Radiation Hardened Electronics Market by Component (Mixed Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Technique (RHBD, RHBP), Product Type (COTS, Custom), Application and Region - Global Forecast to 2030
Description
The global radiation hardened electronics market is anticipated to grow from USD 1.77 billion in 2025 to USD 2.30 billion by 2030, at a CAGR of 5.4% during the forecast period. The market is experiencing steady growth as intelligence, surveillance, and reconnaissance (ISR) platforms, such as satellites, drones, and defense systems, increasingly rely on radiation-tolerant processors, controllers, memory devices, and mixed-signal ICs to ensure mission-critical performance in harsh environments. Defense agencies and space organizations invest heavily in ISR capabilities to enhance situational awareness and secure communications, fueling the demand for reliable rad-hard components. However, high development costs and challenges in replicating real testing environments remain key restraints for the industry. At the same time, opportunities are emerging with the rise in global space missions and the adoption of commercial-off-the-shelf (COTS) components in satellites, while challenges such as customized requirements from high-end consumers continue to shape the competitive landscape.
“Memory segment is expected to grow at highest CAGR from 2025 to 2030”
Memory in the component segment is expected to grow at the fastest CAGR during the forecast period. A memory device is a hardware component that retains data, enabling communication or functionality. The memory products used for critical applications, such as spacecraft and nuclear weapons, need to be radiation-hardened to reduce the total ionizing dose (TID) received by the semiconductor components. Compute-intensive applications in the aerospace & space sector increasingly demand radiation-hardened memory solutions with high density and performance to handle large quantities of data obtained from various processor nodes and sensors.
“Space application is expected to record the largest market share in 2025”
Radiation-hardened electronics are specifically designed to weather the storm and ensure reliable operation across diverse space applications. From the beating heart of onboard computers managing satellites to the guidance systems steering rockets, these robust components power a remarkable range of tasks. They handle communication, fuel efficiency, scientific data collection, and complex robotic maneuvers on distant planetary surfaces. In addition, they are essential for navigation systems in spacecraft, monitoring payload performance, and ensuring mission continuity during exposure to cosmic radiation. With the rapid increase in satellite constellations, crewed missions, and deep-space exploration programs, radiation-hardened electronics are becoming indispensable for commercial and government space initiatives.
“North America is likely to register largest share of radiation hardened electronics market in 2030”
North America accounted for the largest share of the radiation hardened electronics market in 2030. Factors such as continuous technological advancements in this field, the presence of various government-owned space organizations, and a majority of the key market players in the region are driving the growth potential for radiation-hardened electronics in the region. The US government is continuously working on capabilities in manufacturing radiation hardened electronics. In addition, strong defense budgets, rising investments in satellite constellations, and collaborations between government agencies, such as NASA, and private aerospace companies, including SpaceX and Northrop Grumman, boost the adoption. The region also benefits from a well-established semiconductor ecosystem, extensive R&D infrastructure, and robust demand for next-generation ISR and missile defense systems.
Extensive primary interviews were conducted with key industry experts in the radiation hardened electronics market space to determine and verify the market size for various segments and subsegments gathered through secondary research. The breakdown of primary participants for the report is shown below.
The study contains insights from various industry experts, from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
The three tiers of companies are based on their total revenues as of 2024: Tier : >USD 1 billion, Tier 2: USD 500 million to 1 billion, and Tier 3:
The study includes an in-depth competitive analysis of these key players in the radiation hardened electronics market, with their company profiles, recent developments, and key market strategies.
Research Coverage:
The report describes detailed information regarding the key factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the radiation hardened electronics market. It also includes information like technology trends, trade data, and patent analysis. This research report categorizes the radiation hardened electronics market based on components, manufacturing techniques, product type, and region. A detailed analysis of the major industry players was carried out to provide insights into their business overviews, products offered, major strategies adopted that include new product launches, deals (acquisitions, partnerships, agreements, and contracts), and others (expansions), and AI/Gen AI impact on the radiation hardened electronics market.
