.1 Nan Ya Pcb Package Substrates Company Information
- 9.3.2 Nan Ya Pcb Package Substrates Product Portfolio
- 9.3.3 Nan Ya Pcb Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.3.4 Nan Ya Pcb Main Business And Markets Served
- 9.3.5 Nan Ya Pcb Recent Developments/Updates
- 9.4 Shinko Electric Industries
- 9.4.1 Shinko Electric Industries Package Substrates Company Information
- 9.4.2 Shinko Electric Industries Package Substrates Product Portfolio
- 9.4.3 Shinko Electric Industries Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.4.4 Shinko Electric Industries Main Business And Markets Served
- 9.4.5 Shinko Electric Industries Recent Developments/Updates
- 9.5 Kinsus Interconnect Technology
- 9.5.1 Kinsus Interconnect Technology Package Substrates Company Information
- 9.5.2 Kinsus Interconnect Technology Package Substrates Product Portfolio
- 9.5.3 Kinsus Interconnect Technology Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.5.4 Kinsus Interconnect Technology Main Business And Markets Served
- 9.5.5 Kinsus Interconnect Technology Recent Developments/Updates
- 9.6 At&S
- 9.6.1 At&S Package Substrates Company Information
- 9.6.2 At&S Package Substrates Product Portfolio
- 9.6.3 At&S Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.6.4 At&S Main Business And Markets Served
- 9.6.5 At&S Recent Developments/Updates
- 9.7 Samsung Electro-mechanics
- 9.7.1 Samsung Electro-mechanics Package Substrates Company Information
- 9.7.2 Samsung Electro-mechanics Package Substrates Product Portfolio
- 9.7.3 Samsung Electro-mechanics Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.7.4 Samsung Electro-mechanics Main Business And Markets Served
- 9.7.5 Samsung Electro-mechanics Recent Developments/Updates
- 9.8 Kyocera
- 9.8.1 Kyocera Package Substrates Company Information
- 9.8.2 Kyocera Package Substrates Product Portfolio
- 9.8.3 Kyocera Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.8.4 Kyocera Main Business And Markets Served
- 9.8.5 Kyocera Recent Developments/Updates
- 9.9 Toppan
- 9.9.1 Toppan Package Substrates Company Information
- 9.9.2 Toppan Package Substrates Product Portfolio
- 9.9.3 Toppan Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.9.4 Toppan Main Business And Markets Served
- 9.9.5 Toppan Recent Developments/Updates
- 9.10 Zhen Ding Technology
- 9.10.1 Zhen Ding Technology Package Substrates Company Information
- 9.10.2 Zhen Ding Technology Package Substrates Product Portfolio
- 9.10.3 Zhen Ding Technology Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.10.4 Zhen Ding Technology Main Business And Markets Served
- 9.10.5 Zhen Ding Technology Recent Developments/Updates
- 9.11 Daeduck Electronics
- 9.11.1 Daeduck Electronics Package Substrates Company Information
- 9.11.2 Daeduck Electronics Package Substrates Product Portfolio
- 9.11.3 Daeduck Electronics Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.11.4 Daeduck Electronics Main Business And Markets Served
- 9.11.5 Daeduck Electronics Recent Developments/Updates
- 9.12 Zhuhai Access Semiconductor
- 9.12.1 Zhuhai Access Semiconductor Package Substrates Company Information
- 9.12.2 Zhuhai Access Semiconductor Package Substrates Product Portfolio
- 9.12.3 Zhuhai Access Semiconductor Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.12.4 Zhuhai Access Semiconductor Main Business And Markets Served
- 9.12.5 Zhuhai Access Semiconductor Recent Developments/Updates
- 9.13 Lg Innotek
- 9.13.1 Lg Innotek Package Substrates Company Information
- 9.13.2 Lg Innotek Package Substrates Product Portfolio
- 9.13.3 Lg Innotek Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.13.4 Lg Innotek Main Business And Markets Served
- 9.13.5 Lg Innotek Recent Developments/Updates
- 9.14 Shennan Circuit (Greatech Substrates Co., Ltd. (Gts))
- 9.14.1 Shennan Circuit Package Substrates Company Information
- 9.14.2 Shennan Circuit Package Substrates Product Portfolio
- 9.14.3 Shennan Circuit Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.14.4 Shennan Circuit Main Business And Markets Served
- 9.14.5 Shennan Circuit Recent Developments/Updates
- 9.15 Shenzhen Fastprint Circuit Tech
- 9.15.1 Shenzhen Fastprint Circuit Tech Package Substrates Company Information
- 9.15.2 Shenzhen Fastprint Circuit Tech Package Substrates Product Portfolio
- 9.15.3 Shenzhen Fastprint Circuit Tech Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.15.4 Shenzhen Fastprint Circuit Tech Main Business And Markets Served
- 9.15.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
- 9.16 Korea Circuit
- 9.16.1 Korea Circuit Package Substrates Company Information
- 9.16.2 Korea Circuit Package Substrates Product Portfolio
- 9.16.3 Korea Circuit Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.16.4 Korea Circuit Main Business And Markets Served
- 9.16.5 Korea Circuit Recent Developments/Updates
- 9.17 Fict Limited
- 9.17.1 Fict Limited Package Substrates Company Information
- 9.17.2 Fict Limited Package Substrates Product Portfolio
- 9.17.3 Fict Limited Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.17.4 Fict Limited Main Business And Markets Served
- 9.17.5 Fict Limited Recent Developments/Updates
- 9.18 Akm Meadville
- 9.18.1 Akm Meadville Package Substrates Company Information
