
Global IoT Chipset Market Growth, Size, Trends Analysis - By Product, By End Use - Regional Outlook, Competitive Strategies and Segment Forecast to 2034
Description
Global IoT Chipset Market Introduction and Overview
According to SPER market research, ‘Global IoT Chipset Market Size- By Product, By End Use – Regional Outlook, Competitive Strategies and Segment Forecast to 2033’ state that the Global IoT Chipset Market is predicted to reach 1241.69 billion by 2034 with a CAGR of 9.56%.
An IoT chipset consists of integrated circuits specifically designed to facilitate connectivity, processing, and data transmission in Internet of Things (IoT) devices. These chipsets commonly include microcontrollers, processors, memory, and connectivity modules such as Wi-Fi, Bluetooth, or cellular. Acting as the core of IoT devices, they enable data collection from sensors, information processing, and communication with other devices or networks.
Restraints:
The IoT chipset market encounters several challenges that may hinder its growth and progress. A key challenge is designing chips that effectively balance high performance with low power consumption, which is crucial for extending battery life in many IoT devices. Additionally, maintaining strong security and data privacy is vital, as connected devices face increasing risks of cyberattacks. Furthermore, interoperability issues arising from the variety of IoT standards and protocols create obstacles, making seamless communication between devices from different manufacturers difficult.
Scope of the report:
Report Metric Details
Market size available for years 2021-2034
Base year considered 2024
Forecast period 2025-2034
Segments covered
By Product, By End Use
Regions covered
North America, Latin America, Asia-Pacific, Europe, and Middle East & Africa
Companies Covered
Qualcomm Technologies Inc., Intel Corporation, STMicroelectronics N.V., Texas Instruments Incorporated, NXP Semiconductors N.V., Samsung Electronics Co. Ltd., Analog Devices Inc., MediaTek Inc., Microchip Technology Inc., Infineon Technologies AG.
Global IoT Chipset Market Segmentation:
By Product:
Based on the Product, Global IoT Chipset Market is segmented as; Connectivity Integrated Circuits (ICs), Logic Devices, Memory Devices, Processors, Sensors.
By End-use: Based on the End-use, Global IoT Chipset Market is segmented as; Consumer Electronics, Wearable Devices, Automotive & Transportation, BFSI, Healthcare, Retail, Building Automation, Oil & Gas, Agriculture, Aerospace & Defense, Others.
By Region:
This research also includes data for North America, Latin America, Asia-Pacific, Europe, Middle East & Africa.
According to SPER market research, ‘Global IoT Chipset Market Size- By Product, By End Use – Regional Outlook, Competitive Strategies and Segment Forecast to 2033’ state that the Global IoT Chipset Market is predicted to reach 1241.69 billion by 2034 with a CAGR of 9.56%.
An IoT chipset consists of integrated circuits specifically designed to facilitate connectivity, processing, and data transmission in Internet of Things (IoT) devices. These chipsets commonly include microcontrollers, processors, memory, and connectivity modules such as Wi-Fi, Bluetooth, or cellular. Acting as the core of IoT devices, they enable data collection from sensors, information processing, and communication with other devices or networks.
Restraints:
The IoT chipset market encounters several challenges that may hinder its growth and progress. A key challenge is designing chips that effectively balance high performance with low power consumption, which is crucial for extending battery life in many IoT devices. Additionally, maintaining strong security and data privacy is vital, as connected devices face increasing risks of cyberattacks. Furthermore, interoperability issues arising from the variety of IoT standards and protocols create obstacles, making seamless communication between devices from different manufacturers difficult.
Scope of the report:
Report Metric Details
Market size available for years 2021-2034
Base year considered 2024
Forecast period 2025-2034
Segments covered
By Product, By End Use
Regions covered
North America, Latin America, Asia-Pacific, Europe, and Middle East & Africa
Companies Covered
Qualcomm Technologies Inc., Intel Corporation, STMicroelectronics N.V., Texas Instruments Incorporated, NXP Semiconductors N.V., Samsung Electronics Co. Ltd., Analog Devices Inc., MediaTek Inc., Microchip Technology Inc., Infineon Technologies AG.
Global IoT Chipset Market Segmentation:
By Product:
Based on the Product, Global IoT Chipset Market is segmented as; Connectivity Integrated Circuits (ICs), Logic Devices, Memory Devices, Processors, Sensors.
By End-use: Based on the End-use, Global IoT Chipset Market is segmented as; Consumer Electronics, Wearable Devices, Automotive & Transportation, BFSI, Healthcare, Retail, Building Automation, Oil & Gas, Agriculture, Aerospace & Defense, Others.
By Region:
This research also includes data for North America, Latin America, Asia-Pacific, Europe, Middle East & Africa.