Key Benefits of Buying the Report:
“Memory segment is expected to grow at highest CAGR from 2025 to 2030”
Memory in the component segment is expected to grow at the fastest CAGR during the forecast period. A memory device is a hardware component that retains data, enabling communication or functionality. The memory products used for critical applications, such as spacecraft and nuclear weapons, need to be radiation-hardened to reduce the total ionizing dose (TID) received by the semiconductor components. Compute-intensive applications in the aerospace & space sector increasingly demand radiation-hardened memory solutions with high density and performance to handle large quantities of data obtained from various processor nodes and sensors.
“Space application is expected to record the largest market share in 2025”
Radiation-hardened electronics are specifically designed to weather the storm and ensure reliable operation across diverse space applications. From the beating heart of onboard computers managing satellites to the guidance systems steering rockets, these robust components power a remarkable range of tasks. They handle communication, fuel efficiency, scientific data collection, and complex robotic maneuvers on distant planetary surfaces. In addition, they are essential for navigation systems in spacecraft, monitoring payload performance, and ensuring mission continuity during exposure to cosmic radiation. With the rapid increase in satellite constellations, crewed missions, and deep-space exploration programs, radiation-hardened electronics are becoming indispensable for commercial and government space initiatives.
“North America is likely to register largest share of radiation hardened electronics market in 2030”
North America accounted for the largest share of the radiation hardened electronics market in 2030. Factors such as continuous technological advancements in this field, the presence of various government-owned space organizations, and a majority of the key market players in the region are driving the growth potential for radiation-hardened electronics in the region. The US government is continuously working on capabilities in manufacturing radiation hardened electronics. In addition, strong defense budgets, rising investments in satellite constellations, and collaborations between government agencies, such as NASA, and private aerospace companies, including SpaceX and Northrop Grumman, boost the adoption. The region also benefits from a well-established semiconductor ecosystem, extensive R&D infrastructure, and robust demand for next-generation ISR and missile defense systems.
Extensive primary interviews were conducted with key industry experts in the radiation hardened electronics market space to determine and verify the market size for various segments and subsegments gathered through secondary research. The breakdown of primary participants for the report is shown below.
The study contains insights from various industry experts, from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
- By Company Type: Tier 1 – 20%, Tier 2 – 25%, and Tier 3 – 55%
- By Designation: C-level Executives – 30%, Directors – 30%, and Others – 40%
- By Region: Asia Pacific – 30%, Europe – 20%, North America – 40%, and RoW – 10%
The three tiers of companies are based on their total revenues as of 2024: Tier : >USD 1 billion, Tier 2: USD 500 million to 1 billion, and Tier 3:
The study includes an in-depth competitive analysis of these key players in the radiation hardened electronics market, with their company profiles, recent developments, and key market strategies.
Research Coverage:
The report describes detailed information regarding the key factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the radiation hardened electronics market. It also includes information like technology trends, trade data, and patent analysis. This research report categorizes the radiation hardened electronics market based on components, manufacturing techniques, product type, and region. A detailed analysis of the major industry players was carried out to provide insights into their business overviews, products offered, major strategies adopted that include new product launches, deals (acquisitions, partnerships, agreements, and contracts), and others (expansions), and AI/Gen AI impact on the radiation hardened electronics market.
