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Passive and Interconnecting Components Market Growth, Size, Trends Analysis - By Component, By Application - Regional Outlook, Competitive Strategies and Segment Forecast to 2034

Publisher SPER Market Research Pvt. Ltd.
Published Aug 27, 2025
Length 255 Pages
SKU # SPER20501447

Description

Passive and Interconnecting Components Market Introduction and Overview

According to SPER market research, ‘Global Passive and Interconnecting Components Market Size- By Component, By Application – Regional Outlook, Competitive Strategies and Segment Forecast to 2034’ state that the Global Passive and Interconnecting Components Market is predicted to reach 303.58 billion by 2034 with a CAGR of 5.36%.

Passive and interconnecting components are essential elements in electronic circuits that support the functioning of active devices without requiring external power for operation. Passive components include resistors, capacitors, and inductors, which control voltage, current, and energy storage within a circuit. They do not amplify signals but are vital for filtering, timing, and signal conditioning. Interconnecting components, such as connectors, cables, and printed circuit boards (PCBs), facilitate the physical and electrical connections between various parts of a system.

Restraints: The passive and interconnecting components market faces several challenges despite growing demand. One major issue is the volatility in raw material prices, such as copper and rare earth metals, which affects production costs and supply stability. Miniaturization of electronic devices also presents design and manufacturing complexities, requiring high precision and quality control. Additionally, supply chain disruptions, especially due to geopolitical tensions or global events, can lead to component shortages and delayed deliveries.

Scope of the report:

Report Metric Details
Market size available for years 2021-2034
Base year considered 2024
Forecast period 2025-2034

Segments covered
By Component, By Application

Regions covered
North America, Latin America, Asia-Pacific, Europe, and Middle East & Africa

Companies Covered

Hosiden Corporation, KYOCERA AVX Components Corporation, Murata Manufacturing Co., Ltd, NICHICON CORPORATION, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD, TDK Corporation, TE Connectivity, Vishay Intertechnology, Inc, YAGEO Group.

Global Passive and Interconnecting Components Market Segmentation:

By Component: Based on the Component, Global Passive and Interconnecting Components Market is segmented as; Passive, Interconnecting.

By Application: Based on the Application, Global Passive and Interconnecting Components Market is segmented as; Consumer Electronics, IT and Telecommunication, Automative, Industrial, Healthcare, Others.

By Region: This research also includes data for North America, Latin America, Asia-Pacific, Europe, Middle East & Africa.

Table of Contents

255 Pages
1. Introduction
1.1. Scope of the report
1.2. Market segment analysis
2. Research Methodology
2.1. Research data source
2.1.1. Secondary Data
2.1.2. Primary Data
2.1.3. SPERs internal database
2.1.4. Premium insight from KOLs
2.2. Market size estimation
2.2.1. Top-down and Bottom-up approach
2.3. Data triangulation
3. Executive Summary
4. Market Dynamics
4.1. Driver, Restraint, Opportunity and Challenges analysis
4.1.1. Drivers
4.1.2. Restraints
4.1.3. Opportunities
4.1.4. Challenges
5. Market variable and outlook
5.1. SWOT Analysis
5.1.1. Strengths
5.1.2. Weaknesses
5.1.3. Opportunities
5.1.4. Threats
5.2. PESTEL Analysis
5.2.1. Political Landscape
5.2.2. Economic Landscape
5.2.3. Social Landscape
5.2.4. Technological Landscape
5.2.5. Environmental Landscape
5.2.6. Legal Landscape
5.3. PORTERs Five Forces
5.3.1. Bargaining power of suppliers
5.3.2. Bargaining power of buyers
5.3.3. Threat of Substitute
5.3.4. Threat of new entrant
5.3.5. Competitive rivalry
5.4. Heat Map Analysis
6. Competitive Landscape
6.1. Global Passive and Interconnecting Components Market Manufacturing Base Distribution, Sales Area, Product Type
6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Passive and Interconnecting Components Market
7. Global Passive and Interconnecting Components Market, By Component (USD Million) 2021-2034
7.1. Passive
7.2. Interconnecting
8. Global Passive and Interconnecting Components Market, By Application (USD Million) 2021-2034
8.1. Consumer Electronics
8.2. IT and Telecommunication
8.3. Automative
8.4. Industrial
8.5. Healthcare
8.6. Others
9. Global Passive and Interconnecting Components Market, (USD Million) 2021-2034
9.1. Global Passive and Interconnecting Components Market Size and Market Share
10. Global Passive and Interconnecting Components Market, By Region, (USD Million) 2021-2034
10.1. Asia-Pacific
10.1.1. Australia
10.1.2. China
10.1.3. India
10.1.4. Japan
10.1.5. South Korea
10.1.6. Rest of Asia-Pacific
10.2. Europe
10.2.1. France
10.2.2. Germany
10.2.3. Italy
10.2.4. Spain
10.2.5. United Kingdom
10.2.6. Rest of Europe
10.3. Middle East and Africa
10.3.1. Kingdom of Saudi Arabia
10.3.2. United Arab Emirates
10.3.3. Qatar
10.3.4. South Africa
10.3.5. Egypt
10.3.6. Morocco
10.3.7. Nigeria
10.3.8. Rest of Middle-East and Africa
10.4. North America
10.4.1. Canada
10.4.2. Mexico
10.4.3. United States
10.5. Latin America
10.5.1. Argentina
10.5.2. Brazil
10.5.3. Rest of Latin America
11. Company Profile
11.1. Hosiden Corporation
11.1.1. Company details
11.1.2. Financial outlook
11.1.3. Product summary
11.1.4. Recent developments
11.2. KYOCERA AVX Components Corporation
11.2.1. Company details
11.2.2. Financial outlook
11.2.3. Product summary
11.2.4. Recent developments
11.3. Murata Manufacturing Co., Ltd
11.3.1. Company details
11.3.2. Financial outlook
11.3.3. Product summary
11.3.4. Recent developments
11.4. NICHICON CORPORATION
11.4.1. Company details
11.4.2. Financial outlook
11.4.3. Product summary
11.4.4. Recent developments
11.5. SAMSUNG ELECTRO-MECHANICS
11.5.1. Company details
11.5.2. Financial outlook
11.5.3. Product summary
11.5.4. Recent developments
11.6. TAIYO YUDEN CO., LTD
11.6.1. Company details
11.6.2. Financial outlook
11.6.3. Product summary
11.6.4. Recent developments
11.7. TDK Corporation
11.7.1. Company details
11.7.2. Financial outlook
11.7.3. Product summary
11.7.4. Recent developments
11.8. TE Connectivity
11.8.1. Company details
11.8.2. Financial outlook
11.8.3. Product summary
11.8.4. Recent developments
11.9. Vishay Intertechnology, Inc
11.9.1. Company details
11.9.2. Financial outlook
11.9.3. Product summary
11.9.4. Recent developments
11.10. YAGEO Group
11.10.1. Company details
11.10.2. Financial outlook
11.10.3. Product summary
11.10.4. Recent developments
11.11. Others
12. Conclusion
13. List of Abbreviations
14. Reference Links

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