Outsourced Semiconductor Assembly and Test Services

Global Outsourced Semiconductor Assembly and Test Services Market to Reach US$68.1 Billion by 2030

The global market for Outsourced Semiconductor Assembly and Test Services estimated at US$46.8 Billion in the year 2024, is expected to reach US$68.1 Billion by 2030, growing at a CAGR of 6.5% over the analysis period 2024-2030. Assembly & Packaging Services, one of the segments analyzed in the report, is expected to record a 5.4% CAGR and reach US$45.7 Billion by the end of the analysis period. Growth in the Testing Services segment is estimated at 8.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$12.3 Billion While China is Forecast to Grow at 6.4% CAGR

The Outsourced Semiconductor Assembly and Test Services market in the U.S. is estimated at US$12.3 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$11.0 Billion by the year 2030 trailing a CAGR of 6.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.8% and 5.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.3% CAGR.

Global Outsourced Semiconductor Assembly and Test Services Market – Key Trends & Drivers Summarized

Why Is the Outsourced Semiconductor Assembly and Test (OSAT) Market Expanding Rapidly?

The OSAT market is experiencing strong growth as semiconductor manufacturers increasingly rely on third-party specialists to handle assembly, packaging, and testing. With the rising complexity of semiconductor designs, including advanced node chips, 3D packaging, and heterogeneous integration, companies are outsourcing these critical processes to OSAT providers to reduce costs and focus on core innovations.

Additionally, the global chip shortage and increasing demand for consumer electronics, automotive semiconductors, and IoT devices are fueling OSAT market expansion. As semiconductor fabrication processes become more advanced, manufacturers are partnering with OSAT firms to ensure efficient production, faster time-to-market, and compliance with stringent quality standards.

How Are Advanced Packaging and AI-Driven Testing Enhancing OSAT Capabilities?

The OSAT industry is undergoing a major transformation with the adoption of advanced packaging technologies. Fan-out wafer-level packaging (FOWLP), 2.5D and 3D chip stacking, and system-in-package (SiP) solutions are enabling higher performance and miniaturization, particularly in AI, 5G, and high-performance computing applications. These innovations allow OSAT providers to offer cutting-edge packaging solutions that enhance power efficiency and chip functionality.

AI-driven automated testing is also revolutionizing the industry by improving fault detection and increasing test accuracy. Machine learning algorithms are being integrated into semiconductor testing processes to analyze vast amounts of data, predict failures, and optimize quality control. This trend is helping semiconductor companies improve yield rates and reduce manufacturing defects.

Is the Shift Toward Automotive, AI, and 5G Driving OSAT Growth?

The increasing demand for semiconductors in automotive applications, including advanced driver-assistance systems (ADAS), electric vehicles (EVs), and autonomous driving, is driving OSAT market expansion. Automakers require specialized chip packaging and testing services to meet the stringent reliability and safety standards of automotive electronics.

Additionally, the rapid growth of AI-driven edge computing and 5G infrastructure is increasing demand for high-performance semiconductor packaging solutions. OSAT firms are investing in new facilities and expanding their capabilities to support the growing need for ultra-fast, energy-efficient chips used in telecommunications, AI accelerators, and data centers.

What’s Driving the Growth of the OSAT Market?

The growth in the OSAT market is driven by several factors, including rising semiconductor complexity, the need for cost-efficient chip assembly and testing, and the increasing adoption of advanced packaging technologies. The expansion of automotive electronics, AI, and 5G applications is further fueling market demand.

Additionally, the globalization of semiconductor manufacturing, combined with supply chain disruptions, is encouraging companies to diversify their OSAT partners. As semiconductor demand continues to soar, OSAT providers are expected to play a critical role in enabling next-generation electronics, ensuring sustained market growth.

SCOPE OF STUDY:

The report analyzes the Outsourced Semiconductor Assembly and Test Services market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Service Type (Assembly & Packaging Services, Testing Services); Application (Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 41 Featured) -
  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • Chipbond Technology Corporation
  • ChipMOS Technologies Inc.
  • Hana Microelectronics Public Co., Ltd.
  • Integrated Micro-Electronics, Inc. (IMI)
  • Jiangsu Changjiang Electronics Technology (JCET)
  • King Yuan Electronics Co., Ltd. (KYEC)
  • Lingsen Precision Industries, Ltd.
  • Nepes Corporation
  • Powertech Technology Inc. (PTI)
  • Shenzhen Changdian New Energy Technology Co., Ltd.
  • Signetics Corporation
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • Stats ChipPAC
  • Tianshui Huatian Technology Co., Ltd.
  • Tongfu Microelectronics Co., Ltd. (TFME)
  • Unisem Group
  • UTAC Holdings Ltd.
  • Walton Advanced Engineering, Inc.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA
CHINA
MEXICO
CANADA
EU
JAPAN
INDIA
176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

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I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Influencer Market Insights
Tariff Impact on Global Supply Chain Patterns
Outsourced Semiconductor Assembly and Test Services – Global Key Competitors Percentage Market Share in 2025 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Surge in AI, IoT, and 5G Devices Accelerates Demand for Advanced Packaging Solutions
Fabless Semiconductor Model Strengthens Business Case for Outsourced Assembly and Testing
Shrinking Node Sizes and Chip Complexity Propel Innovation in OSAT Capabilities
Automotive Electronics and ADAS Trends Expand Addressable Market for OSAT Providers
Global Chip Shortages Throw Spotlight on Supply Chain Resilience and Capacity Expansion
Shift Toward Heterogeneous Integration Drives Demand for High-Density Packaging Expertise
Proliferation of Consumer Wearables and Smart Devices Sustains Volume Growth in OSAT
Rising Demand for MEMS and Sensor Technologies Spurs Specialized Test Solutions
Strategic Partnerships Between OEMs and OSATs Enhance Technology Access and Speed-to-Market
Regional Diversification and Nearshoring Efforts Create Investment Opportunities in Emerging Hubs
Environmental Compliance and Green Packaging Initiatives Influence Vendor Selection
Regulatory Push for Domestic Semiconductor Ecosystems Boosts Local OSAT Demand
High Capital Costs of In-House Assembly Drive Outsourcing Preference Among Foundries
Rapid Turnaround Requirements and Customization Needs Expand Tier-2 OSAT Opportunities
Private Equity Investment in Semiconductor Value Chain Spurs M&A Activity in OSAT Sector
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World Outsourced Semiconductor Assembly and Test Services Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
TABLE 2: World Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 3: World Historic Review for Outsourced Semiconductor Assembly and Test Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 4: World 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
TABLE 5: World Recent Past, Current & Future Analysis for Assembly & Packaging Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 6: World Historic Review for Assembly & Packaging Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 7: World 15-Year Perspective for Assembly & Packaging Services by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 8: World Recent Past, Current & Future Analysis for Testing Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 9: World Historic Review for Testing Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 10: World 15-Year Perspective for Testing Services by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 11: World Recent Past, Current & Future Analysis for Telecommunication Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 12: World Historic Review for Telecommunication Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 13: World 15-Year Perspective for Telecommunication Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 14: World Recent Past, Current & Future Analysis for Consumer Electronics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 15: World Historic Review for Consumer Electronics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 16: World 15-Year Perspective for Consumer Electronics Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 17: World Recent Past, Current & Future Analysis for Industrial Electronics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 18: World Historic Review for Industrial Electronics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 19: World 15-Year Perspective for Industrial Electronics Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 20: World Recent Past, Current & Future Analysis for Automotive Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 21: World Historic Review for Automotive Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 22: World 15-Year Perspective for Automotive Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 23: World Recent Past, Current & Future Analysis for Aerospace & Defense Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 24: World Historic Review for Aerospace & Defense Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 25: World 15-Year Perspective for Aerospace & Defense Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
TABLE 26: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 27: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 28: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
III. MARKET ANALYSIS
UNITED STATES
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
TABLE 29: USA Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 30: USA Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 31: USA 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 32: USA Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 33: USA Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 34: USA 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
CANADA
TABLE 35: Canada Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 36: Canada Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 37: Canada 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 38: Canada Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 39: Canada Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 40: Canada 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
JAPAN
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
TABLE 41: Japan Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 42: Japan Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 43: Japan 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 44: Japan Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 45: Japan Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 46: Japan 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
CHINA
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
TABLE 47: China Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 48: China Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 49: China 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 50: China Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 51: China Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 52: China 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
EUROPE
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
TABLE 53: Europe Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 54: Europe Historic Review for Outsourced Semiconductor Assembly and Test Services by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 55: Europe 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
TABLE 56: Europe Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 57: Europe Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 58: Europe 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 59: Europe Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 60: Europe Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 61: Europe 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
FRANCE
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
TABLE 62: France Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 63: France Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 64: France 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 65: France Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 66: France Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 67: France 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
GERMANY
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
TABLE 68: Germany Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 69: Germany Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 70: Germany 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 71: Germany Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 72: Germany Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 73: Germany 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
ITALY
TABLE 74: Italy Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 75: Italy Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 76: Italy 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 77: Italy Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 78: Italy Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 79: Italy 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
UNITED KINGDOM
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
TABLE 80: UK Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 81: UK Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 82: UK 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 83: UK Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 84: UK Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 85: UK 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
REST OF EUROPE
TABLE 86: Rest of Europe Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 87: Rest of Europe Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 88: Rest of Europe 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 89: Rest of Europe Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 90: Rest of Europe Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 91: Rest of Europe 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
ASIA-PACIFIC
Outsourced Semiconductor Assembly and Test Services Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
TABLE 92: Asia-Pacific Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 93: Asia-Pacific Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 94: Asia-Pacific 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 95: Asia-Pacific Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 96: Asia-Pacific Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 97: Asia-Pacific 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
REST OF WORLD
TABLE 98: Rest of World Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 99: Rest of World Historic Review for Outsourced Semiconductor Assembly and Test Services by Service Type - Assembly & Packaging Services and Testing Services Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 100: Rest of World 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Service Type - Percentage Breakdown of Value Sales for Assembly & Packaging Services and Testing Services for the Years 2015, 2025 & 2030
TABLE 101: Rest of World Recent Past, Current & Future Analysis for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 102: Rest of World Historic Review for Outsourced Semiconductor Assembly and Test Services by Application - Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
TABLE 103: Rest of World 15-Year Perspective for Outsourced Semiconductor Assembly and Test Services by Application - Percentage Breakdown of Value Sales for Telecommunication Application, Consumer Electronics Application, Industrial Electronics Application, Automotive Application, Aerospace & Defense Application and Other Applications for the Years 2015, 2025 & 2030
IV. COMPETITION

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