Key Benefits of Buying the Report:
- Analysis of key drivers (Increasing use of radiation-hardened electronics in space applications), restraints (Issues in creating real testing environment), opportunities (Favorable government initiatives and increasing space missions), and challenges (Customization required for high-end consumers)
- Product development /Innovation: Detailed insights on growing technologies, research and development activities, and new product and service launches in the radiation hardened electronics market
- Market Development: Comprehensive information about adjacent markets; the report analyses the radiation hardened electronics market across various geographies
- Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the radiation hardened electronics market
- Competitive Assessment: In-depth assessment of market share, growth strategies, and services, offering of leading players, such as Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), and STMicroelectronics (Switzerland), in the radiation hardened electronics market
Table of Contents
286 Pages
- 1 Introduction
- 1.1 Study Objectives
- 1.2 Market Definition
- 1.2.1 Markets Covered And Regional Scope
- 1.2.2 Years Considered
- 1.2.3 Inclusions And Exclusions
- 1.3 Currency Considered
- 1.4 Unit Considered
- 1.5 Stakeholders
- 1.6 Limitations
- 1.7 Summary Of Changes
- 2 Research Methodology
- 2.1 Research Data
- 2.1.1 Secondary And Primary Research
- 2.1.2 Secondary Data
- 2.1.2.1 List Of Key Secondary Sources
- 2.1.2.2 Key Data From Secondary Sources
- 2.1.3 Primary Data
- 2.1.3.1 List Of Primary Interview Participants
- 2.1.3.2 Key Industry Insights
- 2.1.3.3 Breakdown Of Primaries
- 2.1.3.4 Key Data From Primary Sources
- 2.2 Market Size Estimation
- 2.2.1 Bottom-up Approach
- 2.2.1.1 Approach To Arrive At Market Size Using Bottom-up Analysis
- (Demand Side)
- 2.2.2 Top-down Approach
- 2.2.2.1 Approach To Arrive At Market Size Using Top-down Analysis
- (Supply Side)
- 2.3 Market Breakdown And Data Triangulation
- 2.4 Research Assumptions
- 2.5 Research Limitations
- 2.6 Risk Analysis
- 3 Executive Summary
- 4 Premium Insights
- 4.1 Attractive Opportunities For Players In Radiation Hardened Electronics Market
- 4.2 Radiation Hardened Electronics Market, By Product Type
- 4.3 Radiation Hardened Electronics Market, By Manufacturing Technique
- 4.4 Radiation Hardened Electronics Market, By Component
- 4.5 Radiation Hardened Electronics Market, By Geography
- 5 Market Overview
- 5.1 Introduction
- 5.2 Market Dynamics
- 5.2.1 Drivers
- 5.2.1.1 Rising Intelligence, Surveillance, And Reconnaissance (Isr) Activities
- 5.2.1.2 Mounting Demand For Bandwidth, Data Processing, And Memory Components
- 5.2.1.3 Growing Emphasis On Affordable Satellite Communication
- 5.2.1.4 Increasing Power Generation From Nuclear Energy
- 5.2.2 Restraints
- 5.2.2.1 Issues In Creating Testing Environments
- 5.2.2.2 High Costs Associated With Developing Radiation-hardened Products
- 5.2.3 Opportunities
- 5.2.3.1 Increasing Global Space Missions
- 5.2.3.2 Rising Demand For Reconfigurable Radiation-hardened Electronics
- 5.2.3.3 Increasing Use Of Commercial-off-the-shelf Components In Space Satellites
- 5.2.4 Challenges
