MEMS Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)
The global MEMS packaging market is projected to grow at a CAGR of 17.8% during the forecast period (2021 - 2026). Owing to the increase in global demand for smart automotive solutions, the demand for MEMS packaging market is also expected to go up. The increasing market demand for connected devices and consumer electronics is expected to drive the market for sensors. Global industrial sensor usage is soaring due to the ever-increasing applications of sensors and government regulations, which in turn is expected to drive the demand for MEMs packaging. Gaming industry's growth is also likely to influence the market.
Key HighlightsThe MEMS packaging market is moving towards consolidation format as the industry is capital intensive and major vendors in the market are banking on diverse product portfolio and product development to gain an edge and the innovation capabilities of any player are dependent on the investments into R&D. The industry's capital intensive nature poses an entry barrier to new entrants. Key players are ChipMos Technologies Inc., AAC Technologies, Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., etc. A recent development in the market -
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