Table of Contents
250 Pages
- 1. Introduction
- 1.1.Scope of the report
- 1.2.Market segment analysis
- 2.Research Methodology
- 2.1.Research data source
- 2.1.1.Secondary Data
- 2.1.2.Primary Data
- 2.1.3.SPERs internal database
- 2.1.4.Premium insight from KOLs
- 2.2.Market size estimation
- 2.2.1.Top-down and Bottom-up approach
- 2.3.Data triangulation
- 3.Executive Summary
- 4.Market Dynamics
- 4.1.Driver, Restraint, Opportunity and Challenges analysis
- 4.1.1.Drivers
- 4.1.2.Restraints
- 4.1.3.Opportunities
- 4.1.4.Challenges
- 5.Market variable and outlook
- 5.1.SWOT Analysis
- 5.1.1.Strengths
- 5.1.2.Weaknesses
- 5.1.3.Opportunities
- 5.1.4.Threats
- 5.2.PESTEL Analysis
- 5.2.1.Political Landscape
- 5.2.2.Economic Landscape
- 5.2.3.Social Landscape
- 5.2.4.Technological Landscape
- 5.2.5.Environmental Landscape
- 5.2.6.Legal Landscape
- 5.3.PORTERs Five Forces
- 5.3.1.Bargaining power of suppliers
- 5.3.2.Bargaining power of buyers
- 5.3.3.Threat of Substitute
- 5.3.4.Threat of new entrant
- 5.3.5.Competitive rivalry
- 5.4.Heat Map Analysis
- 6.Competitive Landscape
- 6.1.Global IoT Chipset Market Size Market Manufacturing Base Distribution, Sales Area, Product Type
- 6.2.Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global IoT Chipset Market
- 7.Global IoT Chipset Market, By Product 2021-2034 (USD Million)
- 7.1.Connectivity Integrated Circuits (ICs)
- 7.2.Logic Devices
- 7.3.Memory Devices
- 7.4.Processors
- 7.5.Sensors
- 7.5.1.Temperature Sensors
- 7.5.2.Motion Sensors
- 7.5.3.Light Sensors
- 7.5.4.Others
- 8.Global IoT Chipset Market, By End-use 2021-2034 (USD Million)
- 8.1.Consumer Electronics
- 8.2.Wearable Devices
- 8.3.Automotive & Transportation
- 8.4.BFSI
- 8.5.Healthcare
- 8.6.Retail
- 8.7.Building Automation
- 8.8.Oil & Gas
- 8.9.Agriculture
- 8.10.Aerospace & Defense
- 8.11.Others
- 9.Global IoT Chipset Market 2021-2034 (USD Million)
- 9.1.Global IoT Chipset Market Size and Market Share
- 10.Global IoT Chipset Market, By Region, 2021-2034 (USD Million)
- 10.1.Asia-Pacific
- 10.1.1.Australia
- 10.1.2.China
- 10.1.3.India
- 10.1.4.Japan
- 10.1.5.South Korea
- 10.1.6.Rest of Asia-Pacific
- 10.2.Europe
- 10.2.1.France
- 10.2.2.Germany
- 10.2.3.Italy
- 10.2.4.Spain
- 10.2.5.United Kingdom
- 10.2.6.Rest of Europe
- 10.3.Middle East and Africa
- 10.3.1.Kingdom of Saudi Arabia
- 10.3.2.United Arab Emirates
- 10.3.3.Qatar
- 10.3.4.South Africa
- 10.3.5.Egypt
- 10.3.6.Morocco
- 10.3.7.Nigeria
- 10.3.8.Rest of Middle-East and Africa
- 10.4.North America
- 10.4.1.Canada
- 10.4.2.Mexico
- 10.4.3.United States
- 10.5.Latin America
- 10.5.1.Argentina
- 10.5.2.Brazil
- 10.5.3.Rest of Latin America
- 11.Company Profile
- 11.1.Qualcomm Technologies Inc.
- 11.1.1.Company details
- 11.1.2.Financial outlook
- 11.1.3.Product summary
- 11.1.4.Recent developments
- 11.2.Intel Corporation
- 11.2.1.Company details
- 11.2.2.Financial outlook
- 11.2.3.Product summary
- 11.2.4.Recent developments
- 11.3.STMicroelectronics N.V
- 11.3.1.Company details
- 11.3.2.Financial outlook
- 11.3.3.Product summary
- 11.3.4.Recent developments
- 11.4.Texas Instruments Incorporated
- 11.4.1.Company details
- 11.4.2.Financial outlook
- 11.4.3.Product summary
- 11.4.4.Recent developments
- 11.5.NXP Semiconductors N.V.
- 11.5.1.Company details
- 11.5.2.Financial outlook
- 11.5.3.Product summary
- 11.5.4.Recent developments
- 11.6.Samsung Electronics Co. Ltd.
- 11.6.1.Company details
- 11.6.2.Financial outlook
- 11.6.3.Product summary
- 11.6.4.Recent developments
- 11.7.Analog Devices Inc
- 11.7.1.Company details
- 11.7.2.Financial outlook
- 11.7.3.Product summary
- 11.7.4.Recent developments
- 11.8.MediaTek Inc.
- 11.8.1.Company details
- 11.8.2.Financial outlook
- 11.8.3.Product summary
- 11.8.4.Recent developments
- 11.9.Microchip Technology Inc.
- 11.9.1.Company details
- 11.9.2.Financial outlook
- 11.9.3.Product summary
- 11.9.4.Recent developments
- 11.10.Infineon Technologies AG
- 11.10.1.Company details
- 11.10.2.Financial outlook
- 11.10.3.Product summary
- 11.10.4.Recent developments
- 11.11.Others
- 12.Conclusion
- 13.List of Abbreviations
- 14.Reference Links
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