- 5.2.4.1 Customization Requirements From High-end Consumers
- 5.3 Trends/Disruptions Impacting Customer Business
- 5.4 Pricing Analysis
- 5.4.1 Average Selling Price Of Power Management Products Offered
- By Key Players, By Component Type, 2024
- 5.4.2 Average Selling Price Of A/D & D/A Converters, By Key Player, 2024
- 5.4.3 Average Selling Price Of Processors & Controllers, By Key Player, 2024
- 5.4.4 Average Selling Price Of Memory Products, By Key Player, 2024
- 5.5 Value Chain Analysis
- 5.6 Ecosystem Analysis
- 5.7 Investment And Funding Scenario
- 5.8 Technology Analysis
- 5.8.1 Key Technologies
- 5.8.1.1 Radiation-hardened Semiconductors
- 5.8.1.2 Rad-hard Design Techniques
- 5.8.1.3 Rad-hard Packaging
- 5.8.2 Complementary Technologies
- 5.8.2.1 Radiation Testing And Simulation Tools
- 5.8.2.2 Thermal Management Solutions
- 5.8.3 Adjacent Technologies
- 5.8.3.1 Satellite And Space Systems
- 5.8.3.2 Defense Electronics And Avionics
- 5.8.3.3 Quantum And Cryogenic Electronics
- 5.9 Porter’s Five Forces Analysis
- 5.9.1 Intensity Of Competitive Rivalry
- 5.9.2 Bargaining Power Of Suppliers
- 5.9.3 Bargaining Power Of Buyers
- 5.9.4 Threat Of Substitutes
- 5.9.5 Threat Of New Entrants
- 5.10 Key Stakeholders And Buying Criteria
- 5.10.1 Key Stakeholders In Buying Process
- 5.10.2 Buying Criteria
- 5.11 Case Study Analysis
- 5.11.1 Us Dod Invests In Skywater Technology To Advance Radiation-hardened Technology To 90 Mm Process Hardening Technique
- 5.11.2 Aac Microtec And Tohoku University Integrate 4mbit
- Mram Device For Satellites
- 5.11.3 Army Contracting Command Invests In Bae Systems To Expedite Development Of Rhbd Microelectronics
- 5.11.4 Nasa And Air Force Research Laboratory Chose Vorago To Participate In Radiation-hardened Electronic Memory Experiment
- 5.11.5 Mercury Systems, Inc. Develops 3u Trrust-stor Vpx Rt For Two Prominent Suppliers Of Low Earth Orbit Satellites
- 5.12 Trade Analysis
- 5.12.1 Import Scenario (Hs Code 8541)
- 5.12.2 Export Scenario (Hs Code 8541)
- 5.13 Patent Analysis
- 5.14 Key Conferences And Events, 2025–2026
- 5.15 Regulatory Landscape
- 5.15.1 Regulatory Bodies, Government Agencies, And Other Organizations
- 5.15.2 Standards And Regulations
- 5.16 Impact Of Ai On Radiation Hardened Electronics Market
- 5.16.1 Introduction
- 5.16.2 Top Use Cases And Market Potential
- 5.17 Impact Of 2025 Us Tariff On Radiation Hardened Electronics Market
- 5.17.1 Introduction
- 5.17.2 Key Tariff Rates
- 5.17.3 Price Impact Analysis
- 5.17.4 Impact On Countries/Regions
- 5.17.4.1 Us
- 5.17.4.2 Europe
- 5.17.4.3 Asia Pacific
- 5.17.5 Impact On Applications
- 6 Radiation Hardened Electronic Materials And Packaging Types
- 6.1 Introduction
- 6.2 Materials
- 6.2.1 Silicon
- 6.2.2 Silicon Carbide (Sic)
- 6.2.3 Gallium Nitride (Gan)
- 6.2.4 Gallium Arsenide (Gaas)
- 6.3 Packaging Types
- 6.3.1 Flip-chip
- 6.3.2 Ceramic Packages
- 7 Radiation Hardened Electronics Market, By Component
- 7.1 Introduction
- 7.2 Mixed-signal Ics
- 7.2.1 A/D & D/A Converters
- 7.2.1.1 Increasing Usage In Space Applications To Bolster Segmental Growth
- 7.2.2 Multiplexers & Resistors
- 7.2.2.1 Rising Need For Data Acquisition Systems In Space Flights To Augment Segmental Growth
- 7.3 Processors & Controllers
