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Worldwide Outsourced Semiconductor Assembly and Test Manufacturing Market Share, 2022 - Vendor Ranking and Insight

Publisher IDC
Published Sep 27, 2023
Length 22 Pages
SKU # IDC18202335

Description

Worldwide Outsourced Semiconductor Assembly and Test Manufacturing Market Share, 2022 ─ Vendor Ranking and Insight


This IDC study explores the revenue performance, technological evolution, and business development of worldwide OSAT vendors in 2022, and explore future development trends."OSAT is at the core of the downstreamportion of the semiconductor industry chain and is critical to the final quality and performance of chips. With the development of HPC, AI, and ML, advanced packaging will tend to experience heterogeneous integration from 2D to 2.5D/3D. It is expected that manufacturers will increase their investment to meet the huge market demand," says Galen Zeng, senior research manager at IDC.

Please Note: Extended description available upon request.

Table of Contents

22 Pages
IDC Market Share Figure
Executive Summary
Advice for Technology Suppliers
Market Share
Who Shaped the Year
ASE
Amkor
JCET
TFME
PTI
Tianshui Huatian
KYEC
Chipbond and ChipMOS
Sigurd
Market Context
Packaging Technology Development
Capex
Significant Market Developments
Regional Revenue Share
Heterogeneous Integration — Taking ASE, an ASM Leader, as an Example
Review of 2022 and Outlook for 2023
Methodology
Market Definition
Related Research
How Do Licenses Work?
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