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Global Semiconductor Capital Equipment Market 2024-2028

Publisher TechNavio
Published Aug 02, 2024
Length 154 Pages
SKU # INF19175773

Description

Global Semiconductor Capital Equipment Market 2024-2028


The semiconductor capital equipment market is forecasted to grow by USD 14526.2 mn during 2023-2028, accelerating at a CAGR of 4.5% during the forecast period. The report on the semiconductor capital equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising number of semiconductors fabs, surge in global demand for consumer electronics and smart electronic devices, and miniaturization of electronic devices.

Technavio's semiconductor capital equipment market is segmented as below:

By Type
  • Wafer-level manufacturing equipment
  • Packaging and assembly equipment
  • Automated test equipment
By Geographical Landscape
  • APAC
  • North America
  • Europe
  • South America
  • Middle East and Africa
This study identifies the advances in wafer size as one of the prime reasons driving the semiconductor capital equipment market growth during the next few years. Also, growing demand for 14-nm/16-nm finfet technology and increased need for semiconductor memory devices will lead to sizable demand in the market.

The report on the semiconductor capital equipment market covers the following areas:
  • Semiconductor capital equipment market sizing
  • Semiconductor capital equipment market forecast
  • Semiconductor capital equipment market industry analysis
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor capital equipment market vendors that include Advanced Micro Fabrication Equipment Inc, Advantest Corp., Applied Materials Inc., ASM International NV, ASML, Hitachi Ltd., II VI Inc., KLA Corp., Kulicke and Soffa Industries Inc., Lam Research Corp., Nikon Corp., Onto Innovation Inc., Planar Systems Inc., Screen Holdings Co. Ltd, Teradyne Inc., Tokyo Electron Ltd., Tokyo Seimitsu Co. Ltd., Veeco Instruments Inc., Vicky Electrical Contractors India Pvt. Ltd., and Voltabox AG. Also, the semiconductor capital equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

154 Pages
    • Market overview
    • Market ecosystem
    • Market characteristics
    • Value chain analysis
    • Market definition
    • Market segment analysis
    • Market size 2023
    • Market outlook: Forecast for 2023-2028
    • Global Semiconductor Capital Equipment Market 2018 - 2022
    • Type segment analysis 2018 - 2022
    • Geography segment analysis 2018 - 2022
    • Country segment analysis 2018 - 2022
    • Five forces summary
    • Bargaining power of buyers
    • Bargaining power of suppliers
    • Threat of new entrants
    • Threat of substitutes
    • Threat of rivalry
    • Market condition
    • Market segments
    • Comparison by Type
    • Wafer-level manufacturing equipment - Market size and forecast 2023-2028
    • Packaging and assembly equipment - Market size and forecast 2023-2028
    • Automated test equipment - Market size and forecast 2023-2028
    • Market opportunity by Type
    • Customer landscape overview
    • Geographic segmentation
    • Geographic comparison
    • APAC - Market size and forecast 2023-2028
    • North America - Market size and forecast 2023-2028
    • Europe - Market size and forecast 2023-2028
    • South America - Market size and forecast 2023-2028
    • Middle East and Africa - Market size and forecast 2023-2028
    • South Korea - Market size and forecast 2023-2028
    • Taiwan - Market size and forecast 2023-2028
    • China - Market size and forecast 2023-2028
    • Japan - Market size and forecast 2023-2028
    • US - Market size and forecast 2023-2028
    • Market opportunity by geography
    • Market drivers
    • Market challenges
    • Impact of drivers and challenges
    • Market opportunities/restraints
    • Overview
    • Competitive Landscape
    • Landscape disruption
    • Industry risks
    • Companies profiled
    • Market positioning of companies
    • Advantest Corp.
    • Applied Materials Inc.
    • ASM International NV
    • ASML
    • Hitachi Ltd.
    • KLA Corp.
    • Nikon Corp.
    • Onto Innovation Inc.
    • Teradyne Inc.
    • Tokyo Electron Ltd.
    • Scope of the report
    • Inclusions and exclusions checklist
    • Currency conversion rates for US$
    • Research methodology
    • Data procurement
    • Data validation
    • Validation techniques employed for market sizing
    • Data synthesis
    • 360 degree market analysis
    • List of abbreviations
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