- 7.3.1 Mpu
- 7.3.1.1 Mounting Development Of Multicore Processors For Space & Defense Applications To Fuel Segmental Growth
- 7.3.2 Mcu
- 7.3.2.1 Widespread Use In Spacecraft Subsystems To Accelerate Segmental Growth
- 7.3.3 Asic
- 7.3.3.1 Ability To Address Highly Customized Design Requirements To Contribute To Segmental Growth
- 7.3.4 Fpga
- 7.3.4.1 Use To Eliminate Costs Related To Electronic Re-designing Or Manual Updating To Boost Segmental Growth
- 7.4 Memory
- 7.4.1 Volatile
- 7.4.1.1 Dram
- 7.4.1.1.1 Low Retention Time And Increased Bandwidth To Augment Segmental Growth
- 7.4.1.2 Sram
- 7.4.1.2.1 High Adoption In Image Processing Applications In Satellites To Fuel Segmental Growth
- 7.4.2 Non-volatile
- 7.4.2.1 Mram
- 7.4.2.1.1 Ability To Withstand Effects Of Radiation And Ionizing Radiation In Space To Bolster Segmental Growth
- 7.4.2.2 Flash
- 7.4.2.2.1 Use To Withstand Extreme Radiation To Contribute To Segmental Growth
- 7.4.2.3 Other Memory Components
- 7.5 Power Management
- 7.5.1 Mosfets
- 7.5.1.1 Increasing Adoption In Outer Space Applications To Foster Segmental Growth
- 7.5.2 Diodes
- 7.5.2.1 High Voltage And Improved Electrical Radiation Performance To Fuel Segmental Growth
- 7.5.3 Thyristors
- 7.5.3.1 Adoption In Electronic Converters For Aerospace Power Systems To Drive Market
- 7.5.4 Igbts
- 7.5.4.1 High Current Density And Low Power Dissipation Attributes To Accelerate Segmental Growth
- 7.6 Other Components (Qualitative)
- 8 Radiation Hardened Electronics Market,
- By Manufacturing Technique
- 8.1 Introduction
- 8.2 Radiation Hardened By Design (Rhbd)
- 8.2.1 Ability To Improve Reliability Of Electronic Components In Extreme Environments To Foster Segmental Growth
- 8.2.2 Total Ionizing Dose (Tid)
- 8.2.3 Single Event Effect (See)
- 8.3 Radiation Hardened By Process (Rhbp)
- 8.3.1 Less Sensitivity To Degrading Effects Caused By Radiation To Boost Segmental Growth
- 8.3.2 Silicon On Insulator (Soi)
- 8.3.3 Silicon On Sapphire (Sos)
- 8.4 Radiation Hardened By Software (Rhbs) (Qualitative)
- 9 Radiation Hardened Electronics Market, By Product Type
- 9.1 Introduction
- 9.2 Commercial-off-the-shelf
- 9.2.1 Increasing Adoption In Commercial And Military Satellites Due To Low-cost Benefits To Drive Market
- 9.3 Custom-made
- 9.3.1 High Preference In Defense Mission-critical Applications To Expedite Segmental Growth
- 10 Radiation Hardened Electronics Market, By Application
- 10.1 Introduction
- 10.2 Space (Satellites)
- 10.2.1 Commercial
- 10.2.1.1 Widespread Use Of Global Positioning Systems And Navigation Systems To Contribute To Segmental Growth
- 10.2.1.2 Small Satellites
- 10.2.1.3 New Space
- 10.2.1.4 Nanosatellites
- 10.2.2 Military
- 10.2.2.1 Requirement For High-quality Components That Withstand High Levels Of Radiation To Foster Segmental Growth
- 10.3 Aerospace & Defense
- 10.3.1 Weapons & Missiles
- 10.3.1.1 Deployment Of Reliable Electronic Components In Defense Applications To Accelerate Segmental Growth
- 10.3.2 Vehicles/Avionics
- 10.3.2.1 Focus On Withstanding Extreme Radiation And Temperature To Contribute To Segmental Growth
- 10.4 Nuclear Power Plants
- 10.4.1 Emphasis On Increasing Power Generation To Augment Segmental Growth
- 10.5 Medical
- 10.5.1 Implantable Medical Devices
- 10.5.1.1 Rapid Technological Advances To Accelerate Segmental Growth
- 10.5.2 Radiology
- 10.5.2.1 Reliance Of Imaging Techniques On Ionizing Radiation To Fuel Segmental Growth
- 10.6 Other Applications
- 11 Radiation Hardened Electronics Market, By Region
- 11.1 Introduction
- 11.2 North America
- 11.2.1 Macroeconomic Outlook For North America
- 11.2.2 Us
- 11.2.2.1 Increasing Space Missions Supported By Government And Private Agencies To Drive Market
- 11.2.3 Canada
- 11.2.3.1 Government Initiatives Related To Space Exploration To Foster Market Growth
- 11.2.4 Mexico
- 11.2.4.1 Expanding Economy And Commercial Space Satellite Business To Augment Segmental Growth
- 11.3 Europe
- 11.3.1 Macroeconomic Outlook For Europe
- 11.3.2 Uk
- 11.3.2.1 Increasing Government Initiatives To Support Space Sector To Fuel Market Growth
- 11.3.3 Germany
- 11.3.3.1 Proliferation Of National Space Programs To Boost Demand For Radiation-hardened Electronics
- 11.3.4 France
- 11.3.4.1 Rising Partnerships In Space Industry To Contribute To Market Growth
- 11.3.5 Rest Of Europe
- 11.4 Asia Pacific
- 11.4.1 Macroeconomic Outlook For Asia Pacific
- 11.4.2 China
- 11.4.2.1 Increasing Investment In Military Operations And Technologies To Accelerate Market Growth
- 11.4.3 India
- 11.4.3.1 Growing Focus On Earth Observation, Communication, And Navigation Satellites To Drive Market
- 11.4.4 Japan
- 11.4.4.1 Rise In Funding For Space Programs To Contribute To Market Growth
- 11.4.5 South Korea
- 11.4.5.1 Increasing Production Of Rockets To Augment Market Growth
- 11.4.6 Rest Of Asia Pacific
- 11.5 Row
- 11.5.1 Middle East
- 11.5.1.1 Saudi Arabia
- 11.5.1.1.1 Ambitious Space And Defense Initiatives To Contribute To Market Growth
- 11.5.1.2 Uae
- 11.5.1.2.1 Expanding Space Program And Strong Focus On Defense Modernization To Drive Market
- 11.5.1.3 Rest Of Middle East
- 11.5.2 South America
- 11.5.2.1 Growing Support From Foreign Space Agencies To Fuel Market Growth
- 11.5.3 Africa
- 11.5.3.1 Increasing Investment In Satellite Programs To Accelerate Market Growth
- 12 Competitive Landscape
- 12.1 Overview
- 12.2 Key Player Strategies/Right To Win, 2019–2025
- 12.3 Revenue Analysis, 2021–2024
- 12.4 Market Share Analysis, 2024
- 12.5 Company Valuation And Financial Metrics
- 12.6 Brand Comparison
- 12.7 Company Evaluation Matrix: Key Players, 2024
- 12.7.1 Stars
- 12.7.2 Emerging Leaders
- 12.7.3 Pervasive Players
- 12.7.4 Participants
- 12.7.5 Company Footprint: Key Players, 2024
- 12.7.5.1 Company Footprint
- 12.7.5.2 Region Footprint
- 12.7.5.3 Component Footprint
- 12.7.5.4 Manufacturing Technique Footprint
- 12.7.5.5 Product Type Footprint
- 12.7.5.6 Application Footprint
- 12.8 Company Evaluation Matrix: Startups/Smes, 2024
- 12.8.1 Progressive Companies
- 12.8.2 Responsive Companies
- 12.8.3 Dynamic Companies
- 12.8.4 Starting Blocks
- 12.8.5 Competitive Benchmarking: Startups/Smes, 2024
- 12.8.5.1 Detailed List Of Key Startups/Smes
- 12.8.5.2 Competitive Benchmarking Of Key Startups/Smes
- 12.9 Competitive Scenario
- 12.9.1 Product Launches
- 12.9.2 Deals
- 12.9.3 Expansions
- 13 Company Profiles
- 13.1 Key Players
- 13.1.1 Microchip Technology Inc.
- 13.1.1.1 Business Overview
- 13.1.1.2 Products/Solutions/Services Offered
- 13.1.1.3 Recent Developments
- 13.1.1.3.1 Product Launches
- 13.1.1.3.2 Deals
- 13.1.1.3.3 Expansions
- 13.1.1.4 Mnm View
- 13.1.1.4.1 Key Strengths/Right To Win
- 13.1.1.4.2 Strategic Choices
- 13.1.1.4.3 Weaknesses/Competitive Threats
- 13.1.2 Bae Systems
- 13.1.2.1 Business Overview
- 13.1.2.2 Products/Solutions/Services Offered
- 13.1.2.3 Recent Developments
- 13.1.2.3.1 Product Launches
- 13.1.2.3.2 Other Developments
- 13.1.2.4 Mnm View
- 13.1.2.4.1 Key Strengths/Right To Win
- 13.1.2.4.2 Strategic Choices
- 13.1.2.4.3 Weaknesses/Competitive Threats
- 13.1.3 Renesas Electronics Corporation
- 13.1.3.1 Business Overview
- 13.1.3.2 Products/Solutions/Services Offered
- 13.1.3.3 Recent Developments
- 13.1.3.3.1 Product Launches
- 13.1.3.3.2 Deals
- 13.1.3.3.3 Other Developments
- 13.1.3.4 Mnm View
- 13.1.3.4.1 Key Strengths/Right To Win
- 13.1.3.4.2 Strategic Choices
- 13.1.3.4.3 Weaknesses/Competitive Threats
- 13.1.4 Infineon Technologies Ag
- 13.1.4.1 Business Overview
- 13.1.4.2 Products/Solutions/Services Offered
- 13.1.4.3 Recent Developments
- 13.1.4.3.1 Product Launches
- 13.1.4.3.2 Deals
- 13.1.4.3.3 Other Developments
- 13.1.4.4 Mnm View
- 13.1.4.4.1 Key Strengths/Right To Win
- 13.1.4.4.2 Strategic Choices
- 13.1.4.4.3 Weaknesses/Competitive Threats
- 13.1.5 Stmicroelectronics
- 13.1.5.1 Business Overview
- 13.1.5.2 Products/Solutions/Services Offered
- 13.1.5.3 Recent Developments
- 13.1.5.3.1 Product Launches
- 13.1.5.3.2 Deals
- 13.1.5.4 Mnm View
- 13.1.5.4.1 Key Strengths/Right To Win
- 13.1.5.4.2 Strategic Choices
- 13.1.5.4.3 Weaknesses/Competitive Threats
- 13.1.6 Advanced Micro Devices, Inc.
- 13.1.6.1 Business Overview
- 13.1.6.2 Products/Solutions/Services Offered
- 13.1.6.3 Recent Developments
- 13.1.6.3.1 Product Launches
- 13.1.6.3.2 Deals
- 13.1.7 Texas Instruments Incorporated
- 13.1.7.1 Business Overview
- 13.1.7.2 Products/Solutions/Services Offered
- 13.1.7.3 Recent Developments
- 13.1.7.3.1 Product Launches
- 13.1.7.3.2 Deals
- 13.1.7.3.3 Other Developments
- 13.1.8 Honeywell International Inc.
- 13.1.8.1 Business Overview
- 13.1.8.2 Products/Solutions/Services Offered
- 13.1.8.3 Recent Developments
- 13.1.8.3.1 Product Launches
- 13.1.8.3.2 Deals
- 13.1.8.3.3 Other Developments
- 13.1.9 Teledyne Technologies Incorporated
- 13.1.9.1 Business Overview
- 13.1.9.2 Products/Solutions/Services Offered
- 13.1.9.3 Recent Developments
- 13.1.9.3.1 Product Launches
- 13.1.9.3.2 Deals
- 13.1.9.3.3 Other Developments
- 13.1.10 Ttm Technologies Inc.
- 13.1.10.1 Business Overview
- 13.1.10.2 Products/Solutions/Services Offered
- 13.1.10.3 Recent Developments
- 13.1.10.3.1 Product Launches
- 13.1.10.3.2 Expansions
- 13.2 Other Players
- 13.2.1 Thales
- 13.2.2 Analog Devices, Inc.
- 13.2.3 Data Device Corporation
- 13.2.4 3d Plus
- 13.2.5 Mercury Systems, Inc.
- 13.2.6 Pcb Piezotronics, Inc.
- 13.2.7 Vorago Technologies
- 13.2.8 Gsi Technology, Inc.
- 13.2.9 Everspin Technologies Inc
- 13.2.10 Semiconductor Components Industries, Llc
- 13.2.11 Aitech
- 13.2.12 Microelectronics Research Development Corporation
- 13.2.13 Triad Semiconductor
- 13.2.14 Zero Error Systems
- 13.2.15 Resilient Computing
- 14 Appendix
- 14.1 Discussion Guide
- 14.2 Knowledgestore: Marketsandmarkets’ Subscription Portal
- 14.3 Customization Options
- 14.4 Related Reports
- 14.5 Author Details
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