Photonic Integrated Circuit (PIC)

Global Photonic Integrated Circuit (PIC) Market to Reach US$5.5 Billion by 2030

The global market for Photonic Integrated Circuit (PIC) estimated at US$1.9 Billion in the year 2024, is expected to reach US$5.5 Billion by 2030, growing at a CAGR of 19.7% over the analysis period 2024-2030. Hybrid Integration, one of the segments analyzed in the report, is expected to record a 18.6% CAGR and reach US$2.7 Billion by the end of the analysis period. Growth in the Monolithic Integration segment is estimated at 22.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$708.2 Million While China is Forecast to Grow at 30.8% CAGR

The Photonic Integrated Circuit (PIC) market in the U.S. is estimated at US$708.2 Million in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$996.6 Million by the year 2030 trailing a CAGR of 30.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 14.3% and 15.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 16.7% CAGR.

Global Photonic Integrated Circuit (PIC) Market - Key Trends & Drivers Summarized

What Is a Photonic Integrated Circuit (PIC), and Why Is It Transformative?

A Photonic Integrated Circuit (PIC) integrates multiple photonic functions, typically performed by separate optical components, into a single chip. This technology leverages the properties of light to perform functions that electronic integrated circuits execute using electrons. The transformative nature of PICs lies in their ability to process and transmit data at speeds significantly faster than traditional electronic devices, while also reducing energy consumption and heat generation. These capabilities make PICs highly advantageous for applications in high-speed data transmission systems, such as telecommunications and data center networks, where large volumes of data need to be processed quickly and efficiently.

How Are PICs Evolving with Technological Advancements?

Technological advancements in materials science, fabrication techniques, and design methodologies are driving the evolution of PICs. The use of new materials such as silicon nitride and indium phosphide has enhanced the performance characteristics of PICs, enabling broader wavelength operation and higher power handling capabilities. Advances in lithography and etching techniques have allowed for more precise and complex photonic structures, which increase the integration density and functionality of PICs. Additionally, improvements in packaging technology are crucial for reducing losses at the interface between the photonic chip and external fiber connections, further boosting the efficiency of PIC systems.

What Industries Are Leveraging PIC Technology for Innovation?

The use of PIC technology spans several industries, each harnessing its capabilities to foster innovation and enhance performance. In telecommunications, PICs are pivotal for developing more efficient and scalable optical networks that can handle the increasing demand for bandwidth driven by video streaming, cloud computing, and IoT (Internet of Things) connectivity. The biomedical field also benefits from PIC technology, particularly in biosensing devices, where PICs are used for lab-on-a-chip applications that require precise manipulation and analysis of light for diagnostics. Additionally, the aerospace and automotive industries are exploring the use of PICs in lidar systems for navigation and safety applications, given their ability to provide highly accurate and reliable data on the vehicle`s surroundings.

What Factors Are Fueling the Expansion of the PIC Market?

The growth in the PIC market is driven by several factors, reflecting the technology’s broadening applications and its alignment with current digital trends. The relentless demand for higher bandwidth in data communications is a significant driver, as service providers seek to upgrade their infrastructure to support faster and more reliable data transfer. The integration of PICs into consumer electronics, particularly for data connectivity and sensor applications, is spurred by the ongoing digital transformation and the adoption of smart devices. Additionally, ongoing research and development aimed at overcoming current limitations in PIC technology, such as integration with other electronic components and mass manufacturability, promise to broaden their utility and decrease costs. These technological innovations, coupled with the growing need for energy-efficient solutions in data handling and communications, ensure a dynamic growth trajectory for the PIC market, securing its role in the future of photonics and integrated circuits.

SCOPE OF STUDY:

The report analyzes the Photonic Integrated Circuit (PIC) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Technique (Hybrid Integration, Monolithic Integration, Module Integration); Raw Material [Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si), Other Raw Materials]; Application (Optical Communications, Optical Signal Processing, Other Applications)

Geographic Regions/Countries:
World; USA; Canada; Japan; China; Europe; France; Germany; Italy; UK; Spain; Russia; Rest of Europe; Asia-Pacific; Australia; India; South Korea; Rest of Asia-Pacific; Latin America; Argentina; Brazil; Mexico; Rest of Latin America; Middle East; Iran; Israel; Saudi Arabia; UAE; Rest of Middle East; Africa.

Select Competitors (Total 98 Featured) -

• Acacia Communications, Inc.
• Broadcom, Inc.
• Ciena Corporation
• Infinera Corporation
• Intel Corporation
• IPG Photonics Corporation
• Modular Photonics
• OmniSensing Photonics LLC
• Teem Photonics
• Viavi Solutions, Inc.
• Wooriro Co. Ltd.

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