Semiconductor Wafer Polishing and Grinding Equipment Market Forecasts to 2032 – Global Analysis By Equipment Type (Wafer Grinding Machines, Wafer Polishing Machines, Chemical Mechanical Polishing (CMP) Tools, Integrated Grinder-Polisher Systems, and Edge-
Description
According to Stratistics MRC, the Global Semiconductor Wafer Polishing and Grinding Equipment Market is accounted for $2994.32 million in 2025 and is expected to reach $4714.64 million by 2032 growing at a CAGR of 6.7% during the forecast period. Semiconductor wafer polishing and grinding equipment comprises advanced tools designed to refine wafer surfaces during semiconductor fabrication. Grinding processes eliminate surplus material and achieve consistent thickness, while polishing ensures ultra-smooth, defect-free finishes essential for microelectronics. These machines play a crucial role in enhancing wafer reliability, boosting production efficiency, and enabling accurate circuit patterning. By ensuring surface flatness and uniformity, they support precise lithography, etching, and overall semiconductor device performance in the manufacturing chain.
Market Dynamics:
Driver:
Rising demand for consumer electronics
The proliferation of smart devices, wearables, and IoT-enabled appliances is intensifying the need for advanced semiconductor wafers with high precision and performance. As consumer expectations shift toward thinner, faster, and more energy-efficient electronics, manufacturers are investing in cutting-edge polishing and grinding equipment to meet stringent design specifications. Technologies such as CMP (Chemical Mechanical Polishing) and ultra-fine grinding systems are becoming essential for achieving nanoscale surface uniformity. Emerging trends include integration of AI-based process control and real-time defect detection to enhance yield and throughput. Key developments like 3D packaging and chiplet architectures are further driving demand for wafer-level finishing tools.
Restraint:
Complexity in maintenance
Maintaining semiconductor wafer polishing and grinding equipment involves intricate calibration, frequent part replacements, and specialized technical expertise. The precision required in wafer finishing processes means even minor misalignments can lead to costly defects and production delays. Technologies such as multi-zone pressure control and automated slurry management add layers of complexity to routine servicing. Emerging trends like predictive maintenance and remote diagnostics are helping mitigate downtime but require significant upfront investment. Key challenges include compatibility with legacy systems and the need for continuous operator training. These operational burdens often deter smaller fabs and foundries from adopting advanced equipment at scale.
Opportunity:
Rising demand for automotive semiconductors
Wafer polishing and grinding tools are critical for producing power devices, sensors, and microcontrollers that meet automotive-grade standards. Technologies such as SiC and GaN wafer processing require specialized CMP and grinding systems to ensure thermal stability and electrical performance. Emerging trends include integration of AI in process optimization and adoption of hybrid polishing techniques for compound semiconductors. Key developments like EV platform standardization and ADAS expansion are accelerating equipment upgrades across automotive fabs. This transformation presents a lucrative growth avenue for precision wafer processing solutions.
Threat:
Rapid technological obsolescence
As node sizes shrink and new materials emerge, legacy systems struggle to meet evolving performance and integration requirements. Technologies such as hybrid bonding, backside thinning, and advanced CMP formulations demand continuous equipment upgrades. Emerging trends like heterogeneous integration and chiplet-based designs are reshaping wafer finishing needs. Key developments include the rise of 2.5D/3D packaging and quantum computing prototypes, which require ultra-precise surface preparation. This rapid evolution increases capital risk and shortens ROI timelines for equipment manufacturers and users alike.
Covid-19 Impact
The pandemic disrupted global semiconductor supply chains, delaying equipment deliveries and halting fab expansions. However, the surge in remote work, digital infrastructure, and medical electronics created renewed urgency for wafer processing capacity. Technologies such as automated polishing systems and remote monitoring tools gained traction to support socially distanced operations. Emerging trends include increased investment in domestic fabs and reshoring of critical semiconductor production. Key developments like government-backed stimulus for chip manufacturing and strategic stockpiling of equipment components helped stabilize the market.
The chemical mechanical polishing (CMP) tools segment is expected to be the largest during the forecast period
The chemical mechanical polishing (CMP) tools segment is expected to account for the largest market share during the forecast period, due to its critical role in achieving planarization across multiple layers of advanced semiconductor devices. CMP technologies are indispensable for fabricating FinFETs, 3D NAND, and logic chips with ultra-thin geometries. Emerging trends include slurry optimization, endpoint detection enhancements, and integration with AI-driven process analytics. Key developments such as hybrid CMP systems and eco-friendly consumables are reshaping tool design and operational efficiency. The growing complexity of multi-patterning and advanced lithography is further reinforcing CMP’s centrality in wafer fabrication. As a result, CMP tools continue to command the largest share of the polishing and grinding equipment market.
The foundries segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the foundries segment is predicted to witness the highest growth rate, driven by surging demand for outsourced semiconductor manufacturing and advanced node capabilities. These facilities are rapidly adopting next-gen polishing and grinding tools to support high-volume production of logic, memory, and mixed-signal devices. Technologies such as wafer-level packaging, backside grinding, and CMP for advanced interconnects are becoming standard in leading-edge foundries. Emerging trends include AI-based yield optimization, modular tool configurations, and real-time defect mapping. Key developments like the expansion of 5nm and 3nm process nodes and strategic partnerships with fabless firms are fueling equipment upgrades.
Region with largest share:
During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by robust semiconductor manufacturing ecosystems in China, Taiwan, South Korea, and Japan. The region’s dominance is underpinned by aggressive fab expansions, government incentives, and strong demand from consumer electronics and automotive sectors. Technologies such as advanced CMP, wafer thinning and automated grinding systems are widely deployed across regional fabs. Emerging trends include vertical integration of supply chains and adoption of smart manufacturing platforms. Key developments like China’s push for semiconductor self-sufficiency and Taiwan’s leadership in advanced nodes are shaping regional equipment demand.
Region with highest CAGR:
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strategic investments in domestic semiconductor manufacturing and innovation hubs. The region is witnessing increased deployment of polishing and grinding tools to support advanced packaging, AI chips, and defense-grade semiconductors. Technologies such as CMP for heterogeneous integration, wafer-level grinding for RF devices, and AI-enabled process control are gaining traction. Emerging trends include reshoring initiatives, fab modernization, and public-private R&D collaborations. Key developments like CHIPS Act funding, expansion of foundry capacity, and partnerships with equipment vendors are accelerating growth.
Key players in the market
Some of the key players profiled in the Semiconductor Wafer Polishing and Grinding Equipment Market include DISCO Corporation, Lapmaster Wolters GmbH, Tokyo Seimitsu Co., Ltd., Entrepix, Inc., Applied Materials, Inc., Koyo Machinery Co., Ltd., Ebara Corporation, Hantop Intelligence Tech Co., Ltd., Revasum, Inc., G&N Genauigkeits Maschinenbau Nürnberg GmbH, Komatsu NTC Ltd., Logitech Ltd., Okamoto Machine Tool Works Co., Ltd., Pureon AG, and CMP-Tec Inc.
Key Developments:
In August 2025, DISCO announced it has been selected by Watson Farley & Williams (WFW), a prominent Global 200 law firm, as the firm’s strategic partner for ediscovery technology and services to support its growing international disputes practice and client base.
In January 2024, KOYO Machinery USA merges with JTEKT Machinery Americas. Koyo Machinery USA will be integrated into JTEKT Machinery’s range of products, services, and customer support operations. This merger is an extension of JTEKT Corporation’s global brand unification initiative launched in 2021 which is designed to strategically reshape the company for increased efficiency and greater synergy between group companies.
Equipment Types Covered:
• Wafer Grinding Machines
• Wafer Polishing Machines
• Chemical Mechanical Polishing (CMP) Tools
• Integrated Grinder-Polisher Systems
• Edge-Grinding and Bevel-Polishing Equipment
Wafer Sizes Covered:
• ≤150 mm
• 200 mm
• 300 mm
• 450 mm and Above
Technology Nodes Covered:
• Advanced Nodes (≤10 nm)
• Legacy Nodes (>10 nm)
Semiconductor Types Covered:
• Memory (DRAM, NAND)
• Logic & SoC
• Analog & Mixed Signal
• Power Devices
Applications Covered:
• Foundries
• Interlevel Dielectric Materials
• Integrated Device Manufacturers (IDMs)
• Advanced Packaging Facilities
• Memory Manufacturers
• Other Applications
Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Market Dynamics:
Driver:
Rising demand for consumer electronics
The proliferation of smart devices, wearables, and IoT-enabled appliances is intensifying the need for advanced semiconductor wafers with high precision and performance. As consumer expectations shift toward thinner, faster, and more energy-efficient electronics, manufacturers are investing in cutting-edge polishing and grinding equipment to meet stringent design specifications. Technologies such as CMP (Chemical Mechanical Polishing) and ultra-fine grinding systems are becoming essential for achieving nanoscale surface uniformity. Emerging trends include integration of AI-based process control and real-time defect detection to enhance yield and throughput. Key developments like 3D packaging and chiplet architectures are further driving demand for wafer-level finishing tools.
Restraint:
Complexity in maintenance
Maintaining semiconductor wafer polishing and grinding equipment involves intricate calibration, frequent part replacements, and specialized technical expertise. The precision required in wafer finishing processes means even minor misalignments can lead to costly defects and production delays. Technologies such as multi-zone pressure control and automated slurry management add layers of complexity to routine servicing. Emerging trends like predictive maintenance and remote diagnostics are helping mitigate downtime but require significant upfront investment. Key challenges include compatibility with legacy systems and the need for continuous operator training. These operational burdens often deter smaller fabs and foundries from adopting advanced equipment at scale.
Opportunity:
Rising demand for automotive semiconductors
Wafer polishing and grinding tools are critical for producing power devices, sensors, and microcontrollers that meet automotive-grade standards. Technologies such as SiC and GaN wafer processing require specialized CMP and grinding systems to ensure thermal stability and electrical performance. Emerging trends include integration of AI in process optimization and adoption of hybrid polishing techniques for compound semiconductors. Key developments like EV platform standardization and ADAS expansion are accelerating equipment upgrades across automotive fabs. This transformation presents a lucrative growth avenue for precision wafer processing solutions.
Threat:
Rapid technological obsolescence
As node sizes shrink and new materials emerge, legacy systems struggle to meet evolving performance and integration requirements. Technologies such as hybrid bonding, backside thinning, and advanced CMP formulations demand continuous equipment upgrades. Emerging trends like heterogeneous integration and chiplet-based designs are reshaping wafer finishing needs. Key developments include the rise of 2.5D/3D packaging and quantum computing prototypes, which require ultra-precise surface preparation. This rapid evolution increases capital risk and shortens ROI timelines for equipment manufacturers and users alike.
Covid-19 Impact
The pandemic disrupted global semiconductor supply chains, delaying equipment deliveries and halting fab expansions. However, the surge in remote work, digital infrastructure, and medical electronics created renewed urgency for wafer processing capacity. Technologies such as automated polishing systems and remote monitoring tools gained traction to support socially distanced operations. Emerging trends include increased investment in domestic fabs and reshoring of critical semiconductor production. Key developments like government-backed stimulus for chip manufacturing and strategic stockpiling of equipment components helped stabilize the market.
The chemical mechanical polishing (CMP) tools segment is expected to be the largest during the forecast period
The chemical mechanical polishing (CMP) tools segment is expected to account for the largest market share during the forecast period, due to its critical role in achieving planarization across multiple layers of advanced semiconductor devices. CMP technologies are indispensable for fabricating FinFETs, 3D NAND, and logic chips with ultra-thin geometries. Emerging trends include slurry optimization, endpoint detection enhancements, and integration with AI-driven process analytics. Key developments such as hybrid CMP systems and eco-friendly consumables are reshaping tool design and operational efficiency. The growing complexity of multi-patterning and advanced lithography is further reinforcing CMP’s centrality in wafer fabrication. As a result, CMP tools continue to command the largest share of the polishing and grinding equipment market.
The foundries segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the foundries segment is predicted to witness the highest growth rate, driven by surging demand for outsourced semiconductor manufacturing and advanced node capabilities. These facilities are rapidly adopting next-gen polishing and grinding tools to support high-volume production of logic, memory, and mixed-signal devices. Technologies such as wafer-level packaging, backside grinding, and CMP for advanced interconnects are becoming standard in leading-edge foundries. Emerging trends include AI-based yield optimization, modular tool configurations, and real-time defect mapping. Key developments like the expansion of 5nm and 3nm process nodes and strategic partnerships with fabless firms are fueling equipment upgrades.
Region with largest share:
During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by robust semiconductor manufacturing ecosystems in China, Taiwan, South Korea, and Japan. The region’s dominance is underpinned by aggressive fab expansions, government incentives, and strong demand from consumer electronics and automotive sectors. Technologies such as advanced CMP, wafer thinning and automated grinding systems are widely deployed across regional fabs. Emerging trends include vertical integration of supply chains and adoption of smart manufacturing platforms. Key developments like China’s push for semiconductor self-sufficiency and Taiwan’s leadership in advanced nodes are shaping regional equipment demand.
Region with highest CAGR:
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strategic investments in domestic semiconductor manufacturing and innovation hubs. The region is witnessing increased deployment of polishing and grinding tools to support advanced packaging, AI chips, and defense-grade semiconductors. Technologies such as CMP for heterogeneous integration, wafer-level grinding for RF devices, and AI-enabled process control are gaining traction. Emerging trends include reshoring initiatives, fab modernization, and public-private R&D collaborations. Key developments like CHIPS Act funding, expansion of foundry capacity, and partnerships with equipment vendors are accelerating growth.
Key players in the market
Some of the key players profiled in the Semiconductor Wafer Polishing and Grinding Equipment Market include DISCO Corporation, Lapmaster Wolters GmbH, Tokyo Seimitsu Co., Ltd., Entrepix, Inc., Applied Materials, Inc., Koyo Machinery Co., Ltd., Ebara Corporation, Hantop Intelligence Tech Co., Ltd., Revasum, Inc., G&N Genauigkeits Maschinenbau Nürnberg GmbH, Komatsu NTC Ltd., Logitech Ltd., Okamoto Machine Tool Works Co., Ltd., Pureon AG, and CMP-Tec Inc.
Key Developments:
In August 2025, DISCO announced it has been selected by Watson Farley & Williams (WFW), a prominent Global 200 law firm, as the firm’s strategic partner for ediscovery technology and services to support its growing international disputes practice and client base.
In January 2024, KOYO Machinery USA merges with JTEKT Machinery Americas. Koyo Machinery USA will be integrated into JTEKT Machinery’s range of products, services, and customer support operations. This merger is an extension of JTEKT Corporation’s global brand unification initiative launched in 2021 which is designed to strategically reshape the company for increased efficiency and greater synergy between group companies.
Equipment Types Covered:
• Wafer Grinding Machines
• Wafer Polishing Machines
• Chemical Mechanical Polishing (CMP) Tools
• Integrated Grinder-Polisher Systems
• Edge-Grinding and Bevel-Polishing Equipment
Wafer Sizes Covered:
• ≤150 mm
• 200 mm
• 300 mm
• 450 mm and Above
Technology Nodes Covered:
• Advanced Nodes (≤10 nm)
• Legacy Nodes (>10 nm)
Semiconductor Types Covered:
• Memory (DRAM, NAND)
• Logic & SoC
• Analog & Mixed Signal
• Power Devices
Applications Covered:
• Foundries
• Interlevel Dielectric Materials
• Integrated Device Manufacturers (IDMs)
• Advanced Packaging Facilities
• Memory Manufacturers
• Other Applications
Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Table of Contents
200 Pages
- 1 Executive Summary
- 2 Preface
- 2.1 Abstract
- 2.2 Stake Holders
- 2.3 Research Scope
- 2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
- 2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions
- 3 Market Trend Analysis
- 3.1 Introduction
- 3.2 Drivers
- 3.3 Restraints
- 3.4 Opportunities
- 3.5 Threats
- 3.6 Application Analysis
- 3.7 Emerging Markets
- 3.8 Impact of Covid-19
- 4 Porters Five Force Analysis
- 4.1 Bargaining power of suppliers
- 4.2 Bargaining power of buyers
- 4.3 Threat of substitutes
- 4.4 Threat of new entrants
- 4.5 Competitive rivalry
- 5 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Equipment Type
- 5.1 Introduction
- 5.2 Wafer Grinding Machines
- 5.3 Wafer Polishing Machines
- 5.4 Chemical Mechanical Polishing (CMP) Tools
- 5.5 Integrated Grinder-Polisher Systems
- 5.6 Edge-Grinding and Bevel-Polishing Equipment
- 6 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Wafer Size
- 6.1 Introduction
- 6.2 ≤150 mm
- 6.3 200 mm
- 6.4 300 mm
- 6.5 450 mm and Above
- 7 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Technology Node
- 7.1 Introduction
- 7.2 Advanced Nodes (≤10 nm)
- 7.3 Legacy Nodes (>10 nm)
- 8 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Semiconductor Type
- 8.1 Introduction
- 8.2 Memory (DRAM, NAND)
- 8.3 Logic & SoC
- 8.4 Analog & Mixed Signal
- 8.5 Power Devices
- 9 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Application
- 9.1 Introduction
- 9.2 Foundries
- 9.3 Interlevel Dielectric Materials
- 9.4 Integrated Device Manufacturers (IDMs)
- 9.5 Advanced Packaging Facilities
- 9.6 Memory Manufacturers
- 9.7 Other Applications
- 10 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Geography
- 10.1 Introduction
- 10.2 North America
- 10.2.1 US
- 10.2.2 Canada
- 10.2.3 Mexico
- 10.3 Europe
- 10.3.1 Germany
- 10.3.2 UK
- 10.3.3 Italy
- 10.3.4 France
- 10.3.5 Spain
- 10.3.6 Rest of Europe
- 10.4 Asia Pacific
- 10.4.1 Japan
- 10.4.2 China
- 10.4.3 India
- 10.4.4 Australia
- 10.4.5 New Zealand
- 10.4.6 South Korea
- 10.4.7 Rest of Asia Pacific
- 10.5 South America
- 10.5.1 Argentina
- 10.5.2 Brazil
- 10.5.3 Chile
- 10.5.4 Rest of South America
- 10.6 Middle East & Africa
- 10.6.1 Saudi Arabia
- 10.6.2 UAE
- 10.6.3 Qatar
- 10.6.4 South Africa
- 10.6.5 Rest of Middle East & Africa
- 11 Key Developments
- 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
- 11.2 Acquisitions & Mergers
- 11.3 New Product Launch
- 11.4 Expansions
- 11.5 Other Key Strategies
- 12 Company Profiling
- 12.1 DISCO Corporation
- 12.2 Lapmaster Wolters GmbH
- 12.3 Tokyo Seimitsu Co., Ltd.
- 12.4 Entrepix, Inc.
- 12.5 Applied Materials, Inc.
- 12.6 Koyo Machinery Co., Ltd.
- 12.7 Ebara Corporation
- 12.8 Hantop Intelligence Tech Co., Ltd.
- 12.9 Revasum, Inc.
- 12.10 G&N Genauigkeits Maschinenbau Nürnberg GmbH
- 12.11 Komatsu NTC Ltd.
- 12.12 Logitech Ltd.
- 12.13 Okamoto Machine Tool Works Co., Ltd.
- 12.14 Pureon AG
- 12.15 CMP-Tec Inc.
- List of Tables
- Table 1 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Region (2024-2032) ($MN)
- Table 2 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Equipment Type (2024-2032) ($MN)
- Table 3 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Grinding Machines (2024-2032) ($MN)
- Table 4 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Polishing Machines (2024-2032) ($MN)
- Table 5 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Chemical Mechanical Polishing (CMP) Tools (2024-2032) ($MN)
- Table 6 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Integrated Grinder-Polisher Systems (2024-2032) ($MN)
- Table 7 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Edge-Grinding and Bevel-Polishing Equipment (2024-2032) ($MN)
- Table 8 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Size (2024-2032) ($MN)
- Table 9 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By ≤150 mm (2024-2032) ($MN)
- Table 10 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 200 mm (2024-2032) ($MN)
- Table 11 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 300 mm (2024-2032) ($MN)
- Table 12 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 450 mm and Above (2024-2032) ($MN)
- Table 13 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Technology Node (2024-2032) ($MN)
- Table 14 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Advanced Nodes (≤10 nm) (2024-2032) ($MN)
- Table 15 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Legacy Nodes (>10 nm) (2024-2032) ($MN)
- Table 16 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Semiconductor Type (2024-2032) ($MN)
- Table 17 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Memory (DRAM, NAND) (2024-2032) ($MN)
- Table 18 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Logic & SoC (2024-2032) ($MN)
- Table 19 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Analog & Mixed Signal (2024-2032) ($MN)
- Table 20 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Power Devices (2024-2032) ($MN)
- Table 21 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Application (2024-2032) ($MN)
- Table 22 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Foundries (2024-2032) ($MN)
- Table 23 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Interlevel Dielectric Materials (2024-2032) ($MN)
- Table 24 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
- Table 25 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Advanced Packaging Facilities (2024-2032) ($MN)
- Table 26 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Memory Manufacturers (2024-2032) ($MN)
- Table 27 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Other Applications (2024-2032) ($MN)
- Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.
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