- 9.18.2 Akm Meadville Package Substrates Product Portfolio
- 9.18.3 Akm Meadville Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.18.4 Akm Meadville Main Business And Markets Served
- 9.18.5 Akm Meadville Recent Developments/Updates
- 9.19 Shenzhen Hemei Jingyi Semiconductor Technology
- 9.19.1 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Company Information
- 9.19.2 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Product Portfolio
- 9.19.3 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.19.4 Shenzhen Hemei Jingyi Semiconductor Technology Main Business And Markets Served
- 9.19.5 Shenzhen Hemei Jingyi Semiconductor Technology Recent Developments/Updates
- 9.20 Simmtech
- 9.20.1 Simmtech Package Substrates Company Information
- 9.20.2 Simmtech Package Substrates Product Portfolio
- 9.20.3 Simmtech Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.20.4 Simmtech Main Business And Markets Served
- 9.20.5 Simmtech Recent Developments/Updates
- 9.21 Horexs
- 9.21.1 Horexs Package Substrates Company Information
- 9.21.2 Horexs Package Substrates Product Portfolio
- 9.21.3 Horexs Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.21.4 Horexs Main Business And Markets Served
- 9.22 Ase Material
- 9.22.1 Ase Material Package Substrates Company Information
- 9.22.2 Ase Material Package Substrates Product Portfolio
- 9.22.3 Ase Material Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.22.4 Ase Material Main Business And Markets Served
- 9.22.5 Ase Material Recent Developments/Updates
- 9.23 Ppt
- 9.23.1 Ppt Package Substrates Company Information
- 9.23.2 Ppt Package Substrates Product Portfolio
- 9.23.3 Ppt Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.23.4 Ppt Main Business And Markets Served
- 9.24 Mispak Technology
- 9.24.1 Mispak Technology Package Substrates Company Information
- 9.24.2 Mispak Technology Package Substrates Product Portfolio
- 9.24.3 Mispak Technology Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.24.4 Mispak Technology Main Business And Markets Served
- 9.25 Qdos
- 9.25.1 Qdos Package Substrates Company Information
- 9.25.2 Qdos Package Substrates Product Portfolio
- 9.25.3 Qdos Package Substrates Production, Value, Price And Gross Margin (2020-2025)
- 9.25.4 Qdos Main Business And Markets Served
- 10 Industry Chain And Sales Channels Analysis
- 10.1 Package Substrates Industry Chain Analysis
- 10.2 Package Substrates Raw Material Supply Analysis
- 10.2.1 Key Raw Materials
- 10.2.2 Raw Materials Key Suppliers
- 10.3 Package Substrates Production Mode & Process Analysis
- 10.3.1 Abf Substrates Technology Roadmap
- 10.3.2 Bt Substrates Technology Roadmap
- 10.3.3 Mis Substrates Technology Roadmap
- 10.4 Package Substrates Sales And Marketing
- 10.5 Package Substrates Customer Analysis
- 11 Package Substrates Market Dynamics
- 11.1 Package Substrates Industry Trends
- 11.2 Package Substrates Market Drivers
- 11.3 Package Substrates Market Challenges
- 11.4 Package Substrates Market Restraints
- 12 Research Findings And Conclusion
- 13 Methodology And Data Source
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown And Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
- 13.4 Disclaimer
- List Of Tables
- Table 1. Global Package Substrates Market Value By Type, (Us$ Million) & (2024 Vs 2031)
- Table 2. Global Package Substrates Market Value By Material Type, (Us$ Million) & (2024 Vs 2031)
- Table 3. Global Package Substrates Market Value By Chips Type, (Us$ Million) & (2024 Vs 2031)
- Table 4. Global Package Substrates Market Value By Application, (Us$ Million) & (2024 Vs 2031)
- Table 5. Global Package Substrates Production By Manufacturers (2020-2025) & (Thousand Square Meters)
- Table 6. Global Package Substrates Production Market Share By Manufacturers (2020-2025)
- Table 7. Global Package Substrates Production Value By Manufacturers (2020-2025) & (Us$ Million)
- Table 8. Global Package Substrates Production Value Share By Manufacturers (2020-2025)
- Table 9. Global Company Type (Tier 1, Tier 2, And Tier 3) & (Based On The Production Value In Package Substrates As Of 2024)
- Table 10. Global Market Package Substrates Average Price By Manufacturers (Usd/Square Meter) & (2020-2025)
- Table 11. Global Key Manufacturers Of Package Substrates, Manufacturing Sites & Headquarters
- Table 12. Global Key Manufacturers Of Package Substrates, Product Type & Application
- Table 13. Global Key Manufacturers Of Package Substrates, Date Of Enter Into This Industry
- Table 14. Global Package Substrates Manufacturers Market Concentration Ratio (Cr5 And Hhi)
- Table 15. Mergers & Acquisitions, Expansion Plans
- Table 16. Global Package Substrates Production Value Growth Rate By Region: 2020 Vs 2024 Vs 2031 (Us$ Million)
- Table 17. Global Package Substrates Production Value (Us$ Million) By Region (2020-2025)
- Table 18. Global Package Substrates Production Value Market Share By Region (2020-2025)
- Table 19. Global Package Substrates Production Value (Us$ Million) Forecast By Region (2026-2031)
- Table 20. Global Package Substrates Production Value Market Share Forecast By Region (2026-2031)
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