3D Printing Patent Landscape Report

This report is the first of a series of patent landscape reports on 3D Printing by STIMAnalytics. It presents the results of patent analyses in 3D Printing domain, which were performed by STIMAnalytics AI-Powered service in collaboration with experts in patent knowledge and subject-matter. The aim of this report is to provide a summary of the main patent trends in 3D Printing production technology and related areas. Patent information is a valuable source of technical information on patented inventions that reflect the commercial expectations of the applicants. Patent information often contains technical and other information that is not available from any other source. This report can be useful as an information source in the 3D Printing area. The report's methodology relies on AI-Powered service developed by STIMAnalytics. This app uses advanced algorithms and models to meet the needs of various stakeholders (Inc. R&D managers, product managers, technologist, researchers and academics) in established or emerging technical fields. The number of inventions in 3D Printing area has grown significantly in recent years. The number of inventions in this field increased nine times over the last 14 years, which is much higher than the general growth in all fields of technology. The figure on the next page shows the number of International Patent Families in 3D Printing sector and in all technical fields, as a function of the year when the inventions were first disclosed to the public.


Key Findings
Executive Summary
1. Introduction
2. Patent Landscape Overview
2.1. Patent Family Analysis
2.2. Patent-Market Coverage
2.3. Geographical jurisdiction
3. Market and Competitor Analysis
3.1. Market at a Glance
3.2. Market Share of Main Producers
3.3. Main Processes in 3D printing
3.3. Top Applicants
3.4. Market Coverage of Top Applicants
3.5. Top Owners
3.6. Highly-Cited Applicants
3.10. Collaboration
3.10.1. Top Ten Applicants’ collaborations
3.10.2. The strongest cooperation networks
3.11. Top applicant activity
3.12. Pioneer companies in the last 5 years
3.13. Top applicant clustering
3.14. Pending patents
4. Technology Analysis
4.1. Top Technologies
4.1.1. Top Technologies by Class
4.1.2. Top Technologies by Sub-Class
4.1.3. Top Technologies by Main-Group
4.1.4. Top Technologies by Sub-Group
4.1.5. Top Technologies and Main Trends
4.2. Five Recent dominant technologies
4.3. Key Patents
4.4. The main themes of patent
4.5. Technology clustering
4.6. Top inventors
5. Key Players’ Patent Profile
5.1. GEN ELECTRIC
5.1.1. GEN ELECTRIC company Overview
5.1.2. Patent family analysis
5.1.1. Top Processes
5.1.3. Top Technologies
5.1.1. Merge and Acquisitions
5.1.3. Key patents
5.1.4. Topic modeling
5.1.5. Patents clustering
5.2. HEWLETT PACKARD DEVELOPMENT CO
5.2.1. HEWLETT PACKARD DEVELOPMENT CO company Overview
5.1.2. Top Processes
5.2.2. Top Technologies
5.1.6. Merge and Acquisitions
5.1.7. Key patents
5.1.8. Topic modeling
5.1.9. Patents clustering
5.3. ALIGN TECHNOLOGY INC
5.3.1. ALIGN TECHNOLOGY INC company Overview
5.1.3. Top Processes
5.3.2. Top Technologies
5.1.10. Merge and Acquisitions
5.1.11. Key patents
5.1.12. Topic modeling
5.1.13. Patents clustering
5.4. STRATASYS INC
5.4.1. STRATASYS INC company Overview
5.4.2. Patent family analysis
5.1.4. Top Processes
5.4.3. Top Technologies
5.1.14. Merge and Acquisitions
5.1.15. Key patents
5.1.16. Topic modeling
5.1.17. Patents clustering
5.5. 3M INNOVATIVE PROPERTIES CO
5.5.1. 3M INNOVATIVE PROPERTIES CO company Overview
5.5.2. Patent family analysis
5.1.5. Top Processes
5.5.3. Top Technologies
5.1.18. Merge and Acquisitions
5.1.19. Key patents
5.1.20. Topic modeling
5.1.21. Patents clustering
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