The global market for Camera Module Assembly Adhesives was worth US$ 306.08 million in 2024 and is forecast to a readjusted size of US$ 1,138.16 million by 2031 with a CAGR of 20.20% during the forecast period 2025-2031.
North American market for Camera Module Assembly Adhesives was valued at $ 5.72 million in 2024 and will reach $ 18.61 million by 2031, at a CAGR of 17.89% during the forecast period of 2024 through 2031.
Asia-Pacific market for Camera Module Assembly Adhesives was valued at $ 298.04 million in 2024 and will reach $ 1,113.10 million by 2031, at a CAGR of 20.27% during the forecast period of 2024 through 2031.
Europe market for Camera Module Assembly Adhesives was valued at $ 2.22 million in 2024 and will reach $ 6.13 million by 2031, at a CAGR of 15.05% during the forecast period of 2025 through 2031.
The global key companies of Camera Module Assembly Adhesives include Dymax, DELO, Henkel, H.B. Fuller, NAMICS, Addison Clear Wave, ThreeBond, Ajinomoto Fine-Techno, Tex Year Industries, AVENTK, etc. In 2024, the global five largest players hold a share approximately 60.03 % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Camera Module Assembly Adhesives, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Camera Module Assembly Adhesives by region & country, by Type, and by Application.
The Camera Module Assembly Adhesives market size, estimations, and forecasts are provided in terms of sales volume (MT) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Camera Module Assembly Adhesives.
Market Segmentation
By Company
Dymax
DELO
Henkel
H.B. Fuller
NAMICS
Addison Clear Wave
ThreeBond
Ajinomoto Fine-Techno
Tex Year Industries
AVENTK
KY Chemical
Sekisui
Longain New Materials
Chemence
Panacol
Segment by Type
UV Curable Type
Non-UV Curable Type
Segment by Application
Mobile Phone
On-board Camera
Security Camera
Laptop Tablet
AIoT Intelligent Terminal
Others
By Region
North America
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