Semiconductor Advanced Packaging

Global Semiconductor Advanced Packaging Market to Reach US$68.0 Billion by 2030

The global market for Semiconductor Advanced Packaging estimated at US$41.6 Billion in the year 2024, is expected to reach US$68.0 Billion by 2030, growing at a CAGR of 8.5% over the analysis period 2024-2030. Flip Chip Packaging, one of the segments analyzed in the report, is expected to record a 8.0% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5D/3D Packaging segment is estimated at 11.1% CAGR over the analysis period.

The U.S. Market is Estimated at US$3.7 Billion While China is Forecast to Grow at 9.8% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.7 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 9.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.1% and 7.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 6.3% CAGR.

Global Semiconductor Advanced Packaging Market - Key Trends & Drivers Summarized

Semiconductor advanced packaging is a pivotal aspect of the semiconductor industry, focused on enhancing the performance, efficiency, and integration of electronic devices. Unlike traditional packaging methods that primarily served as a protective shell for silicon chips, advanced packaging techniques involve innovative approaches to integrate multiple chips and components into a single package, thus significantly improving the device`s overall functionality. Techniques such as 3D stacking, system-in-package (SiP), and wafer-level packaging (WLP) have revolutionized the industry, enabling higher interconnect density, improved thermal management, and reduced signal delay. These advancements are crucial for meeting the increasing demands for smaller, faster, and more power-efficient electronic devices in applications ranging from smartphones and tablets to high-performance computing and automotive electronics.

Technological advancements have been at the forefront of the evolution in semiconductor advanced packaging. The development of Through-Silicon Vias (TSVs) has enabled the vertical stacking of multiple semiconductor dies, facilitating higher performance and lower power consumption. Additionally, fan-out wafer-level packaging (FOWLP) has emerged as a popular choice for integrating multiple functionalities within a compact footprint, thereby enhancing the performance of mobile and IoT devices. Innovations in materials, such as the use of advanced substrates and interconnect materials, have also contributed to the reliability and efficiency of these packaging solutions. Moreover, the integration of heterogeneous components, including processors, memory, sensors, and power management ICs, within a single package, has led to the creation of sophisticated, multifunctional devices that cater to the needs of modern applications like artificial intelligence, 5G, and autonomous driving.

The growth in the semiconductor advanced packaging market is driven by several factors, including the rising demand for compact and high-performance electronic devices, the proliferation of IoT and 5G technologies, and advancements in AI and machine learning applications. The increasing complexity and functionality of consumer electronics require more advanced packaging solutions to maintain performance and efficiency within smaller form factors. The widespread adoption of IoT devices, which necessitate low power consumption and high integration, has further accelerated the demand for advanced packaging. Additionally, the rollout of 5G networks requires sophisticated packaging technologies to support the higher frequencies and faster data rates. The advancements in AI and machine learning also drive the need for high-performance computing solutions, which in turn rely on advanced packaging for optimal performance. Furthermore, the push towards autonomous vehicles and advanced driver-assistance systems (ADAS) has created a significant demand for reliable and efficient semiconductor packaging solutions, as these applications require high computational power and robust performance. Overall, the continuous innovation in semiconductor packaging technologies and the expanding application areas ensure a robust growth trajectory for the market.

SCOPE OF STUDY:

The report analyzes the Semiconductor Advanced Packaging market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Technology (Flip Chip Packaging, 2.5D/3D Packaging, FI WLP, FO WLP); (Consumer Electronics, Industrial, Automotive, Aerospace & Defense, Other End-Uses)

Geographic Regions/Countries:
World; USA; Canada; Japan; China; Europe; France; Germany; Italy; UK; Rest of Europe; Asia-Pacific; South Korea; Taiwan; Rest of Asia-Pacific; Rest of World.

Select Competitors (Total 109 Featured) -

• Advanced Micro Devices, Inc.
• Applied Materials, Inc.
• Avery Dennison Corporation
• Amkor Technology, Inc.
• Advantest Corporation
• Brewer Science, Inc.
• American Semiconductor, Inc.
• ASM Pacific Technology Ltd.
• ASE Technology Holding Co., Ltd.
• AT & S Austria Technologie & Systemtechnik AG
• BE Semiconductor Industries N.V.
• Amtech Microelectronics, Inc.
• APSTL
• Boschman Technologies
• ASE